LFECP6E-4Q208C
| Part Description |
ECP Field Programmable Gate Array (FPGA) IC 147 94208 6100 208-BFQFP |
|---|---|
| Quantity | 143 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 208-PQFP (28x28) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 208-BFQFP | Number of I/O | 147 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 768 | Number of Logic Elements/Cells | 6100 | ||
| Number of Gates | N/A | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 94208 |
Overview of LFECP6E-4Q208C – ECP Field Programmable Gate Array (FPGA) IC 147 94208 6100 208-BFQFP
The LFECP6E-4Q208C is an ECP Field Programmable Gate Array (FPGA) from Lattice Semiconductor Corporation targeted at commercial-grade programmable-logic designs. It provides a balance of logic capacity, on-chip memory and I/O density suited to applications that require configurable digital logic and multiple peripheral interfaces.
With 6,100 logic elements, approximately 0.094 Mbits of embedded memory and 147 I/O pins in a 208-pin BFQFP package, this device addresses mid-range integration needs while operating within a 1.14 V to 1.26 V supply range and a commercial temperature window of 0 °C to 85 °C.
Key Features
- Logic Capacity 6,100 logic elements provide the programmable fabric necessary for implementing combinational and sequential logic functions.
- Embedded Memory Approximately 0.094 Mbits of on-chip RAM for buffering, small data storage and state retention within user logic.
- I/O Density 147 general-purpose I/O pins enable connections to multiple peripherals, buses and external interfaces.
- Power Operates from a core supply range of 1.14 V to 1.26 V, allowing designs targeting low-voltage logic domains.
- Package & Mounting 208-BFQFP package (supplier device package: 208-PQFP, 28×28); surface-mount mounting for standard PCB assembly processes.
- Temperature & Grade Commercial-grade device rated for operation from 0 °C to 85 °C.
- Environmental Compliance RoHS compliant for regulatory and manufacturing compatibility.
Typical Applications
- Embedded Control Implement control logic and state machines using the device’s 6,100 logic elements and on-chip memory for commercial equipment designs.
- I/O Expansion & Interface Bridging Use the 147 I/O pins to aggregate, translate or route signals between multiple peripherals and interfaces.
- Prototyping & System Integration Leverage the device’s scalable logic and package options for evaluation and integration into commercial products operating within the 0 °C to 85 °C range.
Unique Advantages
- Moderate Logic Density: 6,100 logic elements provide a practical balance of gate count for mid-range programmable tasks without excessive PCB footprint.
- Substantial I/O Count: 147 I/O pins accommodate multi-signal designs and reduce the need for external I/O expanders.
- On-Chip Memory: Approximately 0.094 Mbits of embedded RAM enable local buffering and state storage, simplifying system memory architecture.
- Low-Voltage Operation: 1.14 V to 1.26 V supply range supports integration with low-voltage digital domains.
- Commercial Temperature Grade: Specified 0 °C to 85 °C operating range aligns with a wide range of commercial electronics requirements.
- RoHS Compliance: Meets environmental requirements for lead-free manufacturing and assembly.
Why Choose LFECP6E-4Q208C?
The LFECP6E-4Q208C offers designers a commercially graded FPGA option that combines a practical logic element count, measurable on-chip memory and high I/O capacity in a 208-pin surface-mount package. Its low-voltage supply window and RoHS compliance make it suitable for modern commercial electronic designs that prioritize integration and predictable thermal/environmental behavior.
This part is appropriate for engineering teams seeking a mid-range, vendor-backed programmable device for embedded control, interface bridging and system prototyping where reliable commercial-grade operation and clear hardware resource metrics (logic elements, RAM bits, I/O count) are required.
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