LFECP33E-3FN484I

The LFECP33E-3FN484I is a LatticeECP-family FPGA in a 484-ball BGA package, designed for industrial applications requiring a balance of logic capacity, embedded memory and flexible I/O. The device combines a LUT-based FPGA fabric with on-chip RAM and system-level features suitable for mainstream embedded, industrial control and DSP-accelerated designs.

Key design attributes include approximately 32,800 logic elements, roughly 0.43 Mbits of embedded memory, and 360 user I/O pins in a compact 23 × 23 mm fpBGA footprint, all rated for industrial temperature operation.

Key Features

• Core Logic Approximately 32,800 logic elements for implementing complex combinational and sequential logic functions; 4,096 logic blocks to structure your design.
• Embedded Memory Approximately 0.43 Mbits of on-chip RAM (434,176 total RAM bits) and support for distributed and block memory structures.
• DSP Capability Family-level sysDSP block support for high-performance multiply-and-accumulate operations, enabling efficient signal processing and algorithm acceleration.
• Flexible I/O 360 I/O pins in a 484-ball BGA package, with the family’s flexible I/O buffer architecture to support a wide range of interface standards (family-level feature).
• DDR Memory Interface Dedicated DDR memory support (family-level) enabling implementation of external memory interfaces up to DDR400 (200 MHz).
• Clocking Family supports up to four analog PLLs for clock multiply/divide and phase shifting to manage multi-clock systems.
• Package & Mounting 484-BBGA / 484-FPBGA (23 × 23 mm) surface-mount package suitable for compact board layouts.
• Power & Temperature Core supply range 1.14 V to 1.26 V; industrial operating temperature range from −40 °C to 100 °C.
• Standards & Tools Device is RoHS compliant; family-level toolchain and IP ecosystem available for design implementation and integration.

Typical Applications

• Industrial Control Use for motor control, automation logic and real-time I/O aggregation benefiting from industrial temperature rating and abundant I/O.
• Signal Processing and Embedded DSP Leverage sysDSP blocks and on-chip RAM to accelerate filtering, FFTs and other DSP workloads.
• Memory-Intensive Interfaces Implement external DDR interfaces with the device’s dedicated DDR support to handle buffering and high-throughput data flows.
• Custom Peripheral and Protocol Bridging Create custom interfaces and protocol converters using the flexible I/O resources and ample logic capacity.

Unique Advantages

• Balanced Integration: Combines tens of thousands of logic elements with hundreds of kilobits of embedded memory to reduce external component count.
• Flexible I/O in a Compact Package: 360 I/Os in a 484-ball BGA (23 × 23 mm) enables high-density interfaces while keeping PCB area low.
• DSP-Ready Fabric: Family sysDSP support accelerates compute-bound tasks without needing separate DSP processors.
• Industrial Reliability: Rated for −40 °C to 100 °C operation and RoHS compliant for deployment in industrial environments.
• System Clocking: Multiple PLLs (family-level) provide the clocking flexibility required for multi-domain systems.

Why Choose LFECP33E-3FN484I?

The LFECP33E-3FN484I positions itself as a versatile, industrial-grade FPGA option within the LatticeECP family, offering substantial logic capacity, flexible I/O and on-chip memory in a compact 484-ball BGA package. Its combination of DSP capability, embedded RAM and dedicated DDR support makes it suitable for engineers building industrial automation, signal processing and memory-access-heavy applications.

Designed to fit mainstream embedded and industrial designs, this device offers a practical balance of performance, integration and thermal tolerance, supported by the LatticeECP family toolchain and IP resources for streamlined development and migration within the family.

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