LFE5U-45F-7BG256I

IC FPGA 197 I/O 256CABGA
Part Description

ECP5 Field Programmable Gate Array (FPGA) IC 197 1990656 44000 256-LFBGA

Quantity 261 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time20 Weeks
Datasheet

Specifications & Environmental

Device Package256-CABGA (14x14)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case256-LFBGANumber of I/O197Voltage1.045 V - 1.155 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs11000Number of Logic Elements/Cells44000
Number of GatesN/AECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits1990656

Overview of LFE5U-45F-7BG256I – ECP5 Field Programmable Gate Array (FPGA), 44,000 logic elements, 256-LFBGA

The LFE5U-45F-7BG256I is a member of the Lattice ECP5 FPGA family, delivering a mid-range reconfigurable logic device targeted at industrial-grade applications. It combines a substantial logic fabric with embedded memory and flexible I/O resources to support custom digital logic, interface bridging, and system-level integration.

Based on the ECP5 family architecture, this device is appropriate for designs that require a balance of logic capacity, on-chip memory, and I/O density within a compact 256-ball LFBGA package.

Key Features

  • Logic Capacity  Approximately 44,000 logic elements organized as 11,000 CLBs, providing room for complex FPGA designs and custom logic functions.
  • Embedded Memory  Approximately 1.99 Mbits of on-chip RAM to support buffering, FIFOs, and on-chip data storage.
  • I/O Resources  197 device I/Os for flexible interfacing to peripherals, sensors, and external memory.
  • Power Supply  Specified operating supply range of 1.045 V to 1.155 V for core power planning and regulator selection.
  • Industrial Temperature Range  Qualified for operation from −40 °C to 100 °C to meet industrial environmental requirements.
  • Package & Mounting  256-LFBGA surface-mount package; supplier device package listed as 256-CABGA (14×14) to support high-density board layouts.
  • Series-Level Architecture  ECP5 family features described in the datasheet include DDR memory support, SERDES blocks, programmable I/O cells, on-chip PLLs and clocking structures, and dedicated DSP/memory resources to support diverse system functions.
  • Regulatory  RoHS compliant to support environmental and supply-chain requirements.

Typical Applications

  • Industrial Control  Implement custom control logic, sensor aggregation, and I/O bridging in factory automation and process control equipment.
  • Communications & Connectivity  Use available SERDES and I/O resources for protocol bridging, datapath processing, and interface adaptation in communication systems.
  • Embedded Signal Processing  Leverage on-chip memory and DSP-oriented slices (as described in the ECP5 family datasheet) for real-time data buffering and arithmetic processing.
  • Custom Logic Integration  Consolidate discrete logic, glue functions, and peripheral interfaces into a single reconfigurable device to reduce BOM and board complexity.

Unique Advantages

  • Balanced Logic and Memory  Combines approximately 44,000 logic elements with nearly 2 Mbits of embedded RAM to handle mid-density logic and data buffering without external memory in many designs.
  • High I/O Count  197 I/Os enable extensive peripheral connectivity and flexible pin assignment for mixed-signal and mixed-function boards.
  • Industrial Qualification  Rated for −40 °C to 100 °C operation, making it suitable for many industrial environments that demand extended temperature tolerance.
  • Compact, Surface-Mount Package  256-ball LFBGA footprint supports high-density PCB layouts while maintaining robust mounting for production assembly.
  • Design Flexibility from ECP5 Architecture  Family-level features such as programmable I/O, DDR support, SERDES, and on-chip clocking give designers system-level options without relying solely on external components.
  • RoHS Compliance  Supports environmental compliance requirements for commercial and industrial supply chains.

Why Choose LFE5U-45F-7BG256I?

The LFE5U-45F-7BG256I positions itself as a versatile, industrial-grade FPGA option within the ECP5 family, offering a practical combination of logic density, embedded memory, and I/O capability in a compact 256-ball package. It is well suited for engineers and design teams aiming to consolidate logic, implement custom interfaces, or add in-field reconfigurability while maintaining temperature and environmental robustness.

For projects that demand mid-range FPGA capacity with clear system-level features described in the ECP5 datasheet, this device provides predictable power requirements, defined thermal range, and a package footprint conducive to volume manufacturing and high-density board designs.

If you would like pricing, availability, or to request a formal quote for the LFE5U-45F-7BG256I, submit a quote request or contact sales with your quantity and lead-time requirements.

Request a Quote

















    No file selected



    Our team will respond within 24 hours.


    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.

    Certifications and Membership
    NQA AS9100 CMYK ANAB
    NQA AS9100 ANAB Badge
    ESD2020 Badge
    ESD2020 Association Badge
    GIDEP Badge
    GIDEP Badge
    Suntsu ERAI MemberVerification
    Suntsu ERAI Member Verification
    Available Shipping Methods
    FedEx
    UPS
    DHL
    Accepted Payment Methods
    American Express
    American Express
    Discover
    Discover
    MasterCard
    MasterCard
    Visa
    Visa
    UnionPay
    UnionPay

    Date Founded: 1983


    Headquarters: Hillsboro, Oregon, USA


    Employees: 1,000+


    Revenue: $627.7 Million


    Certifications and Memberships: ISO9001:2015, ISO14001:2015, IATF16949:2016


    Featured Products
    Latest News
    keyboard_arrow_up