LFECP6E-3FN256I

The LFECP6E-3FN256I is an ECP Field Programmable Gate Array (FPGA) offered in a 256-ball BGA package. It provides a balance of programmable logic capacity, on-chip RAM, and a substantial I/O count for industrial embedded applications.

Key architectural highlights include 6,100 logic elements, 94,208 bits of embedded RAM, and 195 I/O pins, all supplied over a nominal voltage range of 1.14 V to 1.26 V and rated for operation from −40 °C to 100 °C.

Key Features

• Core Logic  6,100 logic elements provide the programmable fabric needed for custom digital logic, control functions, and glue logic implementations.
• Embedded Memory  94,208 bits of on-chip RAM support buffering, lookup tables, and small embedded data storage directly within the FPGA fabric.
• I/O Density  195 I/O pins enable broad external connectivity for sensors, peripherals, and bus interfaces in compact board layouts.
• Power Supply  Operates from a supply voltage range of 1.14 V to 1.26 V, allowing integration with systems designed around low-voltage core rails.
• Package  256-ball FPBGA (17 × 17 mm) package provides a compact footprint for space-constrained designs while delivering a high pin count.
• Operating Range and Grade  Industrial-grade device rated for −40 °C to 100 °C operation, suitable for industrial environments.
• Compliance  RoHS‑compliant construction supports environmentally conscious manufacturing requirements.

Unique Advantages

• Balanced Logic and Memory: 6,100 logic elements combined with 94,208 bits of embedded RAM allow designers to implement a mix of control logic and small data buffers without external memory.
• High I/O Count in a Compact Package: 195 I/Os in a 256-ball FPBGA (17×17 mm) package provide a high pin density for complex interfacing while minimizing PCB area.
• Industrial Temperature Range: Rated from −40 °C to 100 °C, the device is suitable for industrial applications that require extended temperature tolerance.
• Low-Voltage Core Operation: A narrow 1.14 V to 1.26 V supply range aligns with modern low-voltage power architectures for efficient integration.
• RoHS Compliance: Environmentally compliant manufacturing eases integration into assemblies requiring lead-free components.

Why Choose LFECP6E-3FN256I?

The LFECP6E-3FN256I offers a practical combination of programmable logic density, embedded RAM, and extensive I/O capacity in a compact 256-FPBGA package, aimed at industrial-grade embedded designs. Its specified operating temperature range and RoHS compliance make it suitable for production environments that demand reliability and regulatory alignment.

This FPGA is well suited for designers seeking a mid-range, industrial-grade programmable device that balances logic resources, on-chip memory, and connectivity while operating on a low-voltage core supply.

Request a quote or submit a pricing and availability inquiry today to learn more about using LFECP6E-3FN256I in your next design.