LFECP15E-4FN484I

IC FPGA 352 I/O 484FBGA
Part Description

ECP Field Programmable Gate Array (FPGA) IC 352 358400 15400 484-BBGA

Quantity 530 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package484-FPBGA (23x23)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case484-BBGANumber of I/O352Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs1920Number of Logic Elements/Cells15400
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits358400

Overview of LFECP15E-4FN484I – ECP Field Programmable Gate Array (FPGA) IC 352 358400 15400 484-BBGA

The LFECP15E-4FN484I is an industrial-grade FPGA from Lattice Semiconductor’s ECP family, combining a mid-range logic fabric with dedicated system features for mainstream and cost-sensitive embedded systems. It provides 15,400 logic elements and approximately 0.36 Mbits of on-chip RAM in a compact 484-ball BGA package.

With a wide I/O count, on-chip memory, programmable I/O buffer options and analog PLLs, this device is targeted at applications that need flexible interfacing, moderate DSP support and robust operation across –40°C to 100°C.

Key Features

  • Logic Capacity — 15,400 logic elements suitable for mid-density designs and complex glue logic integration.
  • On-chip Memory — 358,400 total RAM bits (approximately 0.36 Mbits) to support buffering, packet handling and local storage.
  • I/O Resources — 352 user I/Os with a programmable sysI/O buffer architecture (family-level) that supports a wide range of interface standards.
  • DSP and Multiply/Accumulate — ECP family sysDSP block support (family-level) for high-performance multiply-and-accumulate operations when DSP blocks are required.
  • Clocking — Four analog PLLs per device (family-level) for clock multiplication, division and phase shifting to support multi-clock domain designs.
  • Power — Low-voltage core operation with a specified supply range of 1.14 V to 1.26 V for efficient power delivery and compatibility with 1.2 V systems.
  • Package & Mounting — 484-ball BGA (484-FPBGA, 23 × 23 mm) surface-mount package optimized for high I/O density in space-constrained boards.
  • Industrial Temperature — Rated for operation from –40°C to 100°C to meet industrial environment requirements.
  • Standards & System Support — Family-level features include dedicated DDR memory interface support, SPI boot flash interface, IEEE 1149.1 boundary scan and internal logic analysis capabilities.
  • RoHS Compliant — Meets RoHS environmental requirements.

Typical Applications

  • Industrial Automation — Leverage the industrial temperature range and high I/O count for control logic, sensor interfacing and field I/O aggregation.
  • Communications & Networking — Use the device’s large I/O complement and on-chip memory for packet buffering, protocol bridging and interface adaptation.
  • Embedded DSP Acceleration — Apply on-chip DSP resources and embedded memory for signal processing tasks such as filtering, encoding or protocol offload (family-level DSP support).
  • System Prototyping & Glue Logic — Ideal for consolidating glue logic, custom peripherals and bus-bridging functions in compact BGA form factors.

Unique Advantages

  • Balanced Logic and Memory — 15,400 logic elements paired with ~0.36 Mbits of on-chip RAM provide a strong balance for mid-sized FPGA designs without external memory dependence.
  • High I/O Density — 352 I/Os in a 23 × 23 mm 484-ball BGA package enable dense board-level integration and multiple interface endpoints.
  • Industrial Robustness — Rated for –40°C to 100°C operation, supporting deployment in demanding industrial environments.
  • Flexible Clocking — Four analog PLLs (family-level) allow designers to generate and manage multiple clock domains internally.
  • Low-Voltage Core — Narrow supply range centered on 1.2 V simplifies power-rail design for systems using modern low-voltage cores.
  • System-Level Features — Built-in support for SPI boot, DDR interfaces and boundary-scan eases integration and system bring-up (family-level capabilities).

Why Choose LFECP15E-4FN484I?

The LFECP15E-4FN484I delivers a practical combination of logic capacity, embedded memory and high I/O count in a compact, industrial-grade BGA package. It is well suited to engineers designing mid-density FPGA applications that require flexible interfacing, on-chip buffering and reliable operation across a wide temperature range.

Choosing this device provides a scalable path within the ECP family for designs that need moderate DSP acceleration, robust clocking and system-level integration features, supported by a vendor ecosystem and design tools aligned to the ECP series.

If you’d like pricing, availability or a formal quote for the LFECP15E-4FN484I, request a quote or contact sales to submit your requirements and receive a prompt response.

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