LFECP33E-4FN672C

The LFECP33E-4FN672C is an ECP-series field programmable gate array (FPGA) offered in a 672-ball BGA package. It delivers a high-density programmable fabric with 32,800 logic elements and extensive I/O, targeted at mainstream and cost-sensitive applications that need flexible logic, memory and interface integration.

Built for designs requiring substantial on-chip memory and high I/O count, this device combines programmable logic, embedded RAM and family-level features such as DSP capability, dedicated DDR memory support and multiple PLLs to support a wide range of embedded and system-level functions.

Key Features

• Logic Capacity — 32,800 logic elements provide a high-density fabric for complex logic implementations and moderate to large integration of custom functions.
• On-chip Memory — Approximately 0.43 Mbits of total on-chip RAM (434,176 bits), enabling local storage for buffers, FIFOs and embedded data processing.
• I/O Density — Up to 496 I/Os to support wide peripheral interfacing, bus bridging and multi-channel connectivity from a single device.
• Package — 672-ball BBGA / 672-FPBGA (27 × 27 mm) package for high pin count and compact board area.
• Supply Voltage & Power — Operational supply range of 1.14 V to 1.26 V, compatible with 1.2 V core systems.
• Operating Temperature — Commercial-grade range: 0 °C to 85 °C.
• Family-Level DSP and Memory Features — Lattice ECP family features include dedicated sysDSP blocks (family-level support), embedded block RAM and distributed RAM options for signal processing and accumulation tasks.
• Clocking and System Support — Family supports multiple analog PLLs for clock multiplication/division and phase control, plus system-level features such as SPI boot flash interface and internal logic analysis (ispTRACY usage at family level).
• RoHS Compliance — Device is RoHS compliant.

Typical Applications

• High-density I/O bridging: Use the 496 I/Os to consolidate multiple interfaces, implement protocol conversion, or act as a programmable I/O hub in communications and networking equipment.
• Embedded signal processing: Leverage on-chip memory and family DSP capability for moderate DSP tasks such as filtering, aggregation and data conditioning in instrumentation and consumer devices.
• Memory interface and controllers: Implement dedicated DDR memory interfaces and custom memory controllers using the device’s on-chip resources and family-level DDR support.
• Custom logic integration: Replace multi-chip glue logic with a single FPGA solution for control, sequencing and specialized accelerators in industrial and commercial systems (within the commercial temperature range).

Unique Advantages

• High logic density: 32,800 logic elements enable substantial consolidation of discrete logic and small ASIC functions into a single programmable device.
• Significant on-chip memory: Approximately 0.43 Mbits of RAM reduces external memory dependence for many buffering and state-storage needs.
• Extensive I/O capability: 496 I/Os provide the flexibility to connect multiple peripherals, high-pin-count interfaces or parallel data paths without external expanders.
• System-level features: Family support for PLLs, SPI boot and internal logic analysis simplifies system design and brings configuration and debug capabilities on-chip.
• Compact high-pin package: The 672-ball BGA (27 × 27 mm) provides a compact footprint while preserving high pin count for dense board designs.
• RoHS compliant: Material compliance supports modern manufacturing and environmental requirements.

Why Choose LFECP33E-4FN672C?

The LFECP33E-4FN672C positions itself as a high-density, feature-rich FPGA option for designers needing substantial logic, memory and I/O in a commercially rated device. Its combination of 32,800 logic elements, approximately 0.43 Mbits of on-chip RAM and up to 496 I/Os makes it suitable for consolidating complex glue logic, implementing embedded processing blocks and handling wide interface requirements.

Backed by ECP-family system features—such as PLLs, DDR interface support and SPI boot capability—this FPGA supports scalable designs where integration, flexible configuration and on-board debugging matter for development velocity and lifecycle value.

Request a quote or submit an inquiry to get pricing and availability for the LFECP33E-4FN672C. Our team will provide detailed lead-time and ordering information to support your project schedule.