LFECP6E-3TN144C

The LFECP6E-3TN144C is a Lattice Semiconductor ECP-family field programmable gate array packaged in a 144-pin LQFP/TQFP footprint. It delivers a mid-range FPGA fabric with 6.1K logic elements and on-chip embedded memory, designed for mainstream and cost-sensitive applications that require flexible I/O and integrated DSP/memory resources.

Engineered for surface-mount assembly, the device operates from a 1.14 V to 1.26 V supply and supports commercial temperature ranges. Family-level features available in the LatticeECP/EC series include dedicated DSP blocks, flexible I/O buffering, DDR memory interface logic and system-level support such as boundary scan and SPI boot.

Key Features

• Logic Capacity — 6100 logic elements (logic element cells) to implement a variety of mid-density logic functions.
• On-chip Memory — 94,208 bits of embedded RAM for distributed and block memory needs in embedded designs.
• I/O — 97 I/O pins available in the 144-pin package to support multiple peripherals and interfaces.
• Power — Core voltage supply range of 1.14 V to 1.26 V for optimized core operation.
• Package and Mounting — 144-LQFP package case; supplier device package listed as 144-TQFP (20×20); surface-mount mounting type.
• Temperature and Grade — Commercial grade device rated for 0 °C to 85 °C operating temperature.
• Family-Level DSP and Memory Features — LatticeECP family offers sysDSP blocks and flexible embedded/distributed memory options (family-level capability).
• Flexible I/O Buffer Support — Family supports a wide range of I/O standards for interface flexibility (as documented for the LatticeECP/EC series).
• System-Level Support — Family-level support for SPI boot flash interface and IEEE 1149.1 boundary scan is provided in the LatticeECP/EC data.
• Regulatory — RoHS compliant.

Typical Applications

• Mainstream embedded systems — Implement mid-density logic, glue logic and control functions using the device’s logic elements and on-chip RAM.
• Interface bridging and I/O aggregation — 97 available I/Os in the 144-pin package enable consolidation of multiple peripheral interfaces.
• Cost-sensitive designs — Leverages LatticeECP family features targeted at mainstream, low-cost applications that benefit from integrated memory and DSP resources.

Unique Advantages

• Balanced mid-range capacity: 6100 logic elements with 94,208 bits of embedded RAM provide a balance of logic and memory for many mid-level designs.
• Flexible I/O density: 97 I/Os in a compact 144-LQFP/TQFP footprint reduce board area while supporting multiple interfaces.
• Compact surface-mount package: 144-pin LQFP (144-TQFP 20×20 supplier package) enables straightforward assembly for space-constrained PCBs.
• Commercial operating range: Rated 0 °C to 85 °C and RoHS compliant for general-purpose electronics applications.
• Family-level system features: Access to LatticeECP/EC series capabilities such as DSP blocks, DDR interface support and system-level tools can simplify design integration.

Why Choose LFECP6E-3TN144C?

The LFECP6E-3TN144C positions itself as a practical mid-density FPGA choice for engineers needing a compact, surface-mount solution with a solid mix of logic, memory and I/O. Its combination of 6100 logic elements, 94,208 bits of on-chip RAM and 97 I/Os in a 144-pin package makes it suitable for embedded and mainstream designs where integration and footprint matter.

Being part of the LatticeECP/EC family, the device benefits from series-level features—such as DSP block support, flexible memory architectures, DDR interface capability and system-level utilities—that help accelerate development and provide a clear upgrade path within the family for designs that scale.

Request a quote or submit a pricing inquiry today to evaluate the LFECP6E-3TN144C for your next design.