LFECP33E-5FN672C
| Part Description |
ECP Field Programmable Gate Array (FPGA) IC 496 434176 32800 672-BBGA |
|---|---|
| Quantity | 817 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 672-FPBGA (27x27) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 672-BBGA | Number of I/O | 496 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 4096 | Number of Logic Elements/Cells | 32800 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 434176 |
Overview of LFECP33E-5FN672C – ECP Field Programmable Gate Array (FPGA) IC 496 434176 32800 672-BBGA
The LFECP33E-5FN672C is a LatticeECP-series field programmable gate array (FPGA) in a 672-ball BGA package. It delivers a high-density, low-voltage FPGA fabric with substantial on-chip memory and extensive I/O suitable for mainstream, cost-conscious embedded designs.
Targeted at applications that require programmable logic, on-chip RAM and broad interface support, the device combines 32,800 logic elements with approximately 0.434 Mbits of on-chip RAM and up to 496 user I/Os, providing a balanced building block for system integration and signal-processing functions.
Key Features
- Programmable Logic Capacity — 32,800 logic elements provide substantial resources for implementing complex control, glue logic, and moderate-density FPGA designs.
- On-chip Memory — Total of 434,176 bits of on-chip RAM (approximately 0.434 Mbits) for embedded data buffering, state machines and small lookup-table storage.
- High I/O Count — Up to 496 user I/Os enable wide external connectivity for parallel buses, memory interfaces and multi‑channel peripherals.
- Dedicated DSP Capability (family) — The LatticeECP family provides sysDSP™ blocks on LatticeECP devices for high-performance multiply–accumulate operations and DSP tasks (family feature).
- Flexible I/O and Memory Interfaces (family) — Family-level support for multiple I/O standards and dedicated DDR memory interface logic enables a variety of interface options and system memory connectivity (family feature).
- Package and Mounting — 672-ball FBGA package (27 × 27 mm) in a surface-mount format suitable for compact board designs and automated assembly.
- Low-Voltage Core — Core supply range from 1.14 V to 1.26 V to match low‑voltage system power domains.
- Commercial Temperature Grade — Rated for 0 °C to 85 °C operation for standard commercial applications.
- RoHS Compliant — Meets RoHS environmental requirements for lead-free assembly.
Typical Applications
- Communications and Networking — Implement protocol bridging, packet buffering and custom I/O handling using the device’s high I/O count and on-chip memory.
- Embedded Signal Processing — Leverage family DSP block support alongside abundant logic elements for filtering, accumulation and real-time processing tasks.
- Memory Interface and Control — Use the device’s dedicated DDR memory support (family feature) and on-chip RAM for system memory controllers and buffering in cost-sensitive designs.
- Industrial and Commercial Systems — Suitable for control, monitoring and interface consolidation in commercial-grade equipment operating within 0 °C to 85 °C.
Unique Advantages
- High Logic Density: 32,800 logic elements enable complex designs without external CPLD/ASIC add-ons, reducing BOM and design complexity.
- Substantial On-Chip RAM: Approximately 0.434 Mbits of embedded memory supports localized buffering and state retention to improve system throughput.
- Extensive I/O Flexibility: Up to 496 I/Os accommodate multiple parallel interfaces and mixed-signal front ends for system convergence.
- Compact BGA Package: 672-ball FBGA (27 × 27 mm) provides high pin-count in a compact footprint for space-constrained boards.
- Low-Voltage Operation: Narrow core supply range (1.14 V–1.26 V) helps integrate the FPGA into modern low-voltage power architectures.
- Regulatory and Assembly Ready: RoHS compliance and surface-mount packaging simplify global manufacturing and assembly processes.
Why Choose LFECP33E-5FN672C?
The LFECP33E-5FN672C positions itself as a versatile, commercial-grade FPGA option within the LatticeECP family, combining substantial logic resources, on-chip RAM and a very high I/O count in a compact BGA package. Its low-voltage core and family-level DSP and memory-interface capabilities make it suitable for designers who need programmable logic with embedded memory and broad connectivity while keeping system cost and board area under control.
This device is well suited to engineers building mainstream embedded systems, communications interfaces, and DSP-capable modules that benefit from a balanced mix of logic, memory and I/O. The availability of family-level tools and IP further supports scalable migration and long-term maintainability of designs.
Request a quote or submit your procurement inquiry to receive pricing, availability and lead-time information for the LFECP33E-5FN672C.

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