LFECP15E-4FN256C
| Part Description |
ECP Field Programmable Gate Array (FPGA) IC 195 358400 15400 256-BGA |
|---|---|
| Quantity | 973 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 256-FPBGA (17x17) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 256-BGA | Number of I/O | 195 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 1920 | Number of Logic Elements/Cells | 15400 | ||
| Number of Gates | N/A | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 358400 |
Overview of LFECP15E-4FN256C – ECP Field Programmable Gate Array (FPGA) IC 195 358400 15400 256-BGA
The LFECP15E-4FN256C from Lattice Semiconductor Corporation is a commercial-grade field programmable gate array (FPGA) packaged in a 256-ball BGA. It provides a balanced combination of logic capacity, embedded memory, and I/O count for mid-density FPGA applications.
With 15,400 logic elements, 358,400 bits of on-chip RAM, and 195 I/O pins in a compact 256-FPBGA (17×17) surface-mount package, this device targets designers who need a configurable logic device with focused capacity, low-voltage operation, and RoHS compliance.
Key Features
- Core Logic 15,400 logic elements and 1,920 CLBs provide the FPGA fabric for custom logic implementation and glue-logic integration.
- Embedded Memory Total on-chip RAM of 358,400 bits (approximately 0.36 Mbits) to support data buffering, FIFOs, and small on-chip storage.
- I/O Capability 195 I/O pins to accommodate a broad set of external interfaces and peripheral connections.
- Power Operates from a supply range of 1.14 V to 1.26 V to match low-voltage system domains.
- Package & Mounting 256-BGA package (supplier package: 256-FPBGA 17×17) in a surface-mount form factor for compact PCB integration.
- Operating Conditions Commercial grade operation with an operating temperature range of 0 °C to 85 °C.
- Regulatory RoHS compliant to support lead-free manufacturing processes.
Unique Advantages
- High logic capacity: 15,400 logic elements enable substantial custom logic and moderate-complexity designs without moving to larger devices.
- Substantial embedded memory: 358,400 bits of RAM support buffering, small data stores, and on-chip memory structures that reduce external memory requirements.
- Wide I/O count: 195 I/Os provide flexibility for multiple interfaces and parallel connections on a single device.
- Compact packaging: 256-FPBGA (17×17) surface-mount package minimizes board area while supporting high-density routing.
- Low-voltage operation: 1.14–1.26 V supply range fits modern low-voltage system architectures and helps reduce overall power consumption.
- Manufacturing readiness: Commercial grade temperature range and RoHS compliance support mainstream production environments.
Why Choose LFECP15E-4FN256C?
The LFECP15E-4FN256C is positioned for designers seeking a commercial-grade FPGA that balances logic density, embedded memory, and a high I/O count in a compact BGA package. Its combination of 15,400 logic elements, approximately 0.36 Mbits of on-chip RAM, and 195 I/Os makes it suitable for a range of mid-density programmable logic tasks where PCB real estate and low-voltage operation matter.
Choose this device when you need a RoHS-compliant, surface-mount FPGA solution that integrates meaningful logic and memory capacity while meeting standard commercial operating conditions, simplifying BOM choices and supporting straightforward board-level integration.
Request a quote or submit an inquiry to get pricing, availability, and lead-time information for the LFECP15E-4FN256C.

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