LFE5U-12F-7BG381C

IC FPGA 197 I/O 381CABGA
Part Description

ECP5 Field Programmable Gate Array (FPGA) IC 197 589824 12000 381-FBGA

Quantity 1,762 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time20 Weeks
Datasheet

Specifications & Environmental

Device Package381-CABGA (17x17)GradeCommercialOperating Temperature0°C – 85°C
Package / Case381-FBGANumber of I/O197Voltage1.045 V - 1.155 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs3000Number of Logic Elements/Cells12000
Number of GatesN/AECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits589824

Overview of LFE5U-12F-7BG381C – ECP5 Field Programmable Gate Array (FPGA) IC 197 589824 12000 381-FBGA

The LFE5U-12F-7BG381C is a member of the ECP5 family of FPGAs from Lattice Semiconductor, providing mid-range programmable logic in a compact 381-ball FBGA package. It combines configurable logic, embedded memory, and flexible I/O in a surface-mount 17 × 17 CABGA footprint for space-constrained designs.

This device targets designs that require up to 12,000 logic elements, substantial on-chip RAM, and broad I/O capability—delivering a balance of integration, I/O density, and system-level features described in the ECP5 family data sheet.

Key Features

  • Logic Capacity — 12,000 logic elements (cells) suitable for mid-density programmable logic implementations and custom digital functions.
  • Embedded Memory — Approximately 0.59 Mbits (589,824 bits) of on-chip RAM for buffering, lookup tables, and small memory structures.
  • I/O Density — 197 user I/O pins to support extensive peripheral interfacing and board-level connectivity in a single device.
  • Power and Voltage — Core voltage supply range of 1.045 V to 1.155 V, supporting low-voltage system integration.
  • Packaging and Mounting — 381-FBGA (381-CABGA 17×17) surface-mount package for compact board layouts and reliable soldered mounting.
  • Operating Range — Commercial temperature grade with an operating range of 0 °C to 85 °C.
  • ECP5 Family Architecture — Family-level features documented in the datasheet include programmable logic slices, sysMEM memory blocks, sysDSP slices, flexible clocking with sysCLOCK PLL, DDR memory support, SERDES and PCS blocks, programmable I/O cells, on-chip oscillator, and IEEE 1149.1-compliant boundary scan testability.
  • Standards and Compliance — RoHS compliant for lead-free assembly and regulatory alignment.

Typical Applications

  • High-speed serial interfaces — Use the ECP5 family’s SERDES and PCS blocks to implement serial link endpoints and protocol bridging.
  • Memory interface and buffering — DDR memory support and embedded sysMEM blocks provide resources for memory controllers, buffering, and data staging logic.
  • Embedded signal processing — sysDSP slice capability combined with on-chip RAM enables compact DSP and real-time processing pipelines.
  • I/O expansion and glue logic — 197 I/Os and programmable I/O cells make the device suitable for consolidating board-level logic, protocol translation, and peripheral aggregation.
  • Compact, space-constrained systems — 381-FBGA (17×17) surface-mount package fits dense PCB layouts where board area is limited.

Unique Advantages

  • Mid-density integration: 12,000 logic elements deliver a balance between capacity and cost for a wide range of programmable logic tasks without overprovisioning.
  • On-chip memory for system-level tasks: Approximately 0.59 Mbits of embedded RAM reduces external memory dependence for many buffering and LUT requirements.
  • High I/O count: 197 I/Os enable extensive peripheral connectivity and simplify board-level routing by consolidating signals into a single device.
  • System-level features from the ECP5 family: Documented support for PLL-based clocking, DDR interfaces, SERDES, programmable I/O, and boundary scan simplifies implementation of complex interfaces.
  • Compact FBGA package: The 381-CABGA (17×17) package supports dense PCB designs while maintaining reliable surface-mount assembly.
  • RoHS-compliant: Meets lead-free assembly requirements for modern electronics manufacturing processes.

Why Choose LFE5U-12F-7BG381C?

The LFE5U-12F-7BG381C provides a practical, mid-density FPGA option within the documented ECP5 family architecture—combining 12,000 logic elements, substantial embedded RAM, and 197 I/Os in a compact 381-FBGA package. Its commercial temperature rating and low-voltage core supply make it suitable for a wide range of embedded, communications, and interface-focused designs that require programmable logic alongside system-level features such as SERDES, DDR support, and flexible clocking.

For design teams seeking a compact FPGA with an integrated set of memory, DSP, and I/O capabilities, this device offers a clear balance of integration and feature set aligned with the ECP5 family data sheet.

Request a quote or submit your procurement inquiry to obtain pricing, availability, and lead-time information for the LFE5U-12F-7BG381C.

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