LFECP6E-4FN484I

The LFECP6E-4FN484I is an ECP-class field programmable gate array from Lattice Semiconductor Corporation. It provides 6,100 logic elements and approximately 0.094 Mbits of embedded memory in a 484-ball BGA package, delivering a compact, reprogrammable fabric for industrial applications.

With 224 general-purpose I/Os, a nominal core supply range of 1.14 V to 1.26 V and an industrial operating range of −40 °C to 100 °C, the device is suited to industrial embedded systems and other applications that require moderate logic density, on-chip RAM and a robust temperature rating.

Key Features

• Core Logic 6,100 logic elements providing programmable logic capacity for custom digital functions.
• Logic Structure 768 logic blocks (as reported in device data) to organize and map combinational and sequential logic.
• Embedded Memory Approximately 0.094 Mbits of on-chip RAM for buffering, small FIFOs, and state storage.
• I/O Count 224 I/O pins to support multiple external interfaces, parallel sensors, and peripheral connections.
• Power Supply Core voltage range of 1.14 V to 1.26 V for the programmable fabric.
• Package 484-ball FBGA (484-BBGA / 484-FPBGA, 23 × 23) surface-mount package for compact board-level integration.
• Industrial Temperature Range Rated for operation from −40 °C to 100 °C to meet elevated ambient and industrial-environment requirements.
• Compliance RoHS-compliant construction supporting regulatory and manufacturing environmental requirements.

Typical Applications

• Industrial Control Use the FPGA to implement control logic, sensor interfacing and small-scale automation tasks where industrial temperature operation is required.
• I/O Expansion and Protocol Bridging Leverage 224 I/Os to aggregate signals, translate between interfaces, or offload peripheral timing tasks from a host processor.
• Embedded Logic and Glue Deploy the device as a reprogrammable glue logic solution to integrate custom datapaths and timing-critical functions in embedded systems.

Unique Advantages

• Balanced Logic and Memory: 6,100 logic elements paired with approximately 0.094 Mbits of embedded RAM enable compact implementations of control, buffering and state machines without external memory.
• High I/O Count: 224 I/Os allow flexible interfacing to multiple peripherals, sensors and buses, reducing the need for external GPIO expanders.
• Industrial Rating: −40 °C to 100 °C operating range supports deployment in harsher ambient conditions common to industrial equipment.
• Compact BGA Package: 484-ball BGA (23 × 23) provides a dense footprint for space-constrained PCBs while maintaining robust soldered connections.
• Controlled Core Supply: Defined supply range of 1.14 V–1.26 V enables predictable power sequencing and design integration with modern low-voltage power rails.
• Regulatory-Friendly Manufacturing: RoHS compliance simplifies procurement and manufacturing for customers requiring lead-free processes.

Why Choose LFECP6E-4FN484I?

The LFECP6E-4FN484I combines moderate logic capacity, a substantial I/O count and on-chip RAM in a compact 484-ball BGA package rated for industrial temperatures. Its specification set makes it a practical choice for designers needing a reprogrammable logic device that fits within constrained board space while addressing industrial-environment requirements.

This FPGA is well suited to embedded systems engineers and procurement teams seeking a reliable, RoHS-compliant programmable device for control, I/O aggregation and glue-logic roles where 6,100 logic elements and 224 I/Os meet system needs.

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