LFECP6E-3Q208C

IC FPGA 147 I/O 208QFP
Part Description

ECP Field Programmable Gate Array (FPGA) IC 147 94208 6100 208-BFQFP

Quantity 592 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package208-PQFP (28x28)GradeCommercialOperating Temperature0°C – 85°C
Package / Case208-BFQFPNumber of I/O147Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs768Number of Logic Elements/Cells6100
Number of GatesN/AECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits94208

Overview of LFECP6E-3Q208C – ECP FPGA, 6100 logic elements, 208-BFQFP

The LFECP6E-3Q208C is an ECP Field Programmable Gate Array (FPGA) IC from Lattice Semiconductor Corporation, supplied in a 208-BFQFP surface-mount package. It delivers 6,100 logic elements, approximately 0.094 Mbits (94,208 bits) of on-chip RAM, and 147 user I/O pins, making it suitable for commercial-grade FPGA-based designs that require moderate logic capacity and a high I/O count.

This device operates from a low core voltage (1.14 V to 1.26 V) and supports standard commercial temperature operation (0 °C to 85 °C), offering a compact, RoHS-compliant solution for space-constrained printed circuit board layouts.

Key Features

  • Core Logic: 6,100 logic elements provide configurable logic resources for implementing combinational and sequential functions.
  • Embedded Memory: Approximately 0.094 Mbits (94,208 bits) of on-chip RAM for data buffering and small memory structures.
  • I/O Capacity: 147 user I/O pins support a wide range of external interfaces and signal connections.
  • Power Supply: Low-voltage core operation from 1.14 V to 1.26 V to match system power budgets and core-power domains.
  • Package & Mounting: 208-BFQFP (supplier package: 208-PQFP, 28×28) in a surface-mount form factor for denser PCB implementations.
  • Operating Range: Commercial temperature grade rated from 0 °C to 85 °C for typical commercial applications.
  • Environmental Compliance: RoHS-compliant construction for regulatory alignment in commercial products.

Unique Advantages

  • Balanced logic and memory: 6,100 logic elements combined with on-chip RAM enable implementation of mid-scale digital functions without immediate reliance on external memory.
  • High I/O density: 147 I/O pins provide flexibility for interfacing with multiple peripherals, sensors, and external logic devices.
  • Low-voltage core operation: 1.14 V to 1.26 V supply reduces core power draw and helps integrate with low-voltage system domains.
  • Space-efficient package: 208-BFQFP surface-mount package simplifies placement in compact PCB layouts while offering substantial pin count.
  • Commercial-grade suitability: Rated for 0 °C to 85 °C operation, appropriate for a wide range of commercial electronic products.
  • Regulatory readiness: RoHS compliance supports environmental and manufacturing requirements for commercial markets.

Why Choose LFECP6E-3Q208C?

The LFECP6E-3Q208C positions itself as a practical, commercial-grade FPGA option for designers who need a mid-range logic resource set with substantial I/O capability in a compact surface-mount package. Its combination of 6,100 logic elements, on-chip RAM, and 147 I/Os makes it a solid choice for applications that require flexible digital integration within standard commercial temperature and low-voltage environments.

Engineers and procurement teams looking for a RoHS-compliant FPGA with clear electrical and physical specifications will find the LFECP6E-3Q208C suitable for scalable designs where board space and I/O density are priorities.

Request a quote or submit a purchasing inquiry today to evaluate the LFECP6E-3Q208C for your next commercial FPGA design.

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