LFECP6E-3F484I

The LFECP6E-3F484I is an ECP field programmable gate array (FPGA) device designed for industrial embedded applications. It provides a mid-range logic fabric with on-chip memory and a large number of I/O pins in a compact 484‑ball BGA package.

This device is targeted at designs that require approximately 6,100 logic elements, abundant I/O connectivity, and operation across an industrial temperature range while using a low-voltage supply.

Key Features

• Logic Fabric – Approximately 6,100 logic elements organized into 768 logic blocks (CLBs) for implementing custom combinational and sequential logic.
• Embedded Memory – Approximately 94,208 bits of on-chip RAM for small data buffering, state storage, and control tables.
• I/O Count – 224 general-purpose I/O pins to support broad interfacing needs with external devices and peripherals.
• Power – Operates from a core voltage range of 1.14 V to 1.26 V, enabling integration with low-voltage system rails.
• Package and Mounting – 484‑BBGA (supplier device package: 484‑FPBGA 23×23) in a surface-mount form factor for high-density PCB layouts.
• Industrial Temperature Range – Rated for operation from −40 °C to 100 °C for deployment in industrial environments.
• Environmental Compliance – RoHS-compliant construction for regulatory and manufacturing compatibility.

Typical Applications

• Industrial Control Systems – Implement control logic, I/O aggregation, and small lookup tables for factory automation and process control equipment.
• Embedded Systems – Provide custom glue logic, protocol handling, and interface adaptation in compact embedded designs.
• Interface Bridging – Serve as a programmable interface layer between processors, sensors, and peripheral devices using its 224 I/Os.
• Prototyping and Low-to-Mid Density FPGA Designs – Support development of custom logic functions where moderate logic density and on-chip RAM suffice.

Unique Advantages

• Balanced Logic and Memory: Approximately 6,100 logic elements paired with ~94,208 bits of RAM provide a useful mix for control and buffering tasks without external memory.
• High I/O Count: 224 I/Os enable direct connection to a wide range of peripherals and sensors, reducing the need for extra interface components.
• Industrial Temperature Rating: −40 °C to 100 °C operation supports deployments in demanding environmental conditions.
• Compact BGA Package: 484‑BBGA (23×23) surface-mount packaging offers a space-efficient footprint for dense PCB designs.
• Low-Voltage Core: 1.14 V to 1.26 V supply range aligns with modern low-voltage system architectures.
• RoHS Compliant: Environmentally compliant manufacturing reduces regulatory burden for production.

Why Choose LFECP6E-3F484I?

The LFECP6E-3F484I positions itself as a practical choice for engineers who need a mid-density FPGA with ample I/O and on-chip memory in an industrial-grade package. Its combination of approximately 6,100 logic elements, 224 I/Os, and operation across −40 °C to 100 °C makes it suitable for embedded control, interface, and industrial automation applications where board space and environmental robustness matter.

Designed for surface-mount assembly in a 484‑ball BGA, this device supports compact PCB designs and RoHS-compliant production, delivering a dependable building block for long-term projects that require programmable logic and flexible I/O.

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