LFECP33E-4FN672I

The LFECP33E-4FN672I is an industrial-grade FPGA from the LatticeECP family designed for mainstream embedded and system-level applications. It combines a high logic capacity fabric with dedicated DSP resources and flexible I/O to address designs that require moderate to high gate counts, on-chip memory, and broad interface support.

Key architectural attributes for this device include 32,800 logic elements, 434,176 bits of on-chip RAM, up to 496 I/O pins, and a 672-ball FPBGA package (27 × 27 mm). The device operates from a 1.14 V to 1.26 V supply and supports an operating temperature range from −40 °C to 100 °C.

Key Features

• Logic Capacity — 32,800 logic elements provide the switching and combinational resources needed for complex glue logic, protocol bridges, and mid-size processing blocks.
• On-chip Memory — 434,176 total RAM bits of embedded memory for buffering, FIFOs, and local data storage.
• High I/O Count — Up to 496 I/O pins available for broad interface flexibility and multi-channel connectivity.
• DSP Capability — Family-level DSP resources (LatticeECP series) provide high-performance multiply–accumulate blocks for signal processing; this device aligns with that architecture.
• Clocking — Multi-PLL architecture at the family level supports clock multiply, divide and phase shifting for system clocking needs.
• Package & Mounting — 672-ball FPBGA (27 × 27 mm) / 672-BBGA package, surface-mount construction suitable for compact board layouts.
• Supply & Temperature — Core supply: 1.14 V to 1.26 V; industrial operating range: −40 °C to 100 °C.
• Regulatory & Environmental — RoHS compliant.

Typical Applications

• Industrial Control — Implement motor control logic, deterministic I/O aggregation, and fieldbus interfaces while meeting industrial temperature requirements.
• Signal Processing — Leverage on-chip RAM and the LatticeECP DSP architecture for filtering, transforms, and real-time data handling.
• Memory Interface & Buffering — Use embedded memory and programmable I/O to implement DDR interfaces and high-throughput buffering schemes.
• Multi-Interface Gateways — Consolidate multiple serial and parallel interfaces across the device’s high I/O count for protocol bridging and aggregation.

Unique Advantages

• High Logic Density: 32,800 logic elements enable substantial integration of logic blocks, reducing external glue logic and BOM complexity.
• Significant On-Chip RAM: 434,176 bits of embedded RAM support local buffering and reduce reliance on external memory for many applications.
• Large I/O Footprint: 496 I/Os provide flexibility to connect sensors, memory, and multiple peripherals without extensive board-level multiplexing.
• Industrial Temperature Rating: −40 °C to 100 °C operation supports deployment in demanding environments where thermal range matters.
• Compact, High-Ball-Count Package: 672-ball FPBGA (27 × 27 mm) offers high pin density in a compact footprint suitable for space-constrained boards.
• Design Ecosystem Support: The LatticeECP family is supported by vendor tools and IP (ispLEVER and ispLeverCORE modules at the family level) to accelerate development and migration.

Why Choose LFECP33E-4FN672I?

The LFECP33E-4FN672I positions itself as a capable, industrial-grade FPGA option for designs that require a balanced combination of logic density, on-chip RAM, DSP capability, and a large I/O count. Its core voltage range, extended operating temperature, and RoHS compliance make it suitable for long-lived embedded and industrial systems.

Designers benefit from the LatticeECP family’s ecosystem advantages—density migration options, on-chip DSP and memory architectures, and established design tools and IP—making this device a practical choice for teams seeking scalable, supported FPGA solutions.

Request a quote or submit your requirements to get pricing and availability for the LFECP33E-4FN672I. Our team can provide component lead times and assist with technical selection for your next design.