LFECP6E-4F256C

The LFECP6E-4F256C is a commercial-grade FPGA from Lattice Semiconductor designed for compact, I/O-rich embedded designs. It provides a programmable logic fabric with 6,100 logic elements and approximately 94 Kbits (94,208 bits) of on-chip RAM, making it suitable for control, interface and mid-density signal-processing tasks.

Packaged in a 256-ball fpBGA (17 × 17 mm) surface-mount package and supporting up to 195 I/Os, this device delivers a balance of integration, I/O capacity and low-voltage operation (1.14 V to 1.26 V) for space-constrained systems in commercial temperature environments.

Key Features

• Core Logic  6,100 logic elements provide programmable fabric for glue logic, protocol handling and moderate compute tasks.
• On-chip Memory  Approximately 94 Kbits (94,208 bits) of total RAM to support buffering, small data tables and local state storage.
• I/O Capacity  Up to 195 general-purpose I/Os for wide peripheral connectivity and multi-interface designs.
• Package and Mounting  256-ball fpBGA (256-FPBGA, 17 × 17 mm) in a surface-mount package for compact board layouts.
• Power  Low-voltage supply range (1.14 V to 1.26 V) for efficient power delivery and compatibility with modern low-voltage domains.
• Operating Range  Commercial grade operation from 0 °C to 85 °C.
• Compliance  RoHS-compliant manufacturing.
• Family-level Capabilities (per LatticeECP2 family datasheet)  Family features include flexible embedded memory architectures, sysDSP blocks for multiply-accumulate operations, programmable PLL/DLL clock resources, and support for a broad set of I/O standards—useful for a variety of system-level functions.

Typical Applications

• Protocol and Interface Bridging  Use the device’s 195 I/Os and programmable logic to implement protocol conversion, bus bridging and peripheral aggregation in embedded systems.
• Control and Automation  Deploy as control logic for industrial and commercial automation where mid-density logic and on-chip RAM support deterministic control tasks.
• Sensor and Data Aggregation  Local data buffering and preprocessing for sensor arrays or telemetry nodes leveraging on-chip memory and plentiful I/O.
• Embedded System Glue Logic  Combine custom state machines, timing logic and peripheral interfaces into a single compact package to reduce BOM and PCB complexity.

Unique Advantages

• Balanced Logic and Memory:  6,100 logic elements paired with ~94 Kbits of RAM provides the resources needed for medium-complexity functions without overprovisioning.
• High I/O Count in a Small Footprint:  195 I/Os in a 17 × 17 mm fpBGA package enables dense I/O routing for multi-interface designs in space-constrained products.
• Low-Voltage Operation:  1.14 V–1.26 V supply range aligns with modern low-power system rails and supports efficient power budgeting.
• Commercial Temperature Rating:  Rated 0 °C to 85 °C for reliable operation in typical commercial and consumer environments.
• RoHS Compliance:  Manufactured to RoHS standards for global electronics manufacturing compatibility.
• Surface-Mount Ready:  256-ball fpBGA surface-mount package simplifies assembly for production volumes.

Why Choose LFECP6E-4F256C?

The LFECP6E-4F256C is positioned for engineers who need a compact, I/O-capable FPGA with moderate logic density and on-chip memory for embedded control, interface consolidation and signal-processing tasks. Its combination of 6,100 logic elements, approximately 94 Kbits of RAM and 195 I/Os in a small fpBGA package helps reduce system BOM and simplify board layouts.

Selection of this device is appropriate for teams seeking a commercially graded, RoHS-compliant FPGA with a proven family feature set (including flexible memory, DSP blocks and programmable clock resources) and vendor documentation to support development and integration.

Request a quote or submit an inquiry to receive pricing and availability for LFECP6E-4F256C and to discuss how it can fit into your next design.