LFECP15E-4FN484C

IC FPGA 352 I/O 484FBGA
Part Description

ECP Field Programmable Gate Array (FPGA) IC 352 358400 15400 484-BBGA

Quantity 352 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package484-FPBGA (23x23)GradeCommercialOperating Temperature0°C – 85°C
Package / Case484-BBGANumber of I/O352Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs1920Number of Logic Elements/Cells15400
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits358400

Overview of LFECP15E-4FN484C – ECP Field Programmable Gate Array (FPGA) IC

The LFECP15E-4FN484C is a Lattice Semiconductor ECP-family FPGA in a 484-ball BGA package designed for mainstream embedded and system applications. It provides a mid-range logic capacity with programmable fabric, abundant I/O, and on-chip RAM suitable for control, data-path, and interface acceleration tasks.

With approximately 15,400 logic elements, roughly 358 Kbits of on-chip RAM and 352 I/O pins, this surface-mount device targets applications that require balanced logic density, memory, and flexible I/O in a commercial-temperature, RoHS-compliant package.

Key Features

  • Core Logic  Approximately 15,400 logic elements and a device fabric organized for mainstream FPGA functions.
  • Fabric Units  1,920 PFU/PFF fabric units (family selection), providing the structural resources behind the logic capacity.
  • Embedded Memory  358,400 total RAM bits (approximately 358 Kbits) of on-chip memory for data buffering, FIFOs, and small lookup tables.
  • I/O Density  352 user I/O pins to support wide parallel interfaces and multiple device interconnects in a single package.
  • Power Supply  Core voltage supported from 1.14 V to 1.26 V for standard LatticeECP operating conditions.
  • Package & Mounting  484-ball BBGA package; supplier device package 484-FPBGA (23 × 23 mm). Surface-mount for PCB assembly.
  • Operating Grade  Commercial temperature range of 0 °C to 85 °C.
  • RoHS Compliance  RoHS-compliant lead-free device suitable for standard commercial manufacturing processes.
  • Family-Level DSP & I/O Capabilities  LatticeECP family features include sysDSP support for high-performance multiply–accumulate operations, flexible programmable sysI/O buffers with broad interface support, dedicated DDR memory interface capability, and up to four analog PLLs for clock management.

Typical Applications

  • Communication Interfaces  Implement parallel and serial protocol bridging, custom PHY interfaces, and I/O aggregation using the device’s high I/O count and flexible I/O buffers.
  • Embedded Control  Use the FPGA fabric and on-chip RAM for motor control, system glue logic, and timing-critical control functions in commercial equipment.
  • Signal Processing Acceleration  Leverage family DSP resources for medium-complexity multiply–accumulate tasks and data-path acceleration where dedicated DSP blocks are beneficial.
  • Memory Interface and Buffering  Use on-chip RAM and the family’s dedicated DDR interface support for buffering and interfacing to external memory in cost-sensitive designs.

Unique Advantages

  • Balanced Logic and Memory:  Approximately 15,400 logic elements and ~358 Kbits of on-chip RAM provide a practical balance for mid-range designs without over-provisioning.
  • High I/O Count:  352 I/O pins reduce the need for external multiplexing and simplify board-level connectivity for complex interfaces.
  • Compact BGA Footprint:  484-ball FPBGA (23 × 23 mm) delivers high pin density in a compact surface-mount package for space-constrained PCBs.
  • Commercial-Grade Reliability:  Rated for 0 °C to 85 °C operation and RoHS-compliant construction for mainstream commercial deployments.
  • Family-Level Peripheral Support:  Access to LatticeECP family features such as sysDSP blocks, flexible I/O standards, PLL clocking, and DDR interface support helps accelerate system-level design.

Why Choose LFECP15E-4FN484C?

The LFECP15E-4FN484C offers a strong mid-range FPGA option for designs that require a combination of programmable logic, substantial I/O, and on-chip memory within a compact BGA package. Its commercial-grade temperature rating, defined core voltage range, and RoHS-compliant surface-mount package make it suitable for mainstream embedded and system applications where predictable electrical and thermal characteristics matter.

Designed as part of the LatticeECP family, this device benefits from an architecture that includes DSP-capable blocks, flexible I/O standards, and clock management resources—enabling scalable designs and reuse across product variants in the same family.

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