LFECP15E-3FN256C

IC FPGA 195 I/O 256FBGA
Part Description

ECP Field Programmable Gate Array (FPGA) IC 195 358400 15400 256-BGA

Quantity 629 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package256-FPBGA (17x17)GradeCommercialOperating Temperature0°C – 85°C
Package / Case256-BGANumber of I/O195Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs1920Number of Logic Elements/Cells15400
Number of GatesN/AECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits358400

Overview of LFECP15E-3FN256C – ECP FPGA, 1.14–1.26 V, 256‑BGA

The LFECP15E-3FN256C is a field-programmable gate array (FPGA) IC from Lattice Semiconductor's ECP family. It provides a high-density programmable fabric with 15,400 logic elements and approximately 0.36 Mbits of on-chip embedded memory, aimed at mainstream commercial embedded and communications applications.

Designed for flexible I/O integration and DSP-capable system architectures, this device balances logic density, embedded RAM, and I/O count (195 pins) in a compact 256‑ball fpBGA (17 × 17 mm) package for surface-mount assembly.

Key Features

  • Programmable Logic — 15,400 logic elements delivering substantial combinational and sequential resources for medium-density designs.
  • Embedded Memory — 358,400 total RAM bits, approximately 0.36 Mbits of on-chip memory to support buffers, FIFOs, and small data stores without external SRAM.
  • I/O Capacity — 195 user I/Os enabling multiple parallel interfaces and flexible board-level connectivity.
  • Package and Mounting — 256‑BGA footprint; supplier device package specified as 256‑fpBGA (17 × 17 mm); surface-mount device for compact board layouts.
  • Supply Voltage — Operates from 1.14 V to 1.26 V, matching low-voltage core power domains common in modern FPGA ecosystems.
  • Commercial Temperature Range — Rated for 0 °C to 85 °C for deployment in standard commercial environments.
  • Family Capabilities (series-level) — LatticeECP family features include dedicated DSP blocks, sysI/O buffer programmability, DDR memory interface support, and multiple PLLs for clock management (family-level features as documented in the LatticeECP/EC datasheet).
  • RoHS Compliant — Conforms to RoHS requirements for lead-free manufacturing and regulatory compliance.

Typical Applications

  • Embedded Systems — Use as a central programmable controller or custom logic accelerator in commercial embedded products requiring medium logic density and on-chip memory.
  • Communications and Networking — Implement protocol bridging, packet processing, or interface aggregation leveraging the device's high I/O count and programmable fabric.
  • DSP and Signal Processing — Deploy DSP-oriented algorithms and multiply-accumulate functions using the ECP family’s DSP-capable architecture (series-level capability).
  • Prototyping and Development — Suitable for OEM development platforms where a compact 256‑fpBGA package and substantial logic resources are required for proof-of-concept and validation.

Unique Advantages

  • High-density logic in a compact package: 15,400 logic elements in a 256‑fpBGA (17 × 17 mm) package make it possible to fit significant programmable capability into space-constrained boards.
  • Generous on-chip memory: Approximately 0.36 Mbits of embedded RAM reduces dependency on external memory for control buffering and local data storage.
  • Wide I/O versatility: 195 I/O pins allow multiple peripherals and high-pin-count interfaces without complex external multiplexing.
  • Low-voltage core: 1.14–1.26 V supply range supports modern low-voltage system architectures and power domains.
  • Commercial deployment ready: Rated for 0 °C to 85 °C and RoHS compliant for mainstream commercial products.
  • Series-level design ecosystem: Supported by the LatticeECP family tool and IP ecosystem (as documented in the series datasheet), aiding design integration and time-to-market.

Why Choose LFECP15E-3FN256C?

The LFECP15E-3FN256C offers a balanced combination of programmable logic capacity, embedded memory, and I/O bandwidth in a compact surface-mount fpBGA package, making it suitable for commercial embedded and communications designs that require moderate to high logic density. Its supply voltage range, package density, and family-level DSP and memory interface capabilities make it a practical choice for designers seeking a flexible, configurable silicon foundation.

Backed by the LatticeECP series documentation and toolset, this device provides a clear migration path within the family and integration with series-level IP, helping engineering teams scale designs while leveraging established design flows.

If you would like pricing, availability, or to request a quote for the LFECP15E-3FN256C, submit a sales inquiry or request a formal quote through your preferred procurement channel.

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