LFECP6E-3T144I

The LFECP6E-3T144I is an industrial-grade ECP Field Programmable Gate Array (FPGA) in a 144-pin LQFP package, designed for applications that require programmable logic, on-chip memory and moderate I/O counts. With 6,100 logic elements, approximately 0.094 Mbits of embedded RAM and 97 available I/O, this device targets designs that need flexible, reconfigurable logic in a compact surface-mount package.

Key attributes include industrial temperature operation and a narrow core supply range, enabling deployment in systems where controlled power rails and extended temperature capability are required.

Key Features

• Core Logic 6,100 logic elements provide programmable logic capacity for custom logic, glue logic and moderate-complexity finite state machines.
• Embedded Memory Approximately 0.094 Mbits of on-chip RAM (94,208 bits) for buffering, small FIFOs and localized data storage.
• I/O Capability 97 general-purpose I/O pins to support interfaces, peripherals and board-level signal routing in compact designs.
• Power Supply Operates from a core voltage supply range of 1.14 V to 1.26 V, suitable for systems with defined low-voltage rails.
• Package & Mounting 144-LQFP package case with surface-mount mounting; supplier device package listed as 144-TQFP (20×20) for footprint reference.
• Temperature & Grade Industrial grade device with an operating temperature range of −40 °C to 100 °C for use in extended-temperature environments.
• Environmental Compliance RoHS compliant.

Typical Applications

• Programmable logic integration — Implement custom glue logic, protocol bridging and small-scale hardware acceleration where ~6,100 logic elements and on-chip RAM meet design needs.
• Embedded I/O expansion — Provide additional programmable I/O for systems requiring up to 97 configurable pins in a compact package.
• Industrial control systems — Use the industrial temperature rating and surface-mount package to integrate reconfigurable logic into controls and automation equipment.

Unique Advantages

• Right-sized logic capacity: 6,100 logic elements offer a balance between capability and board-space efficiency for moderately complex programmable designs.
• On-chip memory for local data handling: Approximately 0.094 Mbits of embedded RAM reduces dependence on external memory for small buffers and state storage.
• High I/O count in a compact package: 97 I/O pins enable flexible interfacing while maintaining a 144-pin LQFP footprint for dense board layouts.
• Industrial temperature range: Rated from −40 °C to 100 °C to support deployments in environments with broad temperature swings.
• Low-voltage core operation: Narrow supply window (1.14 V to 1.26 V) aligns with controlled low-voltage system designs.
• RoHS compliant: Conforms to environmental requirements for lead-free manufacturing processes.

Why Choose LFECP6E-3T144I?

The LFECP6E-3T144I delivers a compact, industrial-grade FPGA option combining 6,100 logic elements, nearly 94kbits of embedded RAM and 97 I/Os in a 144-pin surface-mount package. Its defined core voltage range and wide operating temperature window make it suitable for embedded and industrial designs that require reconfigurable logic without large form-factor or external memory dependencies.

This device is well suited to engineers and procurement teams seeking a reliable, RoHS-compliant FPGA for mid-density logic implementations where package size, on-chip memory and I/O count are primary selection criteria.

Request a quote or submit a pricing inquiry to evaluate the LFECP6E-3T144I for your next design project.