LFECP6E-3F484C

The LFECP6E-3F484C is an ECP Field Programmable Gate Array (FPGA) IC from Lattice Semiconductor Corporation designed for commercial-grade programmable-logic applications. It provides 6,100 logic elements, approximately 94,208 bits of on-chip RAM, and 224 user I/O in a compact 484-ball BGA (23 × 23 mm) surface-mount package.

With a core supply range of 1.14 V to 1.26 V and an operating temperature range of 0 °C to 85 °C, this device targets commercial embedded designs that require moderate logic density, significant embedded memory, and high I/O count while complying with RoHS requirements.

Key Features

• Core Logic  Provides 6,100 logic elements suitable for mid-range programmable logic implementations and custom logic functions.
• Embedded Memory  Approximately 94,208 bits of on-chip RAM to support buffering, state machines, and small data-storage needs within the FPGA fabric.
• I/O Capacity  224 user I/O pins to support dense peripheral connectivity and parallel interfaces directly from the FPGA.
• Package & Mounting  484-ball BGA (supplier device package: 484-FPBGA, 23 × 23 mm) in a surface-mount form factor for compact board-level integration.
• Power  Core voltage supply range from 1.14 V to 1.26 V for device operation within specified limits.
• Temperature & Grade  Commercial grade device rated for operation from 0 °C to 85 °C.
• Environmental Compliance  RoHS compliant.

Typical Applications

• Commercial Embedded Systems  Use where reconfigurable logic and on-chip memory are needed within a commercial temperature range.
• I/O-Intensive Designs  Applications that require a high pin count for interfacing multiple peripherals or parallel buses benefit from the 224 I/O pins.
• Mid-Density Logic Implementation  Projects that need roughly 6,100 logic elements and embedded RAM to implement custom logic, control, or data-path functions.

Unique Advantages

• Balanced Logic and Memory  Combines 6,100 logic elements with approximately 94,208 bits of RAM to address a range of mid-density logic and storage requirements on a single device.
• High I/O Density  224 user I/O pins enable direct connection to multiple peripherals and parallel interfaces, reducing external glue logic.
• Compact BGA Footprint  484-ball FPBGA (23 × 23 mm) package allows high integration in space-constrained PCB designs.
• Low-Voltage Operation  Core supply between 1.14 V and 1.26 V supports modern low-voltage system designs.
• Commercial-Grade Availability  Specified for 0 °C to 85 °C operation and RoHS compliance for standard commercial deployments.
• Surface-Mount Assembly  Surface-mount package simplifies automated PCB assembly processes for volume production.

Why Choose LFECP6E-3F484C?

The LFECP6E-3F484C positions itself as a practical commercial-grade FPGA option for designers who need a balance of logic capacity, embedded memory, and high I/O in a compact BGA package. Its specifications—6,100 logic elements, about 94,208 bits of on-chip RAM, 224 I/O, and a 484-ball BGA footprint—make it suitable for a wide range of mid-density programmable logic tasks in commercial embedded systems.

Manufactured by Lattice Semiconductor Corporation and compliant with RoHS, this device offers a clear specification set for procurement and design decisions where commercial temperature operation and surface-mount integration are required.

Request a quote or submit an inquiry to receive pricing and availability for LFECP6E-3F484C.