LFE5U-12F-7BG381C
| Part Description |
ECP5 Field Programmable Gate Array (FPGA) IC 197 589824 12000 381-FBGA |
|---|---|
| Quantity | 1,762 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 20 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 381-CABGA (17x17) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 381-FBGA | Number of I/O | 197 | Voltage | 1.045 V - 1.155 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 3000 | Number of Logic Elements/Cells | 12000 | ||
| Number of Gates | N/A | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 589824 |
Overview of LFE5U-12F-7BG381C – ECP5 Field Programmable Gate Array (FPGA) IC 197 589824 12000 381-FBGA
The LFE5U-12F-7BG381C is a member of the ECP5 family of FPGAs from Lattice Semiconductor, providing mid-range programmable logic in a compact 381-ball FBGA package. It combines configurable logic, embedded memory, and flexible I/O in a surface-mount 17 × 17 CABGA footprint for space-constrained designs.
This device targets designs that require up to 12,000 logic elements, substantial on-chip RAM, and broad I/O capability—delivering a balance of integration, I/O density, and system-level features described in the ECP5 family data sheet.
Key Features
- Logic Capacity — 12,000 logic elements (cells) suitable for mid-density programmable logic implementations and custom digital functions.
- Embedded Memory — Approximately 0.59 Mbits (589,824 bits) of on-chip RAM for buffering, lookup tables, and small memory structures.
- I/O Density — 197 user I/O pins to support extensive peripheral interfacing and board-level connectivity in a single device.
- Power and Voltage — Core voltage supply range of 1.045 V to 1.155 V, supporting low-voltage system integration.
- Packaging and Mounting — 381-FBGA (381-CABGA 17×17) surface-mount package for compact board layouts and reliable soldered mounting.
- Operating Range — Commercial temperature grade with an operating range of 0 °C to 85 °C.
- ECP5 Family Architecture — Family-level features documented in the datasheet include programmable logic slices, sysMEM memory blocks, sysDSP slices, flexible clocking with sysCLOCK PLL, DDR memory support, SERDES and PCS blocks, programmable I/O cells, on-chip oscillator, and IEEE 1149.1-compliant boundary scan testability.
- Standards and Compliance — RoHS compliant for lead-free assembly and regulatory alignment.
Typical Applications
- High-speed serial interfaces — Use the ECP5 family’s SERDES and PCS blocks to implement serial link endpoints and protocol bridging.
- Memory interface and buffering — DDR memory support and embedded sysMEM blocks provide resources for memory controllers, buffering, and data staging logic.
- Embedded signal processing — sysDSP slice capability combined with on-chip RAM enables compact DSP and real-time processing pipelines.
- I/O expansion and glue logic — 197 I/Os and programmable I/O cells make the device suitable for consolidating board-level logic, protocol translation, and peripheral aggregation.
- Compact, space-constrained systems — 381-FBGA (17×17) surface-mount package fits dense PCB layouts where board area is limited.
Unique Advantages
- Mid-density integration: 12,000 logic elements deliver a balance between capacity and cost for a wide range of programmable logic tasks without overprovisioning.
- On-chip memory for system-level tasks: Approximately 0.59 Mbits of embedded RAM reduces external memory dependence for many buffering and LUT requirements.
- High I/O count: 197 I/Os enable extensive peripheral connectivity and simplify board-level routing by consolidating signals into a single device.
- System-level features from the ECP5 family: Documented support for PLL-based clocking, DDR interfaces, SERDES, programmable I/O, and boundary scan simplifies implementation of complex interfaces.
- Compact FBGA package: The 381-CABGA (17×17) package supports dense PCB designs while maintaining reliable surface-mount assembly.
- RoHS-compliant: Meets lead-free assembly requirements for modern electronics manufacturing processes.
Why Choose LFE5U-12F-7BG381C?
The LFE5U-12F-7BG381C provides a practical, mid-density FPGA option within the documented ECP5 family architecture—combining 12,000 logic elements, substantial embedded RAM, and 197 I/Os in a compact 381-FBGA package. Its commercial temperature rating and low-voltage core supply make it suitable for a wide range of embedded, communications, and interface-focused designs that require programmable logic alongside system-level features such as SERDES, DDR support, and flexible clocking.
For design teams seeking a compact FPGA with an integrated set of memory, DSP, and I/O capabilities, this device offers a clear balance of integration and feature set aligned with the ECP5 family data sheet.
Request a quote or submit your procurement inquiry to obtain pricing, availability, and lead-time information for the LFE5U-12F-7BG381C.

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