LFE2M35SE-5F484I

The LFE2M35SE-5F484I is an industrial-grade ECP2M series Field Programmable Gate Array (FPGA) supplied in a 484-ball BGA package. It provides programmable digital logic resources and a large I/O count for embedded designs that require configurable logic, extensive interfacing, and on-chip memory.

With 34,000 logic elements, approximately 2.15 Mbits of embedded memory and 303 user I/Os, this device targets industrial applications where moderate to substantial logic capacity, broad connectivity and reliable operation across –40 °C to 100 °C are needed.

Key Features

• Logic Capacity — 34,000 logic elements to implement custom digital functions and configurable logic blocks.
• On‑chip Memory — Approximately 2.15 Mbits of embedded RAM for buffering, state storage and small-data processing.
• I/O Resources — 303 user I/Os to support extensive peripheral, sensor and interface connectivity.
• Power Supply — Operates from 1.14 V–1.26 V core supply range to match targeted system power architectures.
• Package & Mounting — 484-ball BGA (484-FPBGA, 23×23) in a surface-mount form factor for compact board integration.
• Industrial Temperature Range — Rated for operation from –40 °C to 100 °C for deployment in industrial environments.
• Environmental Compliance — RoHS compliant for regulatory and manufacturing alignment.

Typical Applications

• Industrial Control and Automation — Implement custom control logic, signal processing and I/O aggregation within industrial equipment while meeting extended temperature requirements.
• Communications and Networking — Use the large I/O complement and embedded memory for protocol handling, bridging and custom interface logic.
• Instrumentation and Test Equipment — Leverage programmable logic and on‑chip RAM for timing, data capture and preprocessing tasks in measurement systems.

Unique Advantages

• Substantial Logic Resource: 34,000 logic elements provide the capacity to consolidate multiple functions into a single device and reduce external components.
• Generous I/O Count: 303 I/Os enable direct interfacing to numerous peripherals, sensors and high‑pin-count connectors without extensive glue logic.
• Embedded Memory for On‑Device Data Handling: Approximately 2.15 Mbits of RAM supports buffering and local data processing, simplifying system memory architecture.
• Industrial Temperature Qualification: Rated –40 °C to 100 °C to support deployment in industrial environments where temperature resilience is required.
• Compact Surface‑Mount BGA: 484-ball FPBGA (23×23) package offers a space-efficient footprint for dense PCB layouts.
• RoHS Compliance: Meets common environmental manufacturing requirements for lead‑free production processes.

Why Choose LFE2M35SE-5F484I?

This FPGA balances substantial programmable logic, on‑chip memory and a high I/O count in an industrial‑rated package, making it suitable for embedded systems that require adaptable digital functions and extensive interfacing. Its low core voltage range and surface‑mount BGA packaging support compact, power-conscious board designs while meeting industrial temperature needs.

The LFE2M35SE-5F484I is a practical choice for engineering teams building configurable logic into industrial controllers, communication modules and instrumentation where integration, connectivity and reliable operation across temperature are priorities.

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