LFECP15E-3FN256I

The LFECP15E-3FN256I is an ECP Field Programmable Gate Array (FPGA) IC from Lattice Semiconductor Corporation designed for industrial embedded applications. It integrates 15,400 logic elements, approximately 0.36 Mbits of embedded memory, and 195 I/O pins in a compact 256-ball BGA package to support dense, I/O-rich designs.

With a low-voltage core (1.14 V to 1.26 V) and an industrial operating temperature range (−40 °C to 100 °C), this device is suited for applications that require reliable operation across extended temperature conditions and a high degree of on-chip integration.

Key Features

• Core Logic  15,400 logic elements provide programmable fabric capacity for custom logic, control and glue-logic implementation.
• Embedded Memory  Approximately 0.36 Mbits of on-chip RAM for buffering, small data stores and state machines.
• I/O Density  195 I/O pins enable connectivity to sensors, peripherals and external devices without external multiplexing.
• Power  Low-voltage core supply range of 1.14 V to 1.26 V suitable for power-conscious system architectures.
• Package and Mounting  256-BGA (256-FPBGA, 17 × 17) surface-mount package provides a compact footprint for board-level integration.
• Industrial Temperature Range  Rated for −40 °C to 100 °C operation to meet industrial environmental requirements.
• Compliance  RoHS-compliant construction supports regulatory and manufacturing requirements.

Typical Applications

• Industrial Control  Implement real-time control logic, sequencing and deterministic I/O for factory automation and process control systems.
• Embedded System Glue Logic  Consolidate interface bridging, protocol adaptation and custom peripherals in a single programmable device to reduce BOM and board area.
• Sensor Aggregation and Preprocessing  Aggregate signals from multiple sensors and perform on-chip preprocessing or steering using plentiful I/O and embedded memory.
• High-Density I/O Applications  Drive or monitor many external channels directly with 195 available I/Os, reducing the need for additional interface chips.

Unique Advantages

• Highly integrated logic and memory: 15,400 logic elements combined with approximately 0.36 Mbits of embedded RAM reduce external component count and simplify designs.
• Extensive I/O available: 195 I/Os enable direct connections to a wide array of peripherals and sensors without complex multiplexing.
• Compact BGA footprint: 256-ball FPBGA (17 × 17) allows high-density PCB implementations while keeping package size controlled.
• Industrial reliability: Specified for −40 °C to 100 °C operation, appropriate for deployment in industrial environments.
• Low-voltage operation: Core supply between 1.14 V and 1.26 V supports power-optimized system designs.
• RoHS compliant: Meets common manufacturing and environmental requirements for modern production flows.

Why Choose LFECP15E-3FN256I?

The LFECP15E-3FN256I positions itself as a compact, industrial-grade programmable logic solution that balances density, I/O capability and thermal tolerance. Its combination of 15,400 logic elements, substantial on-chip RAM and nearly 200 I/Os makes it a practical choice for embedded systems that require both logic integration and extensive external connectivity.

This device is well suited for engineers designing industrial control, sensor aggregation, and high-density interface applications who need a single-device solution to reduce board complexity, manage power, and meet extended temperature requirements. Backed by Lattice Semiconductor Corporation manufacturing, it offers a straightforward path for integrating programmable logic into production designs.

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