LFECP33E-3FN484C

The LFECP33E-3FN484C is a Lattice Semiconductor ECP-series Field Programmable Gate Array (FPGA) optimized for mainstream embedded and system designs. The device combines a high logic density fabric with on-chip memory and flexible I/O to address cost-sensitive, high‑integration applications.

Key on‑chip resources include 32,800 logic elements, approximately 0.43 Mbits of total RAM, and 360 I/O pins in a 484‑ball BGA package, making it suited to applications that require high I/O density, embedded memory, and low-voltage operation.

Key Features

• Core Logic  32,800 logic elements provide a high-density FPGA fabric for implementing complex logic and system functions.
• Embedded Memory  Total on‑chip RAM of 434,176 bits (approximately 0.43 Mbits) for block and distributed storage.
• I/O Capacity  360 user I/O pins (484-BBGA package) support high-pin-count interfaces and system connectivity.
• Family DSP & Clock Support  LatticeECP family features include dedicated DSP resources and up to four analog PLLs per device (family-level capabilities described in the datasheet).
• Flexible I/O Standards (family)  The LatticeECP family supports a wide range of I/O standards suitable for LVTTL/LVCMOS and higher‑speed interfaces (family-level capabilities described in the datasheet).
• Power and Supply  Core supply range 1.14 V to 1.26 V for low-voltage system designs.
• Package & Mounting  484‑ball FPBGA (23 × 23 mm) footprint; surface-mount package for standard PCB assembly processes.
• Commercial Temperature Grade  Specified operating range 0 °C to 85 °C for commercial applications.
• Environmental Compliance  RoHS compliant.

Typical Applications

• Embedded Systems  Implement control logic, protocol bridging, and custom peripherals where on‑chip memory and logic density are needed.
• Communications & Networking  High I/O count and programmable fabric enable adaptable interface handling and packet processing in mid‑range networking equipment.
• Signal Processing / DSP  Family DSP resources and embedded memory are suited to offloading multiply‑accumulate and data buffering tasks in signal chains.
• Memory Interface & Bridging  Designed to support dedicated DDR memory interfaces at the family level, enabling memory controller implementation and data buffering.

Unique Advantages

• High logic density: 32,800 logic elements allow consolidation of multiple functions into a single device, reducing board-level BOM.
• Substantial on‑chip memory: Approximately 0.43 Mbits of RAM supports embedded buffering and state storage without external memory for many designs.
• Extensive I/O resources: 360 I/Os in a 484‑ball BGA package simplify routing of parallel interfaces and multiple peripherals.
• Low‑voltage operation: Narrow core supply window (1.14 V–1.26 V) supports modern low‑power system architectures.
• Commercial temperature rating: 0 °C to 85 °C specification aligns with a wide range of consumer and industrial-adjacent applications.
• RoHS compliant: Meets common environmental requirements for assembly and distribution.

Why Choose LFECP33E-3FN484C?

The LFECP33E-3FN484C positions itself as a versatile, high‑density FPGA option within the Lattice ECP family, combining significant logic resources, on‑chip RAM, and a large complement of I/Os in a compact 484‑ball BGA package. Its low‑voltage core and family features such as PLLs and DSP capabilities enable integration of timing-critical and signal processing functions into a single programmable device.

This device is well suited for engineers and procurement teams building cost‑sensitive, mainstream embedded systems, communications equipment, and DSP‑enabled products that benefit from a balanced mix of logic, memory, and interface density backed by Lattice family-level ecosystem support.

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