LFECP15E-4FN256C

IC FPGA 195 I/O 256FBGA
Part Description

ECP Field Programmable Gate Array (FPGA) IC 195 358400 15400 256-BGA

Quantity 973 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package256-FPBGA (17x17)GradeCommercialOperating Temperature0°C – 85°C
Package / Case256-BGANumber of I/O195Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs1920Number of Logic Elements/Cells15400
Number of GatesN/AECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits358400

Overview of LFECP15E-4FN256C – ECP Field Programmable Gate Array (FPGA) IC 195 358400 15400 256-BGA

The LFECP15E-4FN256C from Lattice Semiconductor Corporation is a commercial-grade field programmable gate array (FPGA) packaged in a 256-ball BGA. It provides a balanced combination of logic capacity, embedded memory, and I/O count for mid-density FPGA applications.

With 15,400 logic elements, 358,400 bits of on-chip RAM, and 195 I/O pins in a compact 256-FPBGA (17×17) surface-mount package, this device targets designers who need a configurable logic device with focused capacity, low-voltage operation, and RoHS compliance.

Key Features

  • Core Logic 15,400 logic elements and 1,920 CLBs provide the FPGA fabric for custom logic implementation and glue-logic integration.
  • Embedded Memory Total on-chip RAM of 358,400 bits (approximately 0.36 Mbits) to support data buffering, FIFOs, and small on-chip storage.
  • I/O Capability 195 I/O pins to accommodate a broad set of external interfaces and peripheral connections.
  • Power Operates from a supply range of 1.14 V to 1.26 V to match low-voltage system domains.
  • Package & Mounting 256-BGA package (supplier package: 256-FPBGA 17×17) in a surface-mount form factor for compact PCB integration.
  • Operating Conditions Commercial grade operation with an operating temperature range of 0 °C to 85 °C.
  • Regulatory RoHS compliant to support lead-free manufacturing processes.

Unique Advantages

  • High logic capacity: 15,400 logic elements enable substantial custom logic and moderate-complexity designs without moving to larger devices.
  • Substantial embedded memory: 358,400 bits of RAM support buffering, small data stores, and on-chip memory structures that reduce external memory requirements.
  • Wide I/O count: 195 I/Os provide flexibility for multiple interfaces and parallel connections on a single device.
  • Compact packaging: 256-FPBGA (17×17) surface-mount package minimizes board area while supporting high-density routing.
  • Low-voltage operation: 1.14–1.26 V supply range fits modern low-voltage system architectures and helps reduce overall power consumption.
  • Manufacturing readiness: Commercial grade temperature range and RoHS compliance support mainstream production environments.

Why Choose LFECP15E-4FN256C?

The LFECP15E-4FN256C is positioned for designers seeking a commercial-grade FPGA that balances logic density, embedded memory, and a high I/O count in a compact BGA package. Its combination of 15,400 logic elements, approximately 0.36 Mbits of on-chip RAM, and 195 I/Os makes it suitable for a range of mid-density programmable logic tasks where PCB real estate and low-voltage operation matter.

Choose this device when you need a RoHS-compliant, surface-mount FPGA solution that integrates meaningful logic and memory capacity while meeting standard commercial operating conditions, simplifying BOM choices and supporting straightforward board-level integration.

Request a quote or submit an inquiry to get pricing, availability, and lead-time information for the LFECP15E-4FN256C.

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