LFECP20E-3F484C
| Part Description |
ECP Field Programmable Gate Array (FPGA) IC 360 434176 19700 484-BBGA |
|---|---|
| Quantity | 1,323 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 484-FPBGA (23x23) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 484-BBGA | Number of I/O | 360 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 2464 | Number of Logic Elements/Cells | 19700 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 434176 |
Overview of LFECP20E-3F484C – ECP Field Programmable Gate Array (FPGA) IC 360 434176 19700 484-BBGA
The LFECP20E-3F484C is an ECP Field Programmable Gate Array (FPGA) from Lattice Semiconductor Corporation designed for commercial applications. It provides a mid-density programmable fabric with clearly defined logic, memory and I/O resources for embedded and interface-centric designs.
Key on-chip resources include approximately 19,700 logic elements, about 0.43 Mbits of embedded memory, and 360 I/O pins. The device is supplied in a 484-ball BBGA package and operates from 1.14 V to 1.26 V within a 0 °C to 85 °C commercial temperature range.
Key Features
- Core Logic Approximately 19,700 logic elements and 2,464 logic blocks provide a mid-range programmable fabric for combinational and sequential logic implementation.
- Embedded Memory Total on-chip RAM of 434,176 bits (approximately 0.43 Mbits) supports local buffering and state retention for data-path and control logic.
- I/O Capability 360 programmable I/O pins enable high-pin-count interfacing for parallel buses, multi-channel sensors, and mixed-signal front ends.
- Power Nominal core supply range of 1.14 V to 1.26 V for stable operation within specified power rails.
- Package & Mounting Available in a 484-BBGA footprint (supplier package: 484-FPBGA, 23×23) intended for surface-mount PCB assembly.
- Commercial Grade & Temperature Rated for commercial use with an operating temperature range of 0 °C to 85 °C.
- Environmental Compliance RoHS compliant construction for environmental and regulatory alignment.
Typical Applications
- Commercial Embedded Systems Use the device to implement mid-density control and coordination logic where up to 19,700 logic elements and abundant I/O are required.
- I/O-Intensive Interfaces High I/O count supports parallel bus bridging, multi-channel data acquisition front ends, and interface aggregation tasks.
- On-Board Data Buffering Approximately 0.43 Mbits of embedded RAM is suitable for local buffering, packet staging, and small lookup tables in real-time control paths.
Unique Advantages
- Balanced Logic Density: Approximately 19,700 logic elements provide a mid-range resource set for complex control and signal-processing tasks without the footprint of larger devices.
- Generous I/O Count: 360 I/O pins simplify high-channel and parallel-interface designs, reducing the need for external expanders.
- Integrated On-Chip Memory: About 0.43 Mbits of embedded RAM enables local data storage and state machines that keep latency low and PCB complexity down.
- Compact BBGA Package: The 484-ball BGA (484-FPBGA, 23×23) delivers a compact solution for high-density boards while maintaining robust signal routing.
- Commercial Temperature Rating: Designed for 0 °C to 85 °C operation to meet standard commercial application environments.
- RoHS Compliant: Manufactured to meet RoHS requirements for environmentally conscious design and procurement.
Why Choose LFECP20E-3F484C?
The LFECP20E-3F484C positions itself as a commercially rated, mid-density FPGA that combines significant logic capacity, sizeable embedded memory, and a high I/O count in a compact 484-BBGA package. Its defined voltage supply range and commercial temperature rating make it suitable for a wide range of board-level designs where predictable, verifiable hardware resources are required.
This device is appropriate for designers and procurement teams seeking a programmable solution from Lattice Semiconductor Corporation that offers a balance of integration and I/O density while remaining aligned with RoHS environmental requirements.
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Date Founded: 1983
Headquarters: Hillsboro, Oregon, USA
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