LFECP20E-4F484I

IC FPGA 360 I/O 484FBGA
Part Description

ECP Field Programmable Gate Array (FPGA) IC 360 434176 19700 484-BBGA

Quantity 276 Available (as of May 4, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package484-FPBGA (23x23)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case484-BBGANumber of I/O360Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs2464Number of Logic Elements/Cells19700
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits434176

Overview of LFECP20E-4F484I – ECP FPGA, 19,700 Logic Elements, 360 I/Os, 484‑BBGA

The LFECP20E-4F484I is an ECP Field Programmable Gate Array (FPGA) IC from Lattice Semiconductor Corporation designed for industrial applications. It provides a programmable logic fabric with 19,700 logic elements, 360 I/Os and embedded RAM, packaged in a 484‑BBGA (484‑FPBGA, 23×23) surface‑mount package.

With a supply voltage range of 1.14 V to 1.26 V and an operating temperature range of −40 °C to 100 °C, this device targets industrial systems that require moderate-density programmable logic, flexible I/O capacity and extended temperature operation.

Key Features

  • Programmable Logic  19,700 logic elements provide the core programmable resources for implementing custom digital logic and control functions.
  • Embedded Memory  434,176 total RAM bits (approximately 0.434 Mbits) of on‑chip memory to support buffering, FIFOs and small data structures.
  • I/O Capacity  360 general‑purpose I/O pins to support multiple interfaces and peripheral connectivity within a single device.
  • Power Supply  Operates from a low‑voltage supply range of 1.14 V to 1.26 V to match modern system power rails.
  • Package and Mounting  484‑BBGA (484‑FPBGA, 23×23) surface‑mount package for high pin‑count routing density in compact PCB layouts.
  • Industrial Temperature Grade  Rated for operation from −40 °C to 100 °C to meet thermal requirements of industrial environments.
  • Environmental Compliance  RoHS‑compliant to support regulatory requirements for lead‑free assembly.

Typical Applications

  • Industrial Control  Implement custom control logic, motor control interfaces or protocol bridging that benefit from on‑chip logic and I/O density under industrial temperature conditions.
  • Embedded Systems  Consolidate glue logic, peripheral interfacing and small data buffering using the device’s logic elements and embedded RAM.
  • Communications & Networking  Support multiple I/O lanes and protocol handling where 360 I/Os and on‑chip memory can be used for packet buffering and interface logic.
  • Sensor and Data Acquisition  Aggregate sensor inputs and perform deterministic preprocessing leveraging the device’s I/O count and programmable resources.

Unique Advantages

  • Balanced Logic and Memory:  19,700 logic elements paired with approximately 0.434 Mbits of RAM allow implementation of mid‑density designs with local buffering and state machines.
  • High I/O Count:  360 I/Os enable integration of multiple peripherals and interfaces without additional I/O expanders, simplifying board-level design.
  • Industrial Temperature Range:  −40 °C to 100 °C rating supports deployment in environments with wide temperature swings common to industrial applications.
  • Compact, High‑Pin Package:  484‑BBGA (23×23) provides a high pin count in a compact footprint for dense PCB routing and signal distribution.
  • Low‑Voltage Operation:  1.14 V to 1.26 V supply compatibility aligns with modern low‑voltage system power architectures.
  • RoHS Compliant:  Meets lead‑free manufacturing requirements for environmentally compliant assemblies.

Why Choose LFECP20E-4F484I?

The LFECP20E-4F484I is positioned for designers who need a mid‑density FPGA with significant I/O capacity and industrial temperature capability. Its combination of 19,700 logic elements, 360 I/Os and roughly 0.434 Mbits of embedded RAM provides the integration needed to reduce external components and simplify system architecture.

Ideal for industrial control, embedded systems and communications applications, this RoHS‑compliant, surface‑mount 484‑BBGA device offers a compact, low‑voltage solution from Lattice Semiconductor for projects requiring reliable operation across a wide temperature range.

Request a quote or submit an inquiry to receive pricing, availability and ordering information for the LFECP20E-4F484I.

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