LFECP6E-3FN484C

The LFECP6E-3FN484C is an ECP Field Programmable Gate Array (FPGA) from Lattice Semiconductor Corporation that integrates programmable logic, embedded RAM and a high pin-count I/O footprint in a compact ball-grid package. It combines 768 CLBs and 6,100 logic elements with on-chip memory and broad I/O to support a variety of programmable logic requirements.

With 224 available I/O pins, approximately 0.094 Mbits of embedded RAM (94,208 bits) and a 484-ball BGA package, this device is targeted at designs that require significant interfacing capacity and moderate on-chip logic and memory resources, while operating from a 1.14 V to 1.26 V supply in commercial temperature environments.

Key Features

• Core Logic  768 CLBs providing a total of 6,100 logic elements, enabling implementation of custom logic functions and state machines.
• Embedded Memory  Approximately 0.094 Mbits (94,208 bits) of on-chip RAM for data buffering, small FIFOs and scratchpad storage.
• I/O Density  224 I/O pins to support multiple interfaces, parallel sensors, or large I/O matrices in a single device.
• Package & Mounting  484-ball FPBGA (23 × 23) package in a surface-mount configuration for compact board-level integration.
• Supply Voltage  Device operates from a 1.14 V to 1.26 V supply range, matching low-voltage core domains.
• Operating Range & Grade  Commercial grade device with an operating temperature range of 0 °C to 85 °C.
• Environmental Compliance  RoHS compliant.

Typical Applications

• Embedded Systems  Use as programmable logic for control, data-path customization and peripheral integration where mixed I/O and on-chip memory are needed.
• Interface Bridging  Implement protocol bridging or glue logic between high-pin-count interfaces, leveraging 224 I/O pins for parallel or multi-channel connections.
• Prototyping & Development  Suitable for FPGA-based prototyping where 6,100 logic elements and on-chip RAM enable evaluation of custom logic functions.
• Consumer Electronics Control  Provide configurable control logic and I/O aggregation in compact consumer devices within commercial temperature limits.

Unique Advantages

• High I/O Count:  224 I/Os allow direct connection to multiple peripherals and interfaces, reducing the need for external multiplexers.
• Balanced Logic and Memory:  6,100 logic elements paired with approximately 0.094 Mbits of RAM offer a practical mix for control and small data-buffering tasks.
• Compact BGA Packaging:  484-ball FPBGA (23 × 23) delivers a small board footprint with high pin density for space-constrained designs.
• Low-Voltage Core Compatibility:  Operates from a 1.14 V to 1.26 V supply, matching low-voltage digital domains.
• Commercial Temperature Suitability:  Rated for 0 °C to 85 °C operation for mainstream electronics and consumer applications.
• RoHS Compliance:  Meets RoHS requirements for environmentally conscious designs.

Why Choose LFECP6E-3FN484C?

The LFECP6E-3FN484C positions itself as a compact, mid-capacity FPGA option that integrates a useful balance of logic resources, embedded memory and a large I/O complement in a 484-BBGA surface-mount package. Its voltage and temperature specifications make it suitable for commercial electronic designs that require flexible programmable logic and substantial interfacing capability.

This device is a fit for engineering teams and procurement specialists looking for a programmable solution with clear, verifiable specifications: 6,100 logic elements, 94,208 bits of on-chip RAM, 224 I/Os, and a standardized BGA footprint for streamlined PCB integration and assembly.

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