LFECP20E-3FN484I

IC FPGA 360 I/O 484FBGA
Part Description

ECP Field Programmable Gate Array (FPGA) IC 360 434176 19700 484-BBGA

Quantity 66 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package484-FPBGA (23x23)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case484-BBGANumber of I/O360Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs2464Number of Logic Elements/Cells19700
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits434176

Overview of LFECP20E-3FN484I – ECP Field Programmable Gate Array, 19,700 Logic Elements, 360 I/Os

The LFECP20E-3FN484I is a Lattice ECP family field programmable gate array (FPGA) supplied in a 484-ball BGA (23 × 23 mm) package and rated for industrial use. It combines a mid-range FPGA fabric with dedicated system features from the LatticeECP/EC family to address mainstream, cost-sensitive embedded and signal-processing applications.

Designed for integration into industrial and embedded systems, this device offers 19,700 logic elements, approximately 0.43 Mbits of embedded RAM, up to 360 user I/Os, and support for dedicated DSP blocks and PLLs to enable mixed logic, memory and high-speed interface designs.

Key Features

  • Core Logic  19,700 logic elements provide a mid-range FPGA fabric suitable for complex control, glue-logic and moderate-density processing tasks.
  • Embedded Memory  Approximately 0.43 Mbits (434,176 bits) of on-chip RAM for embedded block and distributed memory needs.
  • DSP Resources  Device family includes dedicated sysDSP blocks (series-level feature) to accelerate multiply–accumulate and signal-processing functions.
  • I/O Flexibility  Up to 360 I/Os with programmable sysI/O buffer options across common standards (series-level support for LVCMOS, LVTTL, SSTL, HSTL, LVDS and others), enabling broad interface compatibility.
  • Clocking and Timing  Series supports up to four analog PLLs for clock multiply, divide and phase-shifting requirements.
  • Memory Interface Support  Series-level dedicated DDR memory interface logic supports standard DDR memory interfaces for system memory needs.
  • Package & Mounting  484-BBGA (484-FPBGA, 23 × 23 mm) surface-mount package for high-pin-count connectivity in a compact footprint.
  • Power  Nominal core supply operating range of 1.14 V to 1.26 V.
  • Operating Temperature  Industrial operating range: -40 °C to 100 °C.
  • Compliance  RoHS compliant for environmental and manufacturing requirements.
  • Design Ecosystem (Series-Level)  Series-level support includes ispLEVER design tools and pre-designed ispLeverCORE IP blocks to streamline implementation and reduce development time.

Typical Applications

  • Industrial Control  Motor control, PLC front-ends and industrial I/O aggregation benefit from the device’s industrial temperature rating, rich I/O set and programmable logic capacity.
  • Signal Processing  Mid-range DSP tasks and algorithm acceleration leverage the family’s sysDSP blocks and embedded RAM for MAC operations and buffer storage.
  • Memory Interface & Bridging  Designs requiring DDR connectivity can use the series-level dedicated DDR interface support to implement memory bridges and controllers.
  • Embedded Systems  Control planes, peripherals aggregation and custom logic functions in cost-sensitive embedded products are supported by the device’s balance of logic, memory and I/O.

Unique Advantages

  • Balanced mid-range resources: 19,700 logic elements and ~0.43 Mbits of embedded RAM offer a practical combination of logic and memory for mainstream designs.
  • High I/O count in a compact package: 360 I/Os in a 484-ball FPBGA (23 × 23 mm) enables dense system integration while preserving board area.
  • DSP and clocking support: Series-level sysDSP blocks and up to four PLLs provide hardware acceleration and flexible clocking for performance-sensitive functions.
  • Industrial-grade reliability: Specified for -40 °C to 100 °C operation to meet industrial application temperature requirements.
  • Design productivity: Series-supported design tools and IP reduce time-to-market by enabling reuse of pre-validated cores and established toolflows.
  • Regulatory-friendly: RoHS compliance simplifies integration into global production environments.

Why Choose LFECP20E-3FN484I?

The LFECP20E-3FN484I targets engineers who need a balanced FPGA solution that combines a substantial logic element count with ample on-chip memory, DSP acceleration and a high I/O count in a compact, BGA package. Its industrial temperature rating and RoHS compliance make it suitable for long-lived embedded and industrial projects that require dependable operation across a wide temperature range.

Supported by the LatticeECP/EC family feature set and design ecosystem, this device is well suited for teams seeking a cost-effective, scalable platform for mid-range embedded, signal-processing and memory-interface applications.

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