LFE5U-45F-7BG554C
| Part Description |
ECP5 Field Programmable Gate Array (FPGA) IC 245 1990656 44000 554-FBGA |
|---|---|
| Quantity | 7 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 20 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 554-CABGA (23x23) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 554-FBGA | Number of I/O | 245 | Voltage | 1.045 V - 1.155 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 11000 | Number of Logic Elements/Cells | 44000 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 1990656 |
Overview of LFE5U-45F-7BG554C – ECP5 Field Programmable Gate Array (FPGA) IC 245 1990656 44000 554-FBGA
The LFE5U-45F-7BG554C is a Lattice Semiconductor ECP5 family FPGA offered in a 554-FBGA (23×23) package. It provides a programmable fabric with 44,000 logic elements, approximately 1.99 Mbits of embedded RAM, and 245 user I/O pins for dense, configurable logic integration in commercial designs.
Built around the ECP5 family architecture described in the datasheet, this device targets applications that require flexible I/O, on-chip memory, and advanced fabric features such as PLLs, DDR support, SERDES, and sysDSP slices to implement custom logic, interfaces, and signal-processing functions.
Key Features
- Core Logic 44,000 logic elements provide programmable capacity for glue logic, state machines, and custom datapaths.
- Embedded Memory Approximately 1.99 Mbits of on-chip RAM to support buffering, FIFOs, and local data storage.
- High I/O Count 245 user I/O pins enable rich connectivity for parallel buses, memory interfaces, and peripheral signals.
- Package & Mounting 554-FBGA (23×23) package, surface-mount mounting type for compact board-level integration.
- Power Core supply range specified between 1.045 V and 1.155 V to match system power rails and enable predictable power design.
- Commercial Temperature Rated for operation from 0 °C to 85 °C for commercial-grade deployments.
- Family-Level Architecture ECP5 family features documented in the datasheet include flexible routing, clocking structure with sysCLOCK PLLs, DDR memory support, sysDSP slices, SERDES and PCS subsystems, programmable I/O cells, and device configuration options.
- RoHS Compliant Meets RoHS environmental compliance for lead-free assembly and regulatory alignment.
Typical Applications
- Interface Bridging and Protocol Conversion Use the high I/O count and SERDES/PCS-capable architecture to implement protocol translation and high-speed serial interfaces.
- Embedded and Commercial Systems Integrate custom control logic, peripheral management, and timing-critical functions within compact commercial products.
- DDR Memory Controllers and Buffering Leverage on-chip RAM and DDR-oriented features for buffering and memory interface logic.
- Signal Processing and Acceleration Deploy sysDSP slices and programmable fabric for fixed-point signal-processing tasks and application-specific datapaths.
Unique Advantages
- High Logic Density: 44,000 logic elements provide substantial programmable capacity for complex finite-state machines, custom accelerators, and glue logic without external ASICs.
- Substantial On-Chip Memory: Approximately 1.99 Mbits of embedded RAM reduces external memory dependence for many control and buffering needs.
- Extensive I/O: 245 I/Os enable broad system interfacing and flexible pin assignment for mixed-signal and digital peripherals.
- Integrated Family Features: ECP5 family capabilities such as PLLs, flexible clock distribution, DDR support, SERDES, and sysDSP slices allow designers to consolidate multiple functions into a single FPGA.
- Compact Package: 554-FBGA (23×23) delivers a dense board footprint for space-constrained commercial products.
- Regulatory and Supply Parameters: Commercial temperature rating (0 °C to 85 °C), defined core supply range (1.045 V–1.155 V), and RoHS compliance support predictable integration and environmental compliance.
Why Choose LFE5U-45F-7BG554C?
The LFE5U-45F-7BG554C positions itself as a compact, commercially graded FPGA solution within the Lattice ECP5 family, combining 44,000 logic elements, approximately 1.99 Mbits of embedded RAM, and 245 I/Os in a 554-FBGA package. Its documented family features—clocking, DDR support, SERDES, sysDSP slices, and programmable I/O—allow designers to consolidate interface, memory, and processing functions onto a single device while keeping board area and component count low.
This device is well suited for commercial embedded systems and interface-rich designs that require deterministic operating conditions (0 °C to 85 °C) and a clearly specified core supply range. Choosing LFE5U-45F-7BG554C offers a scalable path within the ECP5 family for projects that need programmable logic density, embedded memory, and a high pin count in a small package.
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