LFECP6E-3F256I

The LFECP6E-3F256I is an industrial-grade ECP field programmable gate array from Lattice Semiconductor supplied in a 256-ball FPBGA (17 × 17 mm) package. It combines a mid-range logic fabric with on-chip RAM and a high pin count to address embedded, communications and industrial control applications that require flexible I/O and compact board-level integration.

Key attributes include 6,100 logic elements, approximately 94,208 bits of embedded RAM, 195 I/Os and an extended industrial operating temperature range, all designed for surface-mount assembly and RoHS-compliant production.

Key Features

• Core Logic  6,100 logic elements and 768 logic blocks provide mid-range programmable logic capacity suitable for control, protocol bridging and custom logic functions.
• On‑chip Memory  Approximately 0.094 Mbits (94,208 bits) of on-chip RAM for local buffering, state machines and small data structures without immediate need for external memory.
• High I/O Count  195 I/O pins enable dense peripheral interfacing and multi-channel designs in a single device.
• Package & Mounting  256-ball FPBGA (17 × 17 mm) package, surface-mount mounting type, suitable for compact PCB layouts.
• Power  Core supply range from 1.14 V to 1.26 V for integration into tightly specified power domains.
• Temperature & Grade  Industrial grade device rated for operation from −40 °C to 100 °C for deployment in thermally demanding environments.
• Regulatory Compliance  RoHS compliant to support lead‑free manufacturing and regulatory requirements.
• Family Design Support  The device is part of the Lattice ECP family, which is supported by Lattice design tools and documentation for system-level implementation and configuration.

Typical Applications

• Industrial Control  Implement custom control logic, I/O aggregation and deterministic state machines within industrial controllers and automation modules.
• Embedded Systems  Integrate peripheral interfaces and glue logic for embedded appliances and instrumentation where mid-range logic and on-chip RAM are required.
• Communications & Networking  Support protocol handling, packet buffering and multi-channel I/O aggregation for network modules and communication endpoints.
• Prototyping and System Integration  Use the device’s logic capacity and high I/O count to validate system architectures and consolidate discrete functions onto a single FPGA.

Unique Advantages

• Balanced Logic and Memory: 6,100 logic elements paired with roughly 94kbits of embedded RAM provide a compact combination for many mid-range designs, reducing reliance on external memory.
• High Pin Density in a Compact Footprint: 195 I/Os in a 256‑ball FPBGA (17 × 17 mm) package enable complex I/O routing in space-constrained boards.
• Industrial Reliability: Rated for −40 °C to 100 °C operation and specified as industrial grade for deployments in harsh or variable temperature environments.
• Controlled Power Domain: Narrow core voltage range (1.14 V–1.26 V) simplifies power-supply design and integration with regulated power rails.
• RoHS Compliant: Supports lead‑free manufacturing processes and environmental compliance requirements.
• Surface‑Mount Ready: Standard surface-mount package supports automated assembly and modern PCB production flows.

Why Choose LFECP6E-3F256I?

The LFECP6E-3F256I delivers a practical balance of programmable logic, embedded memory and high I/O density in a compact, industrial-grade package. It is well suited for engineers building embedded controllers, communications interfaces and industrial automation modules that require reliable operation across an extended temperature range and straightforward surface-mount integration.

Backed by the Lattice ECP family documentation and design resources, this FPGA offers a clear upgrade path within the ECP product family and supports efficient development flows for mid-range system designs focused on integration, reliability and manufacturability.

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