LFE2M20SE-6FN484C
| Part Description |
ECP2M Field Programmable Gate Array (FPGA) IC 304 1246208 19000 484-BBGA |
|---|---|
| Quantity | 607 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 484-FPBGA (23x23) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | Tray | Number of I/O | 304 | Voltage | 1.14 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | N/A | REACH Compliance | N/A | ||
| Moisture Sensitivity Level | N/A | Number of LABs/CLBs | 2375 | Number of Logic Elements/Cells | 19000 | ||
| Number of Gates | N/A | ECCN | N/A | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 1246208 |
Overview of LFE2M20SE-6FN484C – ECP2M FPGA, ~19,000 Logic Elements, ~1.246 Mbits RAM, 304 I/Os, 484-FP BGA
The LFE2M20SE-6FN484C is a Lattice ECP2M family field programmable gate array (FPGA) optimized for mid-range system integration. It combines approximately 19,000 logic elements with flexible on-chip memory and a high I/O count to address applications that require programmable logic, embedded processing and high-speed serial or parallel interfaces.
Designed for commercial-temperature applications, this surface-mount device delivers a balance of logic density, embedded memory and I/O capability packaged in a 484-ball fpBGA (23 × 23 mm) footprint.
Key Features
- Programmable Logic Capacity Approximately 19,000 logic elements provide the fabric for complex custom logic, glue functions and protocol handling.
- Embedded Memory Approximately 1.246 Mbits of on-chip RAM for frame buffers, FIFOs, lookup tables and intermediate data storage.
- I/O and Package 304 programmable I/Os in a 484-FPBGA (23 × 23 mm) package; surface-mount tray packaging supports compact board-level integration.
- Core Power 1.14 V core supply requirement simplifies power rail planning for the FPGA core.
- Operating Range Commercial temperature operation from 0 °C to 85 °C suitable for a wide range of consumer and enterprise applications.
- High-Speed Serial and DSP Capabilities (Family) The LatticeECP2/M family includes embedded SERDES (250 Mbps to 3.125 Gbps) and dedicated sysDSP blocks for high-performance multiply/accumulate workloads.
- Flexible Memory Architecture (Family) The family supports embedded block RAM (EBR) and distributed RAM options, including 18Kbit EBR blocks and multiple port modes for system buffering and packet processing.
- Clocking and System Integration (Family) Multiple PLLs and DLLs in the family provide clock multiply/divide and phase/delay adjustments for timing-critical designs.
- Programmable I/O Standards (Family) Family support for a broad range of I/O standards (LVTTL, LVCMOS, SSTL, HSTL, LVDS, LVPECL and others) enables interface flexibility across protocols and memory interfaces.
- Configuration and Security (Family) Flexible configuration options include SPI boot, dual-boot image support and optional bitstream encryption on "S" family variants.
Typical Applications
- Telecommunications & Networking Mid-range packet processing, aggregation and protocol bridging leveraging the family’s SERDES and high I/O capability.
- High-Speed Serial Interfaces PHY/PCS and chip-to-chip serial links that benefit from the family’s embedded SERDES and equalization/pre-emphasis features.
- Signal Processing & DSP Implement filtering, FFTs and other DSP functions using the family’s dedicated sysDSP blocks and embedded memory.
- Memory Interfaces and Buffering DDR and source-synchronous interface support for systems requiring dedicated DQS and DDR gearing logic.
- System Integration & Prototyping Combine logic, memory and I/O on a single device to reduce BOM count and accelerate time-to-market for embedded systems.
Unique Advantages
- Balanced Logic and Memory: The combination of ~19,000 logic elements and ~1.246 Mbits of embedded RAM supports complex control and data-path designs without external logic proliferation.
- High I/O Density in a Compact Package: 304 I/Os in a 484-FPBGA (23 × 23 mm) enable dense pinouts suitable for multi-channel interfaces and mezzanine-style connections.
- Family-Level High-Speed SerDes and DSP: Access to SERDES and sysDSP capabilities in the ECP2M family enables scalable serial connectivity and efficient arithmetic processing.
- Flexible I/O Standards: Broad programmable I/O options simplify interfacing to a wide range of memory devices, transceivers and logic levels.
- Comprehensive Clocking and Configuration: On-chip PLL/DLL resources and flexible boot/configuration options streamline system-level design and update flows.
- Vendor Ecosystem Support: Family support via Lattice design tools helps accelerate implementation and debugging for medium-complexity FPGA projects.
Why Choose LFE2M20SE-6FN484C?
The LFE2M20SE-6FN484C positions itself as a versatile mid-range FPGA option within the Lattice ECP2M family—offering a practical mix of programmable logic, embedded memory and high I/O count in a compact fpBGA package. It is suited for designers who need a single-device solution for protocol bridging, signal processing, memory interfacing and high-speed serial connectivity.
For teams targeting scalable, integrated systems while leveraging Lattice’s family-level SERDES, DSP and configuration features, this device delivers predictable electrical and thermal planning with a commercial temperature rating and a defined 1.14 V core supply.
If you would like pricing, lead-time or volume quoting for LFE2M20SE-6FN484C, submit a request for a quote or contact sales to receive a customized response.