LFE2M20SE-6FN484C

IC FPGA 304 I/O 484FBGA
Part Description

ECP2M Field Programmable Gate Array (FPGA) IC 304 1246208 19000 484-BBGA

Quantity 607 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package484-FPBGA (23x23)GradeCommercialOperating Temperature0°C – 85°C
Package / CaseTrayNumber of I/O304Voltage1.14 V
Mounting MethodSurface MountRoHS ComplianceN/AREACH ComplianceN/A
Moisture Sensitivity LevelN/ANumber of LABs/CLBs2375Number of Logic Elements/Cells19000
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits1246208

Overview of LFE2M20SE-6FN484C – ECP2M FPGA, ~19,000 Logic Elements, ~1.246 Mbits RAM, 304 I/Os, 484-FP BGA

The LFE2M20SE-6FN484C is a Lattice ECP2M family field programmable gate array (FPGA) optimized for mid-range system integration. It combines approximately 19,000 logic elements with flexible on-chip memory and a high I/O count to address applications that require programmable logic, embedded processing and high-speed serial or parallel interfaces.

Designed for commercial-temperature applications, this surface-mount device delivers a balance of logic density, embedded memory and I/O capability packaged in a 484-ball fpBGA (23 × 23 mm) footprint.

Key Features

  • Programmable Logic Capacity  Approximately 19,000 logic elements provide the fabric for complex custom logic, glue functions and protocol handling.
  • Embedded Memory  Approximately 1.246 Mbits of on-chip RAM for frame buffers, FIFOs, lookup tables and intermediate data storage.
  • I/O and Package  304 programmable I/Os in a 484-FPBGA (23 × 23 mm) package; surface-mount tray packaging supports compact board-level integration.
  • Core Power  1.14 V core supply requirement simplifies power rail planning for the FPGA core.
  • Operating Range  Commercial temperature operation from 0 °C to 85 °C suitable for a wide range of consumer and enterprise applications.
  • High-Speed Serial and DSP Capabilities (Family)  The LatticeECP2/M family includes embedded SERDES (250 Mbps to 3.125 Gbps) and dedicated sysDSP blocks for high-performance multiply/accumulate workloads.
  • Flexible Memory Architecture (Family)  The family supports embedded block RAM (EBR) and distributed RAM options, including 18Kbit EBR blocks and multiple port modes for system buffering and packet processing.
  • Clocking and System Integration (Family)  Multiple PLLs and DLLs in the family provide clock multiply/divide and phase/delay adjustments for timing-critical designs.
  • Programmable I/O Standards (Family)  Family support for a broad range of I/O standards (LVTTL, LVCMOS, SSTL, HSTL, LVDS, LVPECL and others) enables interface flexibility across protocols and memory interfaces.
  • Configuration and Security (Family)  Flexible configuration options include SPI boot, dual-boot image support and optional bitstream encryption on "S" family variants.

Typical Applications

  • Telecommunications & Networking  Mid-range packet processing, aggregation and protocol bridging leveraging the family’s SERDES and high I/O capability.
  • High-Speed Serial Interfaces  PHY/PCS and chip-to-chip serial links that benefit from the family’s embedded SERDES and equalization/pre-emphasis features.
  • Signal Processing & DSP  Implement filtering, FFTs and other DSP functions using the family’s dedicated sysDSP blocks and embedded memory.
  • Memory Interfaces and Buffering  DDR and source-synchronous interface support for systems requiring dedicated DQS and DDR gearing logic.
  • System Integration & Prototyping  Combine logic, memory and I/O on a single device to reduce BOM count and accelerate time-to-market for embedded systems.

Unique Advantages

  • Balanced Logic and Memory: The combination of ~19,000 logic elements and ~1.246 Mbits of embedded RAM supports complex control and data-path designs without external logic proliferation.
  • High I/O Density in a Compact Package: 304 I/Os in a 484-FPBGA (23 × 23 mm) enable dense pinouts suitable for multi-channel interfaces and mezzanine-style connections.
  • Family-Level High-Speed SerDes and DSP: Access to SERDES and sysDSP capabilities in the ECP2M family enables scalable serial connectivity and efficient arithmetic processing.
  • Flexible I/O Standards: Broad programmable I/O options simplify interfacing to a wide range of memory devices, transceivers and logic levels.
  • Comprehensive Clocking and Configuration: On-chip PLL/DLL resources and flexible boot/configuration options streamline system-level design and update flows.
  • Vendor Ecosystem Support: Family support via Lattice design tools helps accelerate implementation and debugging for medium-complexity FPGA projects.

Why Choose LFE2M20SE-6FN484C?

The LFE2M20SE-6FN484C positions itself as a versatile mid-range FPGA option within the Lattice ECP2M family—offering a practical mix of programmable logic, embedded memory and high I/O count in a compact fpBGA package. It is suited for designers who need a single-device solution for protocol bridging, signal processing, memory interfacing and high-speed serial connectivity.

For teams targeting scalable, integrated systems while leveraging Lattice’s family-level SERDES, DSP and configuration features, this device delivers predictable electrical and thermal planning with a commercial temperature rating and a defined 1.14 V core supply.

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