LFE5U-45F-7BG554I

IC FPGA 245 I/O 554CABGA
Part Description

ECP5 Field Programmable Gate Array (FPGA) IC 245 1990656 44000 554-FBGA

Quantity 83 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time20 Weeks
Datasheet

Specifications & Environmental

Device Package554-CABGA (23x23)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case554-FBGANumber of I/O245Voltage1.045 V - 1.155 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs11000Number of Logic Elements/Cells44000
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits1990656

Overview of LFE5U-45F-7BG554I – ECP5 Field Programmable Gate Array (FPGA) IC 245 1990656 44000 554-FBGA

The LFE5U-45F-7BG554I is an industrial-grade FPGA from the Lattice ECP5 family. It provides a balanced combination of logic density, embedded memory and I/O capacity for mid-range programmable-logic applications.

This device features 44,000 logic elements across approximately 11,000 logic blocks, roughly 1.99 Mbits of on-chip RAM, and 245 user I/O — making it suitable for industrial systems that require extended temperature operation, a high I/O count, and compact surface-mount packaging.

Key Features

  • Core Logic 44,000 logic elements organized across about 11,000 logic blocks to implement control, glue logic and custom datapaths.
  • Embedded Memory Approximately 1.99 Mbits of on-chip RAM for frame buffers, FIFOs, state storage and local data buffering.
  • I/O Capacity 245 user I/O pins provide extensive connectivity for external peripherals, sensors and parallel interfaces.
  • Power and Supply Core supply range from 1.045 V to 1.155 V, allowing precise power budgeting and compatibility with matching regulator rails.
  • Package and Mounting 554-ball FBGA package (supplier package: 554-CABGA, 23×23) in a surface-mount form factor for high-density PCB layouts.
  • Temperature Range Industrial operating range from −40 °C to 100 °C for deployment in extended-temperature environments.
  • Compliance RoHS-compliant construction to meet environmental and assembly requirements.
  • Family-Level Architecture (ECP5) The ECP5 family data sheet describes architecture elements such as programmable I/O cells, PLLs/clocking, DDR memory support and SERDES/PCS blocks that characterize the series.

Typical Applications

  • Industrial Control and Automation — Leverage the device’s industrial temperature rating, large I/O count and programmable logic for motor drives, PLC interfaces and machine control logic.
  • Protocol Bridging and I/O Aggregation — Use the combination of abundant I/O and on-chip memory for protocol conversion, bus bridging and peripheral aggregation.
  • Embedded System Glue Logic — Implement custom state machines, timing-critical interfaces and peripheral controllers that require deterministic logic and local RAM.

Unique Advantages

  • Balanced Logic and Memory: 44,000 logic elements with approximately 1.99 Mbits of RAM supports complex control and buffering without external memory in many designs.
  • High I/O Count: 245 user I/O pins simplify direct interfacing to sensors, data converters and external controllers, reducing PCB complexity.
  • Industrial Readiness: Rated for −40 °C to 100 °C operation, enabling deployment in extended-temperature industrial environments.
  • Compact, High-Density Package: 554-FBGA (23×23) surface-mount package allows high integration density for space-constrained boards.
  • Controlled Core Voltage: Narrow core supply window (1.045–1.155 V) supports predictable power design and stable operation.
  • RoHS Compliant: Meets common environmental assembly requirements for modern electronics production.

Why Choose LFE5U-45F-7BG554I?

The LFE5U-45F-7BG554I positions itself as a versatile mid-density FPGA for industrial and embedded applications that need significant logic capacity, on-chip memory and a large number of I/Os in a compact FBGA package. Its industrial temperature rating and RoHS compliance make it appropriate for designs that must operate reliably across extended conditions.

This part is well suited to engineers and procurement teams building systems that require a balanced mix of programmable logic, embedded RAM and extensive external connectivity while maintaining predictable power and thermal characteristics on surface-mount PCB assemblies.

If you would like pricing, lead-time or availability information, request a quote or submit an inquiry and our team will respond with detailed purchasing options.

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