LFECP6E-4FN256I

The LFECP6E-4FN256I is a Field Programmable Gate Array (FPGA) IC providing 6,100 logic elements and 94,208 bits of on-chip RAM. Packaged in a 256-BGA (256-FPBGA, 17×17) surface-mount format, it exposes 195 I/O pins for flexible system integration.

Rated for industrial use, the device operates from 1.14 V to 1.26 V and across an operating temperature range of -40 °C to 100 °C, delivering a compact, configurable logic solution for designs that require moderate logic capacity, embedded memory and high I/O density.

Key Features

• Core Logic Capacity 6,100 logic elements provide mid-density programmable logic for custom functions and glue logic.
• Embedded Memory Approximately 0.094 Mbits of on-chip RAM (94,208 bits) for local buffering, state storage and small data tables.
• I/O and Packaging 195 I/O pins in a compact 256-BGA package (256-FPBGA, 17×17) enable dense external interfacing while supporting surface-mount assembly.
• Power Low-voltage operation with a supply range of 1.14 V to 1.26 V to align with modern low-voltage system rails.
• Temperature and Grade Industrial-grade device rated for -40 °C to 100 °C for deployment in temperature-challenging environments.
• Environmental Compliance RoHS compliant to meet common environmental and manufacturing requirements.

Typical Applications

• Industrial Control and Automation — Industrial-grade rating and extended temperature range make the device suitable for programmable logic in control systems and automation equipment.
• I/O-Intensive Interfaces — With 195 I/Os, the FPGA supports custom signal aggregation, protocol bridging and sensor/actuator interfacing.
• Embedded System Glue Logic — 6,100 logic elements and embedded RAM enable implementation of mid-density glue logic, state machines and on-chip buffering.

Unique Advantages

• Compact, high-density packaging: 256-FPBGA (17×17) package accommodates substantial I/O and logic in a small PCB footprint, simplifying board-level integration.
• Balanced logic and memory: 6,100 logic elements combined with approximately 0.094 Mbits of RAM provide on-chip resources for a wide range of mid-complexity functions.
• High I/O count: 195 I/Os enable flexible external connectivity for sensor networks, I/O expansion and interface conversion.
• Industrial temperature support: Rated from -40 °C to 100 °C for reliable operation in demanding environmental conditions.
• Low-voltage operation: 1.14 V to 1.26 V supply window supports integration into modern low-power systems.
• RoHS compliant: Meets common environmental manufacturing standards for global deployment.

Why Choose LFECP6E-4FN256I?

The LFECP6E-4FN256I offers a balanced combination of logic density, embedded memory and high I/O in a compact 256-BGA surface-mount package, targeted at designs that require mid-level programmable resources with industrial-grade reliability. Its low-voltage operation and RoHS compliance further support modern, regulated, space-constrained designs.

This device is well suited for engineers and procurement teams seeking a configurable FPGA solution with 6,100 logic elements, substantial I/O capability and an extended operating temperature range for robust, long-term deployment.

Request a quote for the LFECP6E-4FN256I today to check availability and pricing, or submit a procurement inquiry to begin evaluation for your design.