LFECP20E-4FN672C

The LFECP20E-4FN672C is a Lattice Semiconductor ECP-series FPGA in a 672‑ball BGA (27 × 27 mm) surface-mount package. It delivers approximately 19,700 logic elements and roughly 434,176 bits of on-chip RAM, targeting mainstream FPGA applications that need dense logic, abundant I/O and flexible memory support.

Designed for commercial-grade systems (0 °C to 85 °C) and RoHS compliant, the device combines configurable logic, embedded memory and family-level features such as dedicated DSP blocks, flexible I/O buffering and multiple PLLs to enable system integration for mid-range embedded and interface-focused designs.

Key Features

• Logic Capacity — Approximately 19,700 logic elements to implement medium-complexity digital designs.
• On‑chip Memory — Approximately 0.434 Mbits (434,176 bits) of total RAM for buffering, FIFOs and local storage.
• I/O Density — 400 user I/Os in a 672‑ball FBGA package (672‑FPBGA, 27 × 27 mm) for high pin-count system interfaces.
• Power Supply — Core voltage range 1.14 V to 1.26 V matching the family’s 1.2 V VCC domain.
• Commercial Temperature Grade — Specified for 0 °C to 85 °C operation.
• Package & Mounting — 672‑BBGA (surface mount), suitable for compact, high-density board layouts.
• Family‑level DSP Support — LatticeECP family includes dedicated sysDSP blocks for high-performance multiply-accumulate operations (series-level capability).
• Flexible I/O Standards — Family supports a wide set of interfaces including LVCMOS (3.3/2.5/1.8/1.5/1.2), LVTTL, SSTL, HSTL, PCI, LVDS, Bus‑LVDS, LVPECL and RSDS (series-level capability).
• DDR Memory Interface — Series includes dedicated DDR memory support up to DDR400 (200 MHz) for system memory interfacing (series-level capability).
• Clocking — Series provides up to four analog PLLs per device for clock multiply/divide and phase control (series-level capability).
• Compliance — RoHS compliant.

Typical Applications

• Embedded DSP and Signal Processing — Use the family’s dedicated DSP resources and on‑chip RAM for multiply-accumulate and real-time data processing tasks.
• Memory Interface and Buffering — Implement DDR interface logic and buffering using the device’s embedded memory and series DDR support.
• High‑I/O System Integration — 400 I/Os in a 672‑BBGA package enable complex board-level connectivity such as multi-channel interfaces and protocol bridging.
• Prototyping and Mid‑Range FPGA Designs — Sized for medium-complexity designs that require a balance of logic, memory and flexible I/O standards.

Unique Advantages

• High Logic Density — Nearly 19,700 logic elements provide ample resources for feature-rich designs while keeping board count and routing manageable.
• Integrated Memory Resources — Approximately 434,176 bits of on-chip RAM reduce external memory dependence for many control and buffering functions.
• Extensive I/O Capability — 400 I/Os and support for a wide range of signaling standards simplify interfacing to sensors, memory, transceivers and legacy buses.
• Family DSP and Clocking — Access to dedicated DSP blocks and multiple PLLs at the family level helps accelerate compute-heavy kernels and flexible clocking schemes.
• Compact High‑Pin Package — 672‑ball FPBGA delivers high I/O count in a compact footprint for space-constrained designs.
• RoHS Compliant Commercial Grade — Meets environmental requirements for commercial applications and standard temperature operation from 0 °C to 85 °C.

Why Choose LFECP20E-4FN672C?

The LFECP20E-4FN672C positions itself as a mid-density, family-featured FPGA ideal for designs that require a balance of logic resources, embedded memory and high I/O capacity. Its combination of approximately 19,700 logic elements, roughly 434,176 bits of on‑chip RAM and 400 I/Os in a 672‑ball BGA package supports integration of DSP tasks, memory interfaces and multi-protocol I/O within a single device.

Targeted at commercial-grade embedded systems and interface-centric designs, this device is suitable for engineers seeking a scalable FPGA platform with family-level DSP, flexible I/O standard support and multi-PLL clock management to simplify system partitioning and accelerate time-to-prototype.

Request a quote or submit an RFQ to obtain pricing, availability and lead-time information for LFECP20E-4FN672C.