LFECP6E-4FN256C

IC FPGA 195 I/O 256FBGA
Part Description

ECP Field Programmable Gate Array (FPGA) IC 195 94208 6100 256-BGA

Quantity 540 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package256-FPBGA (17x17)GradeCommercialOperating Temperature0°C – 85°C
Package / Case256-BGANumber of I/O195Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs768Number of Logic Elements/Cells6100
Number of GatesN/AECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits94208

Overview of LFECP6E-4FN256C – ECP Field Programmable Gate Array (FPGA) IC 195 94208 6100 256-BGA

The LFECP6E-4FN256C is a field programmable gate array (FPGA) offered by Lattice Semiconductor Corporation. It provides a balance of programmable logic, embedded memory, and high I/O count in a compact 256-ball BGA package.

With 6,100 logic elements, approximately 0.094 Mbits of on-chip RAM, and 195 user I/Os, this surface-mount commercial-grade FPGA is suited for designs that require moderate logic density, significant I/O connectivity, and low-voltage operation (1.14 V to 1.26 V) within a 0 °C to 85 °C operating range.

Key Features

  • Core Architecture FPGA fabric providing 6,100 logic elements to implement custom digital logic and control functions.
  • Logic Structure 768 configurable logic blocks (CLBs) to organize and scale user logic efficiently.
  • Embedded Memory Approximately 0.094 Mbits (94,208 bits) of on-chip RAM for buffering, FIFOs, and small data stores.
  • High I/O Count 195 user I/O pins to support wide parallel interfaces, multiple peripherals, and board-level routing flexibility.
  • Power Low-voltage core operation with a supply range of 1.14 V to 1.26 V for modern low-power designs.
  • Package & Mounting 256-ball FPBGA (17 × 17 mm) surface-mount package for compact footprints and efficient board-level integration.
  • Operating Conditions Commercial temperature grade rated from 0 °C to 85 °C for typical consumer and commercial environments.
  • Environmental Compliance RoHS-compliant construction to meet common environmental and manufacturing requirements.

Typical Applications

  • Custom Logic and Glue Logic Implement application-specific control, protocol bridging, or bus interfacing where programmable logic is required.
  • Prototyping and Development Rapidly iterate hardware designs using reprogrammable logic with moderate density and flexible I/O.
  • Peripheral and Interface Management Manage multiple parallel or serial interfaces and route signals between subsystems using abundant I/O resources.
  • Embedded Control Functions Provide deterministic, hardware-implemented control loops or state machines using the FPGA fabric and on-chip RAM.

Unique Advantages

  • Balanced Logic Density: 6,100 logic elements offer sufficient capacity for many mid-range FPGA tasks without excessive board area or power.
  • Significant I/O Resources: 195 user I/Os enable extensive connectivity to sensors, peripherals, and external devices in a single device.
  • Compact, Industry-Standard Package: 256-FPBGA (17 × 17 mm) package provides a space-efficient solution for dense PCBs and system-in-package designs.
  • Low-Voltage Operation: Core supply between 1.14 V and 1.26 V supports designs targeting lower power budgets and modern supply rails.
  • Commercial Temperature Rating: Specified 0 °C to 85 °C operating range aligns with typical consumer and commercial product requirements.
  • RoHS Compliance: Environmentally compliant manufacturing simplifies integration into products requiring lead-free components.

Why Choose LFECP6E-4FN256C?

The LFECP6E-4FN256C delivers a practical combination of logic resources, embedded memory, and a high I/O count in a compact 256-ball BGA package, making it well-suited for mid-range programmable logic requirements. Its low-voltage core and commercial temperature range support a wide variety of consumer and commercial applications where compact footprint and flexible interfacing are important.

Designed and manufactured by Lattice Semiconductor Corporation, this FPGA provides a straightforward path for engineers seeking to implement custom logic, interface bridging, and embedded control functions with a device that balances integration, power, and board-level density.

Request a quote or submit an inquiry to receive pricing and availability for the LFECP6E-4FN256C.

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