LFE5U-12F-7BG381I

IC FPGA 197 I/O 381CABGA
Part Description

ECP5 Field Programmable Gate Array (FPGA) IC 197 589824 12000 381-FBGA

Quantity 785 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time20 Weeks
Datasheet

Specifications & Environmental

Device Package381-CABGA (17x17)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case381-FBGANumber of I/O197Voltage1.045 V - 1.155 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs3000Number of Logic Elements/Cells12000
Number of GatesN/AECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits589824

Overview of LFE5U-12F-7BG381I – ECP5 Field Programmable Gate Array (FPGA) 381-FBGA

The LFE5U-12F-7BG381I is an FPGA IC from the Lattice Semiconductor ECP5 family. It provides a balance of programmable logic, embedded memory and flexible I/O resources in a 381-ball FBGA package suited for industrial-temperature operation.

Engineered for designs that require moderate logic capacity with substantial I/O count and on-chip RAM, this device supports system-level functions including clocking, memory interfaces and high-speed serial blocks as described in the ECP5 family datasheet.

Key Features

  • Core Logic  12,000 logic elements for implementing combinational and sequential logic, state machines and glue logic.
  • Embedded Memory  Approximately 0.59 Mbits (589,824 bits) of on-chip RAM for buffering, FIFOs and small data stores.
  • I/O Capacity  197 user I/O pins to support dense peripheral integration and multiple external interfaces.
  • Packaging  381-FBGA package (supplier device package: 381-CABGA, 17×17) and surface-mount mounting type for compact board-level integration.
  • Power  Core supply operating range of 1.045 V to 1.155 V for the device core rails.
  • Temperature & Robustness  Industrial operating temperature range from −40 °C to 100 °C and RoHS-compliant construction.
  • Architectural Features (per ECP5 family datasheet)  Family-level architecture includes programmable I/O cells, sysCLOCK PLLs, DDR memory support, SERDES blocks and a flexible clock distribution network as documented in the ECP5 datasheet.

Typical Applications

  • High‑density I/O bridging  Use the 197 I/O pins and programmable I/O cells to consolidate multiple external interfaces and perform protocol bridging.
  • Memory buffering and controllers  Leverage approximately 0.59 Mbits of embedded RAM and DDR memory support (per family datasheet) for buffering and local storage in data-path designs.
  • Embedded logic and glue  Implement control logic, state machines and peripheral interfaces using the 12,000 logic elements to reduce discrete component count.
  • High‑speed serial links  Employ the documented SERDES and clocking features of the ECP5 family to support serial data interfaces where required by the application.

Unique Advantages

  • Balanced integration: Combines 12,000 logic elements with substantial embedded RAM and 197 I/Os to address mid-level FPGA requirements without excessive overcapacity.
  • Industrial temperature rating: Rated for −40 °C to 100 °C operation, enabling deployment in industrial environments.
  • Compact, high‑I/O package: 381-FBGA (381-CABGA, 17×17) package supports high pin count in a compact footprint for space‑constrained boards.
  • Documented family features: The ECP5 family datasheet details integrated PLLs, DDR support, SERDES and flexible clocking — useful for system-level designs requiring these blocks.
  • Controlled core supply range: Narrow core voltage range (1.045 V–1.155 V) supports deterministic power planning for the device core rails.
  • RoHS compliant: Conforms to RoHS environmental requirements for lead-free assembly and regulatory workflows.

Why Choose LFE5U-12F-7BG381I?

The LFE5U-12F-7BG381I positions itself as a practical choice for designers seeking a mid-density FPGA with a strong balance of logic, on-chip RAM and I/O resources within the ECP5 family architecture. Its documented family features — including programmable I/O, PLLs, DDR support and SERDES blocks — provide the building blocks for embedded control, interface bridging and data-path functions.

With industrial temperature support, RoHS compliance and a compact 381-FBGA package, this part suits applications that require reliable operation across a wide temperature range and tight board-space constraints while leveraging the system-level capabilities described in the ECP5 datasheet.

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