LFECP6E-4FN256C
| Part Description |
ECP Field Programmable Gate Array (FPGA) IC 195 94208 6100 256-BGA |
|---|---|
| Quantity | 540 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 256-FPBGA (17x17) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 256-BGA | Number of I/O | 195 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 768 | Number of Logic Elements/Cells | 6100 | ||
| Number of Gates | N/A | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 94208 |
Overview of LFECP6E-4FN256C – ECP Field Programmable Gate Array (FPGA) IC 195 94208 6100 256-BGA
The LFECP6E-4FN256C is a field programmable gate array (FPGA) offered by Lattice Semiconductor Corporation. It provides a balance of programmable logic, embedded memory, and high I/O count in a compact 256-ball BGA package.
With 6,100 logic elements, approximately 0.094 Mbits of on-chip RAM, and 195 user I/Os, this surface-mount commercial-grade FPGA is suited for designs that require moderate logic density, significant I/O connectivity, and low-voltage operation (1.14 V to 1.26 V) within a 0 °C to 85 °C operating range.
Key Features
- Core Architecture FPGA fabric providing 6,100 logic elements to implement custom digital logic and control functions.
- Logic Structure 768 configurable logic blocks (CLBs) to organize and scale user logic efficiently.
- Embedded Memory Approximately 0.094 Mbits (94,208 bits) of on-chip RAM for buffering, FIFOs, and small data stores.
- High I/O Count 195 user I/O pins to support wide parallel interfaces, multiple peripherals, and board-level routing flexibility.
- Power Low-voltage core operation with a supply range of 1.14 V to 1.26 V for modern low-power designs.
- Package & Mounting 256-ball FPBGA (17 × 17 mm) surface-mount package for compact footprints and efficient board-level integration.
- Operating Conditions Commercial temperature grade rated from 0 °C to 85 °C for typical consumer and commercial environments.
- Environmental Compliance RoHS-compliant construction to meet common environmental and manufacturing requirements.
Typical Applications
- Custom Logic and Glue Logic Implement application-specific control, protocol bridging, or bus interfacing where programmable logic is required.
- Prototyping and Development Rapidly iterate hardware designs using reprogrammable logic with moderate density and flexible I/O.
- Peripheral and Interface Management Manage multiple parallel or serial interfaces and route signals between subsystems using abundant I/O resources.
- Embedded Control Functions Provide deterministic, hardware-implemented control loops or state machines using the FPGA fabric and on-chip RAM.
Unique Advantages
- Balanced Logic Density: 6,100 logic elements offer sufficient capacity for many mid-range FPGA tasks without excessive board area or power.
- Significant I/O Resources: 195 user I/Os enable extensive connectivity to sensors, peripherals, and external devices in a single device.
- Compact, Industry-Standard Package: 256-FPBGA (17 × 17 mm) package provides a space-efficient solution for dense PCBs and system-in-package designs.
- Low-Voltage Operation: Core supply between 1.14 V and 1.26 V supports designs targeting lower power budgets and modern supply rails.
- Commercial Temperature Rating: Specified 0 °C to 85 °C operating range aligns with typical consumer and commercial product requirements.
- RoHS Compliance: Environmentally compliant manufacturing simplifies integration into products requiring lead-free components.
Why Choose LFECP6E-4FN256C?
The LFECP6E-4FN256C delivers a practical combination of logic resources, embedded memory, and a high I/O count in a compact 256-ball BGA package, making it well-suited for mid-range programmable logic requirements. Its low-voltage core and commercial temperature range support a wide variety of consumer and commercial applications where compact footprint and flexible interfacing are important.
Designed and manufactured by Lattice Semiconductor Corporation, this FPGA provides a straightforward path for engineers seeking to implement custom logic, interface bridging, and embedded control functions with a device that balances integration, power, and board-level density.
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