LFE5U-12F-7BG256I

IC FPGA 197 I/O 256CABGA
Part Description

ECP5 Field Programmable Gate Array (FPGA) IC 197 589824 12000 256-LFBGA

Quantity 332 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time20 Weeks
Datasheet

Specifications & Environmental

Device Package256-CABGA (14x14)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case256-LFBGANumber of I/O197Voltage1.045 V - 1.155 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs3000Number of Logic Elements/Cells12000
Number of GatesN/AECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits589824

Overview of LFE5U-12F-7BG256I – ECP5 Field Programmable Gate Array (FPGA) IC 197 589824 12000 256-LFBGA

The LFE5U-12F-7BG256I is an industrial-grade FPGA from the Lattice ECP5 family, offering a mid-range balance of programmable logic, embedded memory, I/O density and system-level peripherals. Its architecture is targeted at industrial and embedded designs that require configurable logic, DSP-style processing slices and high-speed I/O in a compact 256-LFBGA package.

With approximately 12,000 logic elements, roughly 0.59 Mbits of on-chip RAM and 197 I/O pins, this device is engineered to integrate custom logic, memory and interface functions while operating across a wide industrial temperature range.

Key Features

  • Core Architecture  ECP5 family FPGA architecture with programmable logic resources and a documented structure for slices, routing and clocking.
  • Logic Capacity  Approximately 12,000 logic elements and about 3,000 logic blocks, providing mid-range programmable logic density for custom hardware functions.
  • Embedded Memory  Approximately 589,824 bits (≈0.59 Mbits) of on-chip RAM with support for single, dual and pseudo-dual port memory modes.
  • I/O and High-Speed Interfaces  197 programmable I/O pins and on-chip SERDES/PCS blocks and I/O buffer banks to support diverse signalling and serial connectivity requirements.
  • DSP and System Resources  Dedicated sysDSP and sysMEM resources are included in the ECP5 architecture to support arithmetic and memory-intensive tasks.
  • Clocking and Timing  Comprehensive clocking structure with sysCLOCK PLLs, clock distribution network, clock dividers and DDRDLL features for precise timing and DDR memory interfaces.
  • Power and Operating Range  Core supply recommended between 1.045 V and 1.155 V, designed for reliable operation across industrial conditions.
  • Package and Mounting  256-LFBGA package (supplier package: 256-CABGA, 14×14 mm) in a surface-mount form factor for compact PCB integration.
  • Industrial Grade and Compliance  Rated for operation from −40 °C to 100 °C and RoHS compliant for environmental compliance in industrial applications.

Typical Applications

  • Industrial Control and Automation  Programmable logic and on-chip memory make the device suitable for implementing control algorithms, I/O aggregation and timing-critical functions in industrial systems.
  • High-Speed Serial Interfaces  On-chip SERDES and programmable I/O support implementation of custom serial links and interface bridging for communications equipment and data concentrators.
  • Embedded Signal Processing  sysDSP resources and local RAM enable DSP-style processing tasks such as filtering, aggregation or preprocessing of sensor data.
  • DDR Memory Interfacing  Integrated DDR support and dedicated DQS/DQSBUF features help implement external memory interfaces for systems needing expanded working memory.

Unique Advantages

  • Balanced Logic and Memory:  Combined approximately 12,000 logic elements with ~0.59 Mbits of embedded RAM to handle both control logic and moderate data buffering on-chip.
  • High I/O Count:  197 I/O pins enable dense peripheral connectivity and flexible pin assignments for mixed-signal and multi-interface boards.
  • Integrated Timing and DDR Support:  sysCLOCK PLLs, DDRDLL and comprehensive clock distribution simplify reliable timing and external memory interfacing.
  • Industrial Temperature Rating:  Rated for −40 °C to 100 °C operation, supporting deployment in industrial environments and temperature-variable installations.
  • Compact Surface-Mount Package:  256-LFBGA (256-CABGA, 14×14 mm) delivers a small footprint for space-constrained PCBs while maintaining robust I/O and logic capacity.
  • RoHS Compliant:  Conforms to RoHS requirements for environmental and manufacturing standards.

Why Choose LFE5U-12F-7BG256I?

The LFE5U-12F-7BG256I provides a well-rounded FPGA option for designers seeking a combination of moderate logic density, embedded memory and extensive I/O in an industrial-grade package. As part of the Lattice ECP5 family, the device is architected to support system-level functions including DSP processing, DDR memory interfacing and high-speed serial links while operating across a broad temperature range.

This device is suited for engineers and procurement teams building industrial embedded systems, communications interfaces, or applications that require integrated timing, memory and connectivity in a compact, surface-mount form factor.

Request a quote or submit a purchase inquiry to get pricing and availability for the LFE5U-12F-7BG256I.

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