LFECP15E-3FN256C
| Part Description |
ECP Field Programmable Gate Array (FPGA) IC 195 358400 15400 256-BGA |
|---|---|
| Quantity | 629 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 256-FPBGA (17x17) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 256-BGA | Number of I/O | 195 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 1920 | Number of Logic Elements/Cells | 15400 | ||
| Number of Gates | N/A | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 358400 |
Overview of LFECP15E-3FN256C – ECP FPGA, 1.14–1.26 V, 256‑BGA
The LFECP15E-3FN256C is a field-programmable gate array (FPGA) IC from Lattice Semiconductor's ECP family. It provides a high-density programmable fabric with 15,400 logic elements and approximately 0.36 Mbits of on-chip embedded memory, aimed at mainstream commercial embedded and communications applications.
Designed for flexible I/O integration and DSP-capable system architectures, this device balances logic density, embedded RAM, and I/O count (195 pins) in a compact 256‑ball fpBGA (17 × 17 mm) package for surface-mount assembly.
Key Features
- Programmable Logic — 15,400 logic elements delivering substantial combinational and sequential resources for medium-density designs.
- Embedded Memory — 358,400 total RAM bits, approximately 0.36 Mbits of on-chip memory to support buffers, FIFOs, and small data stores without external SRAM.
- I/O Capacity — 195 user I/Os enabling multiple parallel interfaces and flexible board-level connectivity.
- Package and Mounting — 256‑BGA footprint; supplier device package specified as 256‑fpBGA (17 × 17 mm); surface-mount device for compact board layouts.
- Supply Voltage — Operates from 1.14 V to 1.26 V, matching low-voltage core power domains common in modern FPGA ecosystems.
- Commercial Temperature Range — Rated for 0 °C to 85 °C for deployment in standard commercial environments.
- Family Capabilities (series-level) — LatticeECP family features include dedicated DSP blocks, sysI/O buffer programmability, DDR memory interface support, and multiple PLLs for clock management (family-level features as documented in the LatticeECP/EC datasheet).
- RoHS Compliant — Conforms to RoHS requirements for lead-free manufacturing and regulatory compliance.
Typical Applications
- Embedded Systems — Use as a central programmable controller or custom logic accelerator in commercial embedded products requiring medium logic density and on-chip memory.
- Communications and Networking — Implement protocol bridging, packet processing, or interface aggregation leveraging the device's high I/O count and programmable fabric.
- DSP and Signal Processing — Deploy DSP-oriented algorithms and multiply-accumulate functions using the ECP family’s DSP-capable architecture (series-level capability).
- Prototyping and Development — Suitable for OEM development platforms where a compact 256‑fpBGA package and substantial logic resources are required for proof-of-concept and validation.
Unique Advantages
- High-density logic in a compact package: 15,400 logic elements in a 256‑fpBGA (17 × 17 mm) package make it possible to fit significant programmable capability into space-constrained boards.
- Generous on-chip memory: Approximately 0.36 Mbits of embedded RAM reduces dependency on external memory for control buffering and local data storage.
- Wide I/O versatility: 195 I/O pins allow multiple peripherals and high-pin-count interfaces without complex external multiplexing.
- Low-voltage core: 1.14–1.26 V supply range supports modern low-voltage system architectures and power domains.
- Commercial deployment ready: Rated for 0 °C to 85 °C and RoHS compliant for mainstream commercial products.
- Series-level design ecosystem: Supported by the LatticeECP family tool and IP ecosystem (as documented in the series datasheet), aiding design integration and time-to-market.
Why Choose LFECP15E-3FN256C?
The LFECP15E-3FN256C offers a balanced combination of programmable logic capacity, embedded memory, and I/O bandwidth in a compact surface-mount fpBGA package, making it suitable for commercial embedded and communications designs that require moderate to high logic density. Its supply voltage range, package density, and family-level DSP and memory interface capabilities make it a practical choice for designers seeking a flexible, configurable silicon foundation.
Backed by the LatticeECP series documentation and toolset, this device provides a clear migration path within the family and integration with series-level IP, helping engineering teams scale designs while leveraging established design flows.
If you would like pricing, availability, or to request a quote for the LFECP15E-3FN256C, submit a sales inquiry or request a formal quote through your preferred procurement channel.

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