LFECP6E-4F256I

The LFECP6E-4F256I is an industrial-grade FPGA IC from Lattice Semiconductor Corporation optimized for system integration and embedded designs. It delivers 6,100 logic elements in a compact 256-ball fpBGA (17 × 17 mm) package with 195 user I/Os, making it suitable for mid-density logic, memory and I/O-intensive functions.

As part of the LatticeECP2 family, the device targets applications that require a blend of logic density, flexible memory and robust I/O connectivity while operating across a wide industrial temperature range.

Key Features

• Logic Capacity  Approximately 6,100 logic elements for mid-range FPGA integration and on-chip logic consolidation.
• Embedded Memory  Approximately 0.094 Mbits of on-chip RAM (94,208 total bits) to store configuration data, buffers and small working datasets.
• I/O Density  195 general-purpose I/Os in a 256-ball fpBGA footprint to support broad connectivity and peripheral interfacing.
• Package & Mounting  256-BGA (supplier package: 256-FPBGA, 17 × 17 mm); surface-mount package suitable for compact PCB layouts.
• Power  1.14 V to 1.26 V core supply range, enabling stable operation within tight power rails.
• Industrial Temperature Range  Rated for operation from −40 °C to 100 °C for deployment in industrial environments.
• Family-Level Capabilities  LatticeECP2 family features include high logic density, flexible embedded memory, sysDSP blocks, on-chip PLL/DLL clocking and a wide range of programmable I/O standards (as documented for the LatticeECP2 family).
• Compliance  RoHS compliant, meeting common environmental restrictions for electronics manufacturing.

Typical Applications

• Protocol Bridging and Interface Glue  Dense I/O and flexible on-chip logic enable bridging between different subsystems and custom protocol handling.
• Embedded Control  Suits motor control, industrial automation controllers and embedded sequencing where mid-range logic and reliable I/O are required.
• Memory and Buffering Functions  On-chip RAM and plentiful I/Os support small buffer, register file and interface staging tasks in data paths.
• Sensor and Data Acquisition Front-Ends  Compact package and industrial temperature range make it appropriate for conditioning and aggregating sensor data in harsh environments.

Unique Advantages

• Balanced Logic and I/O  6,100 logic elements paired with 195 I/Os provide a balanced platform for mixed-control and I/O-heavy designs, reducing the need for external glue logic.
• Compact System Footprint  256-FPBGA (17 × 17 mm) package enables high integration in space-constrained PCBs while maintaining substantial I/O count.
• Industrial Reliability  Rated for −40 °C to 100 °C operation, supporting deployment in industrial and temperature-challenging applications.
• Low-Voltage Operation  1.14–1.26 V core supply reduces power headroom and supports efficient power system design.
• Proven Family Ecosystem  Part of the LatticeECP2 family, which includes documented capabilities for DSP blocks, embedded memory options and advanced clocking resources to accelerate development.
• Regulatory-Friendly  RoHS compliance simplifies environmental regulatory considerations for manufacturing and distribution.

Why Choose LFECP6E-4F256I?

The LFECP6E-4F256I is positioned for designers who need a mid-density, industrial-grade FPGA that combines several thousand logic elements, modest embedded memory and a high I/O count in a compact fpBGA package. Its electrical and thermal specifications make it well suited to embedded control, interface bridging and I/O-centric tasks where board space and reliable operation across temperature are priorities.

Choosing this device leverages the LatticeECP2 family ecosystem and documentation to speed development while providing a component that balances integration, I/O flexibility and industrial robustness for long-term, scalable deployments.

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