LFE2M35E-5FN672I

The LFE2M35E-5FN672I is an industrial-grade Field Programmable Gate Array (FPGA) from Lattice Semiconductor Corporation's ECP2M family. It combines high logic density and embedded memory with a large I/O count in a compact ball-grid array package, making it suitable for designs that require significant on-chip resources and broad interface support.

Key device parameters include 34,000 logic elements, approximately 2.15 Mbits of embedded memory, 410 I/O pins, a 672-ball BGA package, a low-voltage core supply range of 1.14 V to 1.26 V, and an operating temperature range of −40 °C to 100 °C. The device is RoHS compliant and supplied in a surface-mount package.

Key Features

• Logic Capacity — 34,000 logic elements provide substantial on-chip logic for custom digital implementations.
• Configurable Logic Blocks (CLBs) — 4,250 CLBs for structured, fabric-based logic partitioning and design mapping.
• Embedded Memory — Approximately 2.15 Mbits of total RAM bits to support buffering, lookup tables, and state storage on-chip.
• I/O Density — 410 general-purpose I/O pins to support multiple interfaces and peripheral connections.
• Power and Core Supply — Low-voltage core supply range of 1.14 V to 1.26 V to match system power architectures.
• Package — 672-ball BGA (supplier package: 672-FPBGA, 27×27) for high pin-count routing in a compact footprint; surface-mount mounting type.
• Industrial Temperature Range — Qualified for operation from −40 °C to 100 °C to meet industrial environmental requirements.
• Regulatory — RoHS compliant for environmental and manufacturing compliance.

Typical Applications

• Custom Digital Processing — Implement application-specific logic, protocol handling, and parallel data processing using the device's logic elements and embedded memory.
• High-Interface Systems — Leverage 410 I/O pins to bridge multiple peripherals, sensors, or communication interfaces within a single FPGA.
• Industrial Control — Use the industrial temperature rating and robust packaging for control and automation modules requiring on-chip logic and memory.

Unique Advantages

• High Logic Density: 34,000 logic elements enable complex logic implementations without external CPLDs or additional FPGAs.
• Significant On-Chip Memory: Approximately 2.15 Mbits of embedded RAM reduces the need for external memory in many buffering and table-based functions.
• Extensive I/O: 410 I/O pins allow flexible interfacing to sensors, peripherals, and communication links, minimizing external glue logic.
• Industrial-Grade Operation: Rated for −40 °C to 100 °C, suitable for deployments in demanding environmental conditions.
• Compact High-Pin Package: 672-ball BGA (27×27) delivers high connectivity in a compact surface-mount footprint for space-constrained PCBs.
• Environmentally Compliant: RoHS compliance supports environmentally conscious product builds and manufacturing processes.

Why Choose LFE2M35E-5FN672I?

The LFE2M35E-5FN672I balances a high number of logic elements, ample embedded memory, and a large I/O complement within a 672-ball BGA package, making it a strong choice for designs that require consolidated digital logic, on-chip data storage, and extensive interfacing. Its industrial temperature rating and RoHS compliance support deployment in professional and industrial applications where environmental tolerance and regulatory compliance matter.

This FPGA is well suited for engineers and procurement teams seeking a mid-to-high density programmable device from Lattice Semiconductor's ECP2M family that integrates substantial on-chip resources while fitting into compact, surface-mount hardware designs.

Request a quote or submit an inquiry to receive pricing and availability information for LFE2M35E-5FN672I.