LFECP33E-4F484I

The LFECP33E-4F484I is an ECP Field Programmable Gate Array (FPGA) supplied in a 484-BBGA package. It provides 32,800 logic elements, approximately 0.43 Mbits of embedded memory, and 360 general-purpose I/O pins, delivering a balanced mix of logic capacity, on-chip RAM and I/O for industrial designs.

Designed for industrial-grade operation, the device supports a 1.14 V to 1.26 V core supply and an operating temperature range of -40 °C to 100 °C, making it suitable for applications that require broad environmental tolerance and a high pin count in a compact surface-mount package.

Key Features

• Core Logic  32,800 logic elements provide programmable logic resources for custom digital designs and control functions.
• Embedded Memory  Approximately 0.43 Mbits of on-chip RAM to store buffers, state machines, and lookup tables without external memory.
• I/O Capacity  360 I/O pins enable extensive peripheral and bus connectivity directly from the FPGA package.
• Package and Mounting  484-BBGA package (supplier device package: 484-FPBGA, 23×23) in a surface-mount form factor for compact PCB integration.
• Power  Core voltage range of 1.14 V to 1.26 V to match system power budgets and regulator selections.
• Industrial Temperature Range  Rated for operation from -40 °C to 100 °C for deployment in temperature-challenging environments.
• Regulatory  RoHS compliant.

Typical Applications

• Industrial Control Systems  Leverages the industrial temperature rating and 360 I/Os for sensor interfacing, motor control logic and distributed control functions.
• Embedded Processing and Glue Logic  32,800 logic elements and on-chip RAM support custom protocol handling, data path stitching and real-time decision logic.
• I/O-Intensive Assemblies  High pin count in a 484-BBGA package makes it suitable for designs requiring many external connections in a compact footprint.
• Edge and Appliance Electronics  The combination of moderate embedded memory and broad I/O enables local processing, aggregation and interface bridging at the edge.

Unique Advantages

• Balanced logic and memory: 32,800 logic elements alongside approximately 0.43 Mbits of embedded RAM supports a wide range of control and data-path tasks without immediate external memory.
• High I/O density: 360 I/O pins simplify system integration by reducing the need for external multiplexers or I/O expanders.
• Industrial-ready thermal range: Operation from -40 °C to 100 °C supports deployment in harsh or temperature-variable environments.
• Compact surface-mount package: 484-BBGA (484-FPBGA, 23×23) provides a high-pin-count solution in a space-efficient package for modern PCB layouts.
• Low-voltage core compatibility: 1.14 V to 1.26 V supply range aligns with modern power-rail designs and regulator choices.
• RoHS compliance: Meets environmental legislation requirements for lead-free assembly.

Why Choose LFECP33E-4F484I?

The LFECP33E-4F484I positions itself as a flexible, industrial-grade FPGA option for designs that require a combination of substantial logic resources, moderate on-chip memory and a large number of I/Os in a compact surface-mount package. Its specified voltage range and extended operating temperature make it appropriate for engineered systems operating in varied environmental conditions.

This device is well suited for engineers building industrial control systems, I/O-dense appliances, and embedded processing modules that benefit from integrated logic and memory, high pin-count connectivity, and RoHS compliance. Its package and electrical specifications support efficient board-level integration and predictable procurement planning.

Request a quote or submit an inquiry for pricing and availability to begin your evaluation and procurement process.