LFECP6E-3TN144I

The LFECP6E-3TN144I is an industrial‑grade LatticeECP-series FPGA supplied in a 144‑LQFP (20 × 20 mm) surface‑mount package. It provides 6.1K logic elements, approximately 94 Kbits of on‑chip RAM and 97 user I/Os, making it suitable for cost‑sensitive mainstream embedded and industrial designs that require flexible I/O, moderate logic density and on‑chip memory.

Key Features

• Logic Capacity  6,100 logic elements and 768 configurable logic blocks (CLBs) for implementing medium‑complexity FPGA designs.
• On‑chip Memory  Total RAM of 94,208 bits (approximately 94 Kbits) to support distributed and embedded memory requirements.
• I/O Count and Flexibility  97 I/O pins in the 144‑LQFP package, with family‑level support for a wide range of interfaces including LVCMOS (3.3/2.5/1.8/1.5/1.2), LVTTL, SSTL, HSTL, PCI, LVDS and related differential standards.
• Power Supply  Core supply range specified at 1.14 V to 1.26 V consistent with the LatticeECP family VCC requirements.
• Clocking  Family support includes sysCLOCK PLLs for clock multiply/divide and phase shifting (family selection indicates two PLLs for LFEC6/LFECP6 devices).
• Package and Mounting  144‑LQFP (20 × 20 mm) surface‑mount package (supplier device package: 144‑TQFP) for compact board integration.
• Industrial Temperature Grade  Rated for operation from −40 °C to 100 °C, suitable for industrial environments.
• Standards and System Support  Family features include IEEE 1149.1 boundary scan and SPI boot flash interface for system‑level integration and in‑system programming.
• Compliance  RoHS compliant.

Typical Applications

• Industrial control and automation  Industrial temperature rating and flexible I/O make the device suitable for sensor aggregation, I/O expansion and control logic in process and factory automation.
• Embedded systems with external memory  On‑chip memory combined with family DDR interface support makes it appropriate for embedded designs that require managed external memory interfaces.
• Communications and protocol bridging  The mix of programmable I/O standards and moderate logic density supports protocol conversion, interface aggregation and mid‑range networking functions.
• Cost‑sensitive mainstream designs  Optimized for mainstream applications where a balance of logic, memory and I/O in a compact package reduces BOM and board area.

Unique Advantages

• Balanced logic and memory density: 6,100 logic elements and approximately 94 Kbits of on‑chip RAM deliver a practical balance for medium complexity designs without overprovisioning.
• Flexible interfacing: Support for a broad range of I/O standards enables integration with legacy and modern peripherals using a single device.
• Industrial robustness: −40 °C to 100 °C operating range and industrial grade classification support deployment in demanding environments.
• Compact package: 144‑LQFP surface‑mount package provides a small footprint option for space‑constrained PCBs while delivering 97 I/Os.
• System integration features: Boundary scan and SPI boot capabilities aid board bring‑up, manufacturing test and in‑system configuration.
• Regulatory compliance: RoHS compliance simplifies environmental and supply‑chain considerations.

Why Choose LFECP6E-3TN144I?

The LFECP6E-3TN144I positions itself as a solid choice for engineers seeking an industrial‑grade FPGA with moderate logic density, useful on‑chip memory and extensive I/O flexibility in a compact 144‑LQFP package. It is well suited to mainstream embedded, industrial control and communications designs that benefit from family‑level features such as programmable I/O standards, PLL clocking and system support functions.

For developers and procurement teams, this device offers a practical combination of integration, proven family capabilities and environmental robustness for projects requiring a balance between capability and cost.

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