LFE2M35E-5F256I
| Part Description |
ECP2M Field Programmable Gate Array (FPGA) IC 140 2151424 34000 256-BGA |
|---|---|
| Quantity | 1,390 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 256-FPBGA (17x17) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 256-BGA | Number of I/O | 140 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 4250 | Number of Logic Elements/Cells | 34000 | ||
| Number of Gates | N/A | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 2151424 |
Overview of LFE2M35E-5F256I – ECP2M FPGA, 256-BGA, Industrial
The LFE2M35E-5F256I is an ECP2M Field Programmable Gate Array (FPGA) from Lattice Semiconductor Corporation in a 256-ball FPBGA package. It provides a balance of programmable logic capacity, embedded memory, and I/O density targeted at industrial-grade surface-mount designs.
Key on-chip resources include 34,000 logic elements, approximately 2.15 Mbits of embedded RAM, and 140 user I/O pins. The device operates from a 1.14 V to 1.26 V supply and is rated for an operating temperature range of −40 °C to 100 °C, with RoHS compliance for environmental conformity.
Key Features
- Core Logic 34,000 logic elements provide programmable fabric for implementing custom digital logic and control functions.
- Embedded Memory Approximately 2.15 Mbits of on-chip RAM for data buffering, state storage, and local memory needs.
- I/O Capacity 140 user I/O pins support a wide range of external interfaces and peripheral connections.
- Power Low-voltage core operation with a supply range of 1.14 V to 1.26 V to match system power architectures.
- Package and Mounting 256-FPBGA (17 × 17) package in a surface-mount form factor for compact board-level integration.
- Industrial Temperature Range Specified for operation from −40 °C to 100 °C to meet industrial environment requirements.
- Regulatory Status RoHS compliant for environmental and manufacturing compatibility.
Typical Applications
- Industrial Systems Programmable logic for industrial control and automation applications, leveraging industrial-grade temperature specifications.
- Embedded Systems Integration of control, glue-logic, and custom processing in compact surface-mount designs using available logic and embedded memory.
- Interface and I/O Bridging Implementations requiring flexible I/O mapping and on-chip RAM to manage data transfers and protocol adaptation.
Unique Advantages
- Substantial Logic Capacity: 34,000 logic elements enable moderate to complex logic implementations without external FPGA fabrics.
- Significant On-Chip Memory: Approximately 2.15 Mbits of embedded RAM reduce the need for external memory in many designs.
- High I/O Count: 140 user I/O pins provide flexibility for interfacing multiple peripherals and sensors.
- Industrial-Rated Operation: Rated for −40 °C to 100 °C to support deployment in industrial environments.
- Compact, Surface-Mount Package: 256-FPBGA (17 × 17) offers a space-efficient solution for PCB integration.
- Low-Voltage Core: 1.14 V to 1.26 V supply range accommodates low-voltage system power domains.
Why Choose LFE2M35E-5F256I?
The LFE2M35E-5F256I delivers a practical combination of logic density, embedded memory, and I/O resources in a compact 256-BGA package for industrial surface-mount applications. Its specified operating temperature range and RoHS compliance make it suitable for systems requiring reliable, environmentally conscious components.
This device is a fit for design teams needing a mid-range FPGA from Lattice Semiconductor that consolidates programmable logic, on-chip memory, and substantial I/O in a single component—helping reduce board-level complexity and parts count while supporting industrial deployment conditions.
Request a quote or submit a purchase inquiry to check availability and lead times for the LFE2M35E-5F256I.

Date Founded: 1983
Headquarters: Hillsboro, Oregon, USA
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