LFE2M20SE-6FN256I

The LFE2M20SE-6FN256I is an ECP2M family Field Programmable Gate Array (FPGA) provided in a 256-BGA surface-mount package. It delivers 19,000 logic elements and approximately 1.246 Mbits of embedded memory with 140 user I/O pins, targeting designs that require moderate logic density and on-chip memory in an industrial-grade device.

Designed for industrial-temperature operation, this device supports a core voltage supply range of 1.14 V to 1.26 V and an operating temperature range of −40 °C to 100 °C, making it suitable for applications that demand reliable operation across extended temperature ranges.

Key Features

• Core Logic  19,000 logic elements for implementing custom digital logic and control functions.
• Embedded Memory  Approximately 1.246 Mbits of on-chip RAM to store buffers, registers, and state information without external memory.
• I/O Capacity  140 user I/O pins to interface with peripherals, sensors, and system buses.
• Package  256-ball fine-pitch BGA (256-FPBGA, 17×17) surface-mount package for compact board-level integration.
• Power  Core voltage supply range of 1.14 V to 1.26 V to match system power rails and design constraints.
• Temperature and Grade  Industrial-grade device rated for operation from −40 °C to 100 °C for extended-environment reliability.
• RoHS Compliance  RoHS-compliant material status for environmental conformity in assembly.

Typical Applications

• Industrial Control  Implement custom control logic and I/O aggregation using the device’s 19,000 logic elements and 140 I/O pins within industrial-temperature systems.
• Communications Interfaces  Use the on-chip memory and ample I/O to implement protocol bridging, data buffering, and interface adaptation functions.
• Instrumentation and Test Equipment  Deploy programmable logic and embedded RAM for data acquisition, preprocessing, and real-time signal handling in equipment operating across wide temperature ranges.

Unique Advantages

• Substantial Logic Density:  19,000 logic elements enable integration of multiple control and processing functions into a single device, reducing BOM count.
• Significant On-Chip Memory:  Approximately 1.246 Mbits of embedded RAM supports buffering and state retention without external memory, simplifying board design.
• High I/O Count:  140 user I/O pins allow flexible connectivity to peripherals and system buses, minimizing the need for external I/O expanders.
• Industrial Temperature Range:  Rated from −40 °C to 100 °C, the device supports applications exposed to extended environmental conditions.
• Compact BGA Packaging:  The 256-FPBGA (17×17) package provides a compact footprint for space-constrained designs while maintaining robust pin count.
• RoHS-Compliant:  Environmentally compliant materials facilitate integration into modern assembly processes.

Why Choose LFE2M20SE-6FN256I?

The LFE2M20SE-6FN256I positions itself as a practical FPGA choice where mid-range logic capacity, on-chip memory, and a high I/O count are required within an industrial-temperature envelope. Its 256-BGA package and surface-mount mounting type support compact, manufacturable PCB designs.

This device suits engineering teams building control, interface, or instrumentation solutions that need programmable logic, embedded RAM, and reliable operation from −40 °C to 100 °C. The combination of logic density, memory, I/O, and industrial-grade operation provides a balanced platform for scalable, robust designs.

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