LFECP33E-4FN484I

The LFECP33E-4FN484I is an industrial-grade FPGA from the LatticeECP family, delivering a balance of logic capacity, on-chip memory and DSP resources in a 484-ball BGA package. It is designed for embedded and industrial applications that require flexible I/O, dedicated DSP blocks and built-in memory resources to implement signal processing, control and interface functions.

Key Features

• Logic Capacity — 32,800 logic elements (LUT-based architecture) suitable for medium- to high-density designs.
• Compute/DSP — Family sysDSP blocks provide dedicated multiply–accumulate resources for high-performance DSP tasks; the LFECP33 class supports multiple DSP blocks to accelerate arithmetic-intensive functions.
• On-Chip Memory — Approximately 0.43 Mbits (434,176 bits) of total RAM for embedded and distributed memory requirements.
• I/O Density — 360 I/O pins, enabling wide interface connectivity in a compact footprint.
• Flexible I/O Standards — Programmable sysI/O buffers in the family support a broad range of interfaces including LVCMOS, LVTTL, SSTL, HSTL, PCI, LVDS, LVPECL and RSDS as documented for the LatticeECP family.
• Clocking — Up to four analog PLLs per device for clock multiply, divide and phase shifting as provided by the family architecture.
• Power — Operates from a core supply range of 1.14 V to 1.26 V (nominal 1.2 V family supply).
• Package & Mounting — 484-ball BBGA (484-FPBGA, 23 × 23 mm) in a surface-mount package suited for compact system designs.
• Industrial Temperature Range — Rated for operation from −40 °C to 100 °C.
• Regulatory — RoHS compliant.

Typical Applications

• Industrial Control and Automation — Use the device for real-time control, motor drive interfaces and protocol bridging where industrial temperature operation and high I/O counts are required.
• Signal Processing and DSP — Leverage on-chip sysDSP blocks and embedded memory for filtering, transforms and other multiply–accumulate workloads.
• Memory and Bus Interfaces — Implement dedicated DDR memory interfaces and complex bus bridging using the device’s I/O flexibility and clocking resources.
• High-Density Interface Hubs — With 360 I/Os and programmable I/O standards, consolidate multiple peripheral interfaces in compact systems.

Unique Advantages

• Substantial Logic Resources: 32,800 logic elements provide the capacity to integrate multiple functions on a single device, reducing system BOM.
• Integrated DSP Acceleration: Family sysDSP blocks accelerate arithmetic-intensive algorithms, offloading work from external processors.
• Flexible I/O and Standards Support: Programmable I/O buffers support a wide set of interface standards, simplifying board-level interface design.
• Compact, High-Pin Package: 484-ball BGA (23 × 23 mm) delivers high I/O density in a space-efficient footprint for compact systems.
• Industrial Reliability: Specified operating range from −40 °C to 100 °C and surface-mount packaging meet common industrial deployment needs.
• On-Chip Memory: Approximately 0.43 Mbits of embedded RAM supports buffering, FIFOs and local data storage without external memory for many applications.

Why Choose LFECP33E-4FN484I?

The LFECP33E-4FN484I positions itself as a versatile FPGA option in the LatticeECP family, combining tens of thousands of logic elements, dedicated DSP resources and flexible, high-density I/O in a single 484-BBGA package. Its combination of on-chip memory, PLL clocking and multi-standard I/O makes it suitable for embedded signal processing, interface consolidation and industrial control designs that require reliable operation across a wide temperature range.

Engineers can leverage the family’s design ecosystem and documented device capabilities to migrate or scale designs within the LatticeECP lineup while keeping power and board-level complexity under control.

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