LFECP6E-3FN256C

The LFECP6E-3FN256C is an ECP Field Programmable Gate Array (FPGA) provided in a 256-ball fine-pitch BGA package. It delivers moderate logic capacity and embedded memory with a high I/O count, targeting commercial embedded logic applications and board-level designs that require dense I/O and compact surface-mount packaging.

Key hardware characteristics include 6,100 logic elements, approximately 0.094 Mbits of on-chip RAM, 195 I/O pins, and low-voltage operation in the 1.14 V to 1.26 V range—making it suitable for designs constrained by board space and power budget within commercial temperature conditions.

Key Features

• Core Logic 6,100 logic elements and 768 logic blocks provide the programmable fabric required for moderate-complexity logic implementations.
• Embedded Memory Approximately 0.094 Mbits of on-chip RAM for buffering, small data tables, and state storage within the FPGA fabric.
• I/O and Package 195 I/O pins in a 256-BGA package (supplier package: 256-FPBGA, 17×17) enable dense external interfacing while supporting surface-mount board assembly.
• Power Operates from a defined core voltage range of 1.14 V to 1.26 V to support low-voltage system designs.
• Operating Range Commercial grade device rated for 0 °C to 85 °C operation.
• Compliance RoHS compliant for lead-free assembly and regulatory alignment in commercial products.

Typical Applications

• Commercial Embedded Systems — Implement custom logic and protocol adaptation in space-constrained commercial products where moderate logic capacity and many I/Os are required.
• Board-Level Logic and Glue — Provide interface bridging, timing adaptation, or control logic between multiple subsystems using the available I/O resources.
• Prototyping and Evaluation — Rapidly validate hardware architectures and firmware with a surface-mount FPGA that matches commercial production constraints.

Unique Advantages

• High I/O Density: 195 I/Os support extensive external interfacing without increasing PCB footprint.
• Balanced Logic Capacity: 6,100 logic elements and 768 logic blocks provide a mid-range programmable fabric for a wide set of control and glue logic tasks.
• Compact, Surface-Mount Package: 256-FPBGA (17×17) enables compact board layouts and modern assembly processes.
• Low-Voltage Core: 1.14 V to 1.26 V operation supports designs targeting lower supply voltages and optimized power distribution.
• Commercial Temperature Range: Rated 0 °C to 85 °C for deployment in standard commercial environments.
• RoHS Compliant: Meets lead-free assembly requirements for commercial product manufacturing.

Why Choose LFECP6E-3FN256C?

The LFECP6E-3FN256C offers a pragmatic combination of logic density, embedded memory, and a large I/O complement in a compact 256-BGA surface-mount package. Its low-voltage core and commercial temperature rating make it well suited for engineers designing space- and power-sensitive commercial embedded systems that require reliable, on-board programmable logic.

For projects that need a mid-range FPGA with substantial I/O and on-chip RAM in a production-ready package, the LFECP6E-3FN256C provides a clear hardware foundation to implement control logic, interface bridging, and prototype-to-production designs.

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