LFECP20E-5FN672C

The LFECP20E-5FN672C is an ECP-series field programmable gate array provided in a 672-ball BGA (27 × 27 mm) package with 400 user I/Os. It combines a mid-range logic fabric with dedicated DSP resources and on-chip memory to address mainstream FPGA applications that require a balance of logic density, embedded memory and I/O resources.

Designed for commercial-temperature systems, this surface-mount device operates from 1.14 V to 1.26 V and is RoHS compliant, making it suitable for a broad range of cost-sensitive embedded designs.

Key Features

• Logic Capacity — 19,700 logic elements providing the equivalent of approximately 19.7K LUT4s for implementing complex glue logic, control and datapath functions.
• Embedded Memory — Total on-chip RAM of 434,176 bits (approximately 0.43 Mbits) for distributed and block memory requirements.
• DSP Resources — Family-level sysDSP capability mapped for this device: 6 sysDSP blocks supporting multiple multiply/accumulate configurations and 24 18×18 multipliers (per family selection guide).
• I/O and Interfaces — 400 user I/Os and a programmable I/O buffer architecture (family-level) supporting a wide range of signaling standards for flexible system interfacing.
• Clocking — Up to four analog PLLs (per device family) for clock multiplication, division and phase shifting.
• Power and Supply — Low-voltage core operation with a specified supply range of 1.14 V to 1.26 V.
• Package & Mounting — 672-ball BGA (27 × 27 mm) supplier device package 672-FPBGA, surface-mount.
• Operating Range & Compliance — Commercial grade operation from 0 °C to 85 °C; RoHS compliant.
• Dedicated DDR Support — Family-level dedicated DDR memory interface logic implementing interfaces up to DDR400 (200 MHz).

Typical Applications

• Embedded DSP and Signal Processing: Use the on-chip sysDSP blocks and 18×18 multipliers for fixed- and floating-point datapaths, filters and accelerator functions.
• Memory-Intensive Designs: Embedded block and distributed RAM (approximately 0.43 Mbits total) support buffering, FIFOs and small on-chip storage for real-time systems.
• High-Density I/O Systems: With 400 I/Os in a 672-BBGA package, the device is suited for applications requiring many parallel interfaces or multi-channel signaling.
• DDR Interface Designs: Use the dedicated DDR memory support for systems that require external SDRAM connectivity up to DDR400.

Unique Advantages

• Balanced Logic and Memory: 19,700 logic elements paired with ~0.43 Mbits of on-chip RAM simplifies designs that need both LUT resources and embedded storage.
• Integrated DSP Acceleration: Family-level sysDSP blocks and multiple 18×18 multipliers reduce the need for discrete DSP components in signal-processing paths.
• Flexible I/O Count: 400 user I/Os in a compact 672-BBGA package enables dense connectivity without a larger board footprint.
• Low-Voltage Operation: 1.14 V to 1.26 V core supply supports modern low-voltage system architectures.
• Clocking Versatility: Multiple PLLs (as provided by the family) allow fine-grained clock management for multi-domain systems.
• Commercial-Grade Reliability: Rated for 0 °C to 85 °C operation and RoHS compliant for broad deployment in commercial electronics.

Why Choose LFECP20E-5FN672C?

This Lattice ECP-series FPGA option offers a well-rounded combination of mid-range logic density, on-chip memory and dedicated DSP resources in a 672-BBGA package with 400 I/Os. It is positioned for designers who need a compact, low-voltage FPGA platform capable of handling mixed control, memory buffering and DSP workloads within commercial-temperature environments.

Choose this device when you require integrated DSP blocks, flexible I/O capacity, and dedicated DDR interface support alongside a practical balance of resources for cost-sensitive, mainstream embedded designs. The device’s family-level tool and IP support can help streamline development and scale across similar density devices.

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