LFECP20E-3FN484I
| Part Description |
ECP Field Programmable Gate Array (FPGA) IC 360 434176 19700 484-BBGA |
|---|---|
| Quantity | 66 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 484-FPBGA (23x23) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 484-BBGA | Number of I/O | 360 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 2464 | Number of Logic Elements/Cells | 19700 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 434176 |
Overview of LFECP20E-3FN484I – ECP Field Programmable Gate Array, 19,700 Logic Elements, 360 I/Os
The LFECP20E-3FN484I is a Lattice ECP family field programmable gate array (FPGA) supplied in a 484-ball BGA (23 × 23 mm) package and rated for industrial use. It combines a mid-range FPGA fabric with dedicated system features from the LatticeECP/EC family to address mainstream, cost-sensitive embedded and signal-processing applications.
Designed for integration into industrial and embedded systems, this device offers 19,700 logic elements, approximately 0.43 Mbits of embedded RAM, up to 360 user I/Os, and support for dedicated DSP blocks and PLLs to enable mixed logic, memory and high-speed interface designs.
Key Features
- Core Logic 19,700 logic elements provide a mid-range FPGA fabric suitable for complex control, glue-logic and moderate-density processing tasks.
- Embedded Memory Approximately 0.43 Mbits (434,176 bits) of on-chip RAM for embedded block and distributed memory needs.
- DSP Resources Device family includes dedicated sysDSP blocks (series-level feature) to accelerate multiply–accumulate and signal-processing functions.
- I/O Flexibility Up to 360 I/Os with programmable sysI/O buffer options across common standards (series-level support for LVCMOS, LVTTL, SSTL, HSTL, LVDS and others), enabling broad interface compatibility.
- Clocking and Timing Series supports up to four analog PLLs for clock multiply, divide and phase-shifting requirements.
- Memory Interface Support Series-level dedicated DDR memory interface logic supports standard DDR memory interfaces for system memory needs.
- Package & Mounting 484-BBGA (484-FPBGA, 23 × 23 mm) surface-mount package for high-pin-count connectivity in a compact footprint.
- Power Nominal core supply operating range of 1.14 V to 1.26 V.
- Operating Temperature Industrial operating range: -40 °C to 100 °C.
- Compliance RoHS compliant for environmental and manufacturing requirements.
- Design Ecosystem (Series-Level) Series-level support includes ispLEVER design tools and pre-designed ispLeverCORE IP blocks to streamline implementation and reduce development time.
Typical Applications
- Industrial Control Motor control, PLC front-ends and industrial I/O aggregation benefit from the device’s industrial temperature rating, rich I/O set and programmable logic capacity.
- Signal Processing Mid-range DSP tasks and algorithm acceleration leverage the family’s sysDSP blocks and embedded RAM for MAC operations and buffer storage.
- Memory Interface & Bridging Designs requiring DDR connectivity can use the series-level dedicated DDR interface support to implement memory bridges and controllers.
- Embedded Systems Control planes, peripherals aggregation and custom logic functions in cost-sensitive embedded products are supported by the device’s balance of logic, memory and I/O.
Unique Advantages
- Balanced mid-range resources: 19,700 logic elements and ~0.43 Mbits of embedded RAM offer a practical combination of logic and memory for mainstream designs.
- High I/O count in a compact package: 360 I/Os in a 484-ball FPBGA (23 × 23 mm) enables dense system integration while preserving board area.
- DSP and clocking support: Series-level sysDSP blocks and up to four PLLs provide hardware acceleration and flexible clocking for performance-sensitive functions.
- Industrial-grade reliability: Specified for -40 °C to 100 °C operation to meet industrial application temperature requirements.
- Design productivity: Series-supported design tools and IP reduce time-to-market by enabling reuse of pre-validated cores and established toolflows.
- Regulatory-friendly: RoHS compliance simplifies integration into global production environments.
Why Choose LFECP20E-3FN484I?
The LFECP20E-3FN484I targets engineers who need a balanced FPGA solution that combines a substantial logic element count with ample on-chip memory, DSP acceleration and a high I/O count in a compact, BGA package. Its industrial temperature rating and RoHS compliance make it suitable for long-lived embedded and industrial projects that require dependable operation across a wide temperature range.
Supported by the LatticeECP/EC family feature set and design ecosystem, this device is well suited for teams seeking a cost-effective, scalable platform for mid-range embedded, signal-processing and memory-interface applications.
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