LFECP20E-3F484C

IC FPGA 360 I/O 484FBGA
Part Description

ECP Field Programmable Gate Array (FPGA) IC 360 434176 19700 484-BBGA

Quantity 1,323 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package484-FPBGA (23x23)GradeCommercialOperating Temperature0°C – 85°C
Package / Case484-BBGANumber of I/O360Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs2464Number of Logic Elements/Cells19700
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits434176

Overview of LFECP20E-3F484C – ECP Field Programmable Gate Array (FPGA) IC 360 434176 19700 484-BBGA

The LFECP20E-3F484C is an ECP Field Programmable Gate Array (FPGA) from Lattice Semiconductor Corporation designed for commercial applications. It provides a mid-density programmable fabric with clearly defined logic, memory and I/O resources for embedded and interface-centric designs.

Key on-chip resources include approximately 19,700 logic elements, about 0.43 Mbits of embedded memory, and 360 I/O pins. The device is supplied in a 484-ball BBGA package and operates from 1.14 V to 1.26 V within a 0 °C to 85 °C commercial temperature range.

Key Features

  • Core Logic  Approximately 19,700 logic elements and 2,464 logic blocks provide a mid-range programmable fabric for combinational and sequential logic implementation.
  • Embedded Memory  Total on-chip RAM of 434,176 bits (approximately 0.43 Mbits) supports local buffering and state retention for data-path and control logic.
  • I/O Capability  360 programmable I/O pins enable high-pin-count interfacing for parallel buses, multi-channel sensors, and mixed-signal front ends.
  • Power  Nominal core supply range of 1.14 V to 1.26 V for stable operation within specified power rails.
  • Package & Mounting  Available in a 484-BBGA footprint (supplier package: 484-FPBGA, 23×23) intended for surface-mount PCB assembly.
  • Commercial Grade & Temperature  Rated for commercial use with an operating temperature range of 0 °C to 85 °C.
  • Environmental Compliance  RoHS compliant construction for environmental and regulatory alignment.

Typical Applications

  • Commercial Embedded Systems  Use the device to implement mid-density control and coordination logic where up to 19,700 logic elements and abundant I/O are required.
  • I/O-Intensive Interfaces  High I/O count supports parallel bus bridging, multi-channel data acquisition front ends, and interface aggregation tasks.
  • On-Board Data Buffering  Approximately 0.43 Mbits of embedded RAM is suitable for local buffering, packet staging, and small lookup tables in real-time control paths.

Unique Advantages

  • Balanced Logic Density: Approximately 19,700 logic elements provide a mid-range resource set for complex control and signal-processing tasks without the footprint of larger devices.
  • Generous I/O Count: 360 I/O pins simplify high-channel and parallel-interface designs, reducing the need for external expanders.
  • Integrated On-Chip Memory: About 0.43 Mbits of embedded RAM enables local data storage and state machines that keep latency low and PCB complexity down.
  • Compact BBGA Package: The 484-ball BGA (484-FPBGA, 23×23) delivers a compact solution for high-density boards while maintaining robust signal routing.
  • Commercial Temperature Rating: Designed for 0 °C to 85 °C operation to meet standard commercial application environments.
  • RoHS Compliant: Manufactured to meet RoHS requirements for environmentally conscious design and procurement.

Why Choose LFECP20E-3F484C?

The LFECP20E-3F484C positions itself as a commercially rated, mid-density FPGA that combines significant logic capacity, sizeable embedded memory, and a high I/O count in a compact 484-BBGA package. Its defined voltage supply range and commercial temperature rating make it suitable for a wide range of board-level designs where predictable, verifiable hardware resources are required.

This device is appropriate for designers and procurement teams seeking a programmable solution from Lattice Semiconductor Corporation that offers a balance of integration and I/O density while remaining aligned with RoHS environmental requirements.

Request a quote or submit an inquiry to obtain pricing and availability for the LFECP20E-3F484C. Provide your quantity and lead-time requirements to receive a tailored response.

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