LFE2M20SE-7FN256C
| Part Description |
ECP2M Field Programmable Gate Array (FPGA) IC 140 1246208 19000 256-BGA |
|---|---|
| Quantity | 370 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 20 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 256-FPBGA (17x17) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 256-BGA | Number of I/O | 140 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 2375 | Number of Logic Elements/Cells | 19000 | ||
| Number of Gates | N/A | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 1246208 |
Overview of LFE2M20SE-7FN256C – ECP2M FPGA, 19,000 logic elements, 140 I/O, 256-BGA
The LFE2M20SE-7FN256C is an ECP2M Field Programmable Gate Array (FPGA) in a 256-ball BGA package, offering a balance of on-chip logic, memory, and I/O capacity for commercial-grade designs. It integrates approximately 19,000 logic elements and roughly 1.246 Mbits of embedded memory with a 140-pin I/O capability in a compact surface-mount package.
Designed for designs that require mid-range logic density and moderate I/O counts, this FPGA operates from a low-voltage core supply (1.14 V to 1.26 V) and is specified for commercial temperature ranges (0°C to 85°C). The device is RoHS compliant and supplied in a 256-FPBGA (17×17) package.
Key Features
- Logic Capacity Approximately 19,000 logic elements provide mid-range programmable logic resource for complex combinational and sequential designs.
- Embedded Memory Approximately 1.246 Mbits of on-chip RAM to support buffers, FIFOs, and local data storage without external memory in many designs.
- I/O Count 140 general-purpose I/O pins enable interfacing to a variety of peripherals and subsystems within the package I/O budget.
- Power and Voltage Core voltage supply range from 1.14 V to 1.26 V for the programmable fabric.
- Package and Mounting 256-ball FPBGA (17×17) package in a surface-mount form factor for compact board layouts.
- Operating Range and Grade Commercial grade device specified for operation from 0°C to 85°C.
- Environmental Compliance RoHS compliant construction.
Typical Applications
- Embedded logic and prototyping Use the device’s ~19,000 logic elements and on-chip RAM to implement mid-range digital systems and validate designs in development boards or production modules.
- Moderate I/O control The 140 I/O pins support interfacing to sensors, actuators, and peripheral devices where moderate pin count and flexible I/O are required.
- On-chip buffering and data handling Approximately 1.246 Mbits of embedded memory enable local buffering, FIFOs, and temporary data storage without immediate dependence on external memory.
Unique Advantages
- Balanced resource mix: Combines a substantial logic element count with embedded RAM and a 140-pin I/O budget for versatile mid-range designs.
- Compact, manufacturable package: 256-FPBGA (17×17) surface-mount package enables dense board layouts and standard SMT assembly flows.
- Low-voltage operation: Core supply specified between 1.14 V and 1.26 V for designs targeting lower-power programmable fabric operation.
- Commercial temperature suitability: Specified for 0°C to 85°C operation, matching many consumer and commercial electronics applications.
- RoHS compliant: Meets environmental compliance expectations for lead-free manufacturing.
Why Choose LFE2M20SE-7FN256C?
The LFE2M20SE-7FN256C positions itself as a practical, mid-range FPGA option for designs that require a solid combination of programmable logic, embedded memory, and a moderate I/O count in a compact BGA footprint. Its approximate 19,000 logic elements and ~1.246 Mbits of on-chip RAM provide designers flexibility to implement substantial functionality without immediately resorting to larger, more complex devices.
With a 256-FPBGA surface-mount package, low-voltage core operation, RoHS compliance, and commercial temperature rating, this FPGA is suited for mainstream embedded and electronic systems where integration density and predictable electrical characteristics are primary concerns.
Request a quote or submit an inquiry to check pricing and availability for the LFE2M20SE-7FN256C and to discuss lead times for your project needs.

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Headquarters: Hillsboro, Oregon, USA
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