LFECP33E-4FN484C

The LFECP33E-4FN484C is a commercial‑grade Field Programmable Gate Array (FPGA) in a 484‑ball BGA package from Lattice Semiconductor. It is built on the LatticeECP family architecture and combines a high logic capacity with extensive I/O and on‑chip memory for mainstream embedded and system applications.

With 32,800 logic elements, 360 I/O pins and approximately 0.43 Mbits of on‑chip RAM, this device targets applications that require a balance of logic density, memory resources and flexible I/O in a compact surface‑mount package.

Key Features

• Programmable Logic Capacity — 32,800 logic elements provide substantial implementation resources for state machines, datapath logic and glue logic in medium‑to‑large designs.
• On‑Chip Memory — Total RAM of 434,176 bits (approximately 0.43 Mbits) for embedded and distributed storage of data and buffering.
• High I/O Count — 360 general‑purpose I/O pins support complex interfacing and multiple parallel buses.
• Family DSP and Multiplier Support — As part of the LatticeECP family, the architecture includes dedicated sysDSP blocks and multiple multiplier configurations for multiply‑accumulate functions and signal processing (family‑level capability).
• Flexible I/O Standards (family capability) — LatticeECP devices support a wide range of interfaces including LVCMOS, LVTTL, SSTL, HSTL, PCI, LVDS, Bus‑LVDS, LVPECL and RSDS, enabling integration with many signaling standards.
• Dedicated DDR Memory Support (family capability) — Family architecture includes dedicated DDR interface logic (supports up to DDR400/200 MHz signaling at the family level).
• Power — Core voltage range 1.14 V to 1.26 V (typical family VCC 1.2 V), enabling compatibility with standard low‑voltage power domains.
• Package & Mounting — Surface‑mount 484‑BBGA (supplier package 484‑FPBGA, 23 × 23 mm) for compact board integration.
• Commercial Temperature Grade — Operating temperature range 0 °C to 85 °C, suitable for commercial electronics applications.
• RoHS Compliant — Device meets RoHS environmental requirements.

Typical Applications

• Communications Interfaces — Implement protocol bridging, parallel/serial PHY glue logic and custom I/O handling using the device’s high I/O count and flexible I/O standards.
• Embedded System Controllers — Offload control tasks, implement custom peripherals and handle multiple I/O domains with the available logic elements and on‑chip RAM.
• Signal Processing & Acceleration — Use family DSP/multiplier resources for fixed‑function acceleration within moderate DSP workloads (family‑level DSP blocks available).
• Memory Interface Control — Drive DDR memory interfaces using the family’s dedicated DDR memory support for buffering and system memory control.

Unique Advantages

• High Logic Density: 32,800 logic elements enable complex designs and integration of multiple functions into a single device, reducing board BOM.
• Extensive I/O Capability: 360 I/Os provide flexibility for parallel buses, high pin‑count peripherals and multi‑channel interfaces without external multiplexing.
• On‑Chip Memory for Local Storage: Approximately 0.43 Mbits of embedded RAM supports FIFOs, buffering and small data tables directly on the FPGA fabric.
• Compact, Surface‑Mount Package: The 484‑BBGA footprint (23 × 23 mm supplier package) delivers high density in a board‑level friendly form factor.
• Commercial‑Grade Reliability: Rated for 0 °C to 85 °C operation, aligning with standard commercial electronic systems and environments.
• RoHS Compliance: Conforms to environmental directives for lead‑free assembly and manufacturing.

Why Choose LFECP33E-4FN484C?

The LFECP33E-4FN484C provides a balanced combination of logic capacity, I/O density and embedded memory in a compact BGA package, built on the LatticeECP family architecture. It is well suited for designers who need to consolidate multiple functions, implement custom interfaces or add DSP acceleration while keeping board area and component count under control.

For teams building commercial electronics that require a mid‑to‑high logic resource FPGA with extensive I/O and family‑level DSP/memory support, this device delivers predictable electrical requirements (1.14–1.26 V core) and commercial temperature operation with RoHS compliance and a compact surface‑mount package.

Request a quote or submit an RFQ to get pricing and availability for the LFECP33E-4FN484C. Our team can provide lead time and ordering information to support your design schedule.