LFECP6E-3QN208C
| Part Description |
ECP Field Programmable Gate Array (FPGA) IC 147 94208 6100 208-BFQFP |
|---|---|
| Quantity | 657 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 208-PQFP (28x28) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 208-BFQFP | Number of I/O | 147 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 768 | Number of Logic Elements/Cells | 6100 | ||
| Number of Gates | N/A | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 94208 |
Overview of LFECP6E-3QN208C – ECP Field Programmable Gate Array (FPGA) IC, 6,100 Logic Elements, 147 I/Os, 208-BFQFP
The LFECP6E-3QN208C is a LatticeECP family FPGA optimized for mainstream, cost-sensitive applications. It provides a programmable logic fabric with 6,100 logic elements and approximately 94,208 bits of on-chip RAM, together with 147 general-purpose I/Os in a 208-pin BFQFP surface-mount package.
This device targets embedded and system-level designs that require flexible I/O, embedded memory, and supply compatibility with low-voltage core rails (1.14 V to 1.26 V). It is offered as a commercial-grade component with an operating range of 0 °C to 85 °C.
Key Features
- Logic Capacity — 6,100 logic elements (cells) suitable for medium-density FPGA implementations and mainstream design migration within the LatticeECP family.
- On-chip Memory — Approximately 94,208 bits of total RAM for distributed and embedded memory use in application buffering, FIFOs, and small lookup tables.
- I/O Density & Flexibility — 147 I/Os provided in a 208-pin BFQFP (28 × 28 mm) surface-mount package, enabling diverse peripheral and bus connections.
- Power Supply — Core supply range specified at 1.14 V to 1.26 V (nominal family VCC = 1.2 V), supporting modern low-voltage system architectures.
- Commercial Temperature Grade — Rated for 0 °C to 85 °C operation for standard commercial applications.
- Family-level DSP and Memory Capabilities — LatticeECP family devices include dedicated sysDSP blocks and embedded block RAM options; the family supports high-performance multiply–accumulate functions and flexible memory resources.
- Flexible I/O Standards (Family Support) — The LatticeECP family supports a wide range of I/O standards including LVCMOS (3.3/2.5/1.8/1.5/1.2), LVTTL, SSTL, HSTL, PCI, LVDS, LVPECL and RSDS for interface versatility.
- System-level Support (Family) — Family features include up to four analog PLLs per device, IEEE 1149.1 boundary scan, SPI boot flash interface, and internal logic analyzer capability (ispTRACY) to assist in system debug and clock management.
- Package & Mounting — 208-BFQFP (28 × 28 mm) surface-mount package (supplier device package listed as 208-PQFP), simplifying PCB assembly for conventional SMT processes.
Typical Applications
- Embedded Systems — Use as the programmable logic core for control, peripheral aggregation, or custom protocol handling where moderate logic and on-chip RAM are required.
- Communications & Interfaces — Implement interface bridging, SERDES-less parallel interfaces, and protocol translation leveraging the device's high I/O count and family I/O standard support.
- DSP and Signal Processing — Leverage LatticeECP family DSP capabilities (family sysDSP blocks and multiply–accumulate support) for medium-complexity signal processing tasks.
- Memory Interface & Buffering — Implement DDR interface logic and on-chip buffering consistent with the family’s dedicated DDR memory support and embedded memory resources.
Unique Advantages
- Balanced Logic and Memory — 6,100 logic elements combined with approximately 94 kbits of RAM provide a balanced resource set for moderate-complexity designs without unnecessary overhead.
- Wide I/O Count in Compact Package — 147 I/Os in a 208-pin BFQFP package give designers extensive connectivity while maintaining a standard SMT footprint.
- Low-Voltage Core Compatibility — Narrow core supply window (1.14 V–1.26 V) aligns with a 1.2 V device family architecture for straightforward power-rail planning.
- System Integration Support — Family-level features such as multiple PLLs, boundary scan, and SPI boot provide system integration and debug capabilities that reduce development time.
- Commercial-Grade Reliability — Rated for commercial operating temperatures (0 °C to 85 °C), suitable for consumer and standard industrial control environments.
Why Choose LFECP6E-3QN208C?
The LFECP6E-3QN208C positions itself as a practical, mid-density FPGA option within the LatticeECP family, delivering a compact combination of logic, embedded RAM, and extensive I/O in a 208-pin BFQFP package. Its supply voltage and family-level system features simplify integration into low-voltage, mainstream embedded designs.
This device is well suited for designers requiring a cost-conscious, commercially rated FPGA that supports flexible I/O standards, onboard memory for buffering and state storage, and family-level DSP and clock-management capabilities for scalable design migration within the LatticeECP portfolio.
If you need pricing, availability, or a formal quote for the LFECP6E-3QN208C, request a quote or submit an inquiry to receive further purchasing and lead-time information.

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