LFECP6E-3FN484I

The LFECP6E-3FN484I is a Lattice ECP-family field programmable gate array supplied in a 484-ball fpBGA (23 × 23 mm) package. It delivers 6.1K-class FPGA capacity with 6,100 logic elements, approximately 94 Kbits of on‑chip RAM, and 224 user I/Os for medium-density, I/O‑rich designs. With a 1.14 V to 1.26 V core supply range and an industrial operating window, this device is targeted at mainstream embedded and industrial applications that require flexible logic, moderate on‑chip memory, and high pin count in a compact surface‑mount package.

Key Features

• Logic Capacity — Approximately 6,100 logic elements support mid-range combinational and sequential logic implementations.
• Embedded Memory — Total on‑chip RAM of 94,208 bits (approximately 94 Kbits) for distributed and small block memory needs.
• I/O Density — 224 user I/Os available for interfacing with sensors, memories, peripherals, and external logic.
• Supply Voltage — Core voltage range of 1.14 V to 1.26 V to match system power domains and regulator choices.
• Package & Mounting — 484-ball fpBGA package (supplier device package: 484‑FPBGA, 23 × 23 mm) designed for surface‑mount assembly.
• Industrial Temperature Grade — Rated for operation from −40 °C to 100 °C for deployment in industrial environments.
• Compliance — RoHS‑compliant manufacturing status.

Typical Applications

• Industrial Control — Implement control logic, I/O aggregation, and medium‑complexity state machines using the 6,100 logic elements and 224 I/Os within an industrial temperature range.
• Interface Bridging — Use the high I/O count to translate or aggregate multiple peripheral interfaces and bus signals in embedded systems.
• Communications and Networking — Perform protocol handling, packet parsing, or peripheral interfacing where moderate logic and on‑chip RAM capacity suffice.
• Custom Embedded Logic — Offload application‑specific processing and glue logic from the main processor with flexible programmable fabric and local memory.

Unique Advantages

• Balanced Mid‑Range Capacity: 6,100 logic elements provide a practical balance between density and cost for mainstream designs.
• High I/O Count: 224 user I/Os enable dense external connectivity without needing larger footprint packages.
• Compact BGA Package: 484‑ball fpBGA (23 × 23 mm) delivers high pin count in a compact surface‑mount form factor, reducing PCB area for complex designs.
• Industrial Temperature Support: Operation from −40 °C to 100 °C supports deployment in harsher environments and industrial applications.
• RoHS Compliant: Meets common environmental compliance expectations for modern electronics manufacturing.

Why Choose LFECP6E-3FN484I?

The LFECP6E-3FN484I positions itself as a pragmatic FPGA choice for engineers needing a mid‑density, I/O‑rich programmable device in an industrial package. Its combination of roughly 6,100 logic elements, approximately 94 Kbits of on‑chip RAM, and 224 I/Os in a 484‑ball fpBGA gives designers the flexibility to implement control, interface, and custom logic functions while maintaining a compact PCB footprint.

This device suits teams balancing performance, integration, and manufacturability needs: it is appropriate for industrial embedded systems, interface bridging, and communications subsystems where temperature range, I/O count, and programmable logic capability are key selection criteria.

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