LFECP15E-3FN484C

The LFECP15E-3FN484C is a Lattice Semiconductor ECP family field programmable gate array (FPGA) provided in a 484-ball BBGA package. It combines a mid-range logic fabric with on-chip memory and DSP/clock resources suitable for mainstream embedded and signal-processing applications.

This commercial-grade, surface-mount device targets designs that require approximately 15,400 logic elements, extensive I/O, and embedded memory — offering a balance of integration and flexibility while operating from a 1.14 V to 1.26 V supply and within a 0 °C to 85 °C temperature range.

Key Features

• Programmable Logic Capacity  Approximately 15,400 logic elements (cells) for implementing control, glue logic, and moderate-density system functions.
• On-chip Memory  Total on-chip RAM of 358,400 bits (approximately 0.36 Mbits) supporting embedded block RAM and distributed memory structures for data buffering and state storage.
• High I/O Count  352 I/Os available to support wide parallel interfaces, bus connectivity, and multiple external peripherals.
• Dedicated DSP Resources  Family-level sysDSP resources include multiple DSP blocks; LFECP15 devices provide sysDSP blocks and 18×18 multipliers for multiply-accumulate and signal-processing tasks.
• Clocking  Up to four analog PLLs per device for clock multiplication, division and phase shifting to support complex timing domains.
• Memory Interface Support  Family supports dedicated DDR memory interfaces, enabling implementation of external SDRAM up to DDR400 (200 MHz) where required by the system.
• Package & Mounting  484-ball BBGA (484-FPBGA, 23×23 mm footprint) in a surface-mount package suitable for dense board layouts.
• Power and Temperature  Operates from a 1.14 V to 1.26 V supply window with a commercial operating temperature range of 0 °C to 85 °C.
• Standards & Tools  Family-level system features include IEEE 1149.1 boundary-scan, SPI boot flash interface, ispTRACY internal logic analyzer capability, and ispLEVER design tool support.
• Compliance  RoHS compliant.

Typical Applications

• Signal Processing / DSP Acceleration  Use the device’s sysDSP blocks and on-chip multipliers to implement filtering, transforms, and other DSP kernels in embedded systems.
• Memory-Intensive Embedded Systems  With dedicated DDR interface support and on-chip RAM, the FPGA can act as an interface and controller for external memory in network and storage equipment.
• High-Density I/O Control  352 I/Os provide flexibility for multi-channel sensor interfaces, parallel data buses, and board-level glue logic in communication and instrumentation equipment.
• Prototyping and System Integration  The combination of logic capacity, memory and clocking resources makes the device suitable for system-level prototyping and consolidation of discrete functions onto a single FPGA.

Unique Advantages

• Balanced Integration:  Combines mid-range logic density with embedded memory and DSP blocks to reduce external components and simplify system architecture.
• Flexible I/O and Interfaces:  High I/O count enables broad peripheral and bus connectivity without adding external multiplexers or expanders.
• Deterministic Clocking:  Multiple analog PLLs allow creation of multiple clock domains and precise phase/ frequency control for complex timing requirements.
• On-board Memory Resources:  Approximately 0.36 Mbits of on-chip RAM helps keep latency-sensitive buffering and state close to the logic fabric.
• Compact, Surface-Mount Package:  The 484-ball BBGA (23×23 mm) package supports high-density board designs while maintaining a surface-mount assembly flow.
• Design Ecosystem:  Family-level support for ispLEVER tools, ispTRACY internal logic analysis and SPI boot flash interface expedites development and in-system debugging.

Why Choose LFECP15E-3FN484C?

The LFECP15E-3FN484C positions itself as a mid-range, commercial-grade FPGA option that delivers a practical mix of logic resources, embedded memory, DSP capabilities and abundant I/O in a compact 484-BBGA package. Its voltage and temperature operating windows and RoHS compliance make it suitable for mainstream embedded and signal-processing designs that prioritize integration and board-level density.

Designers seeking a device with on-chip RAM, dedicated DSP multipliers, multiple PLLs and broad I/O options will find this part well matched to applications requiring consolidated logic, memory interfacing and deterministic clocking, supported by the LatticeECP family design tools and system features.

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