LFECP6E-3F256C

The LFECP6E-3F256C is a commercial-grade FPGA from the LatticeECP2 family, offering 6K-class logic resources in a compact 256-ball fpBGA package. It combines 6,100 logic elements, approximately 94 Kbits of on-chip RAM, and 195 user I/Os to support mid-density system integration and embedded logic functions.

Designed for applications that require flexible I/O, on-chip memory, and integrated DSP and clock resources provided at the family level, this device targets system designers needing a compact, low-power FPGA solution in a surface-mount 17 × 17 mm package.

Key Features

• Core Logic — 6,100 logic elements for implementing mid-density custom logic and control functions.
• On-chip Memory — Total of 94,208 bits (approximately 94 Kbits) of embedded RAM for buffering, small tables, and state storage.
• I/O and Interfaces — 195 user I/Os supporting a wide range of system interfacing needs in a single device.
• Package & Mounting — 256-ball fpBGA (256-FPBGA, 17 × 17 mm) surface-mount package for compact board-level integration.
• Power — Nominal core supply range of 1.14 V to 1.26 V for the device core.
• Temperature & Grade — Commercial-grade device rated for 0 °C to 85 °C operation.
• Family-Level System Features — LatticeECP2 family resources include embedded DSP blocks, sysCLOCK PLL/DLL resources, flexible embedded block RAM architecture, and pre‑engineered source-synchronous I/O support as described in the family datasheet.
• Compliance — RoHS compliant.

Typical Applications

• Communications and Interface Bridging — Use the device’s 195 I/Os and family-level source-synchronous I/O support to implement protocol bridging, interface conversion, and glue logic between system components.
• Embedded Signal Processing — Leverage on-chip memory and family-level sysDSP blocks to implement multiply-accumulate and other DSP functions for medium-complexity signal paths.
• Memory Interface and Timing Control — Implement DDR/DDR2 interface logic and timing-critical control using the device’s embedded RAM resources and clocking primitives described at the family level.
• Compact System Integration — The 17 × 17 mm 256-FPBGA package enables space-constrained board designs that require moderate logic density and a high pin count.

Unique Advantages

• Balanced Resource Mix: 6,100 logic elements paired with ~94 Kbits of embedded RAM provide a practical balance for mid-range logic and memory needs without excess overhead.
• High I/O Count in a Small Footprint: 195 user I/Os in a 256-ball fpBGA (17 × 17 mm) package simplifies routing and interconnect in compact designs.
• Commercial-Grade Reliability: Rated for 0 °C to 85 °C operation and RoHS compliant, suitable for mainstream embedded and consumer applications requiring standard commercial temperature ranges.
• Low-Voltage Core: 1.14 V to 1.26 V core supply range aligns with modern low-power system rails.
• Family Ecosystem: Part of the LatticeECP2 family, which includes on-chip DSP blocks, flexible EBR architecture, and clocking resources to accelerate implementation and reduce system BOM when leveraging family-level features.

Why Choose LFECP6E-3F256C?

The LFECP6E-3F256C delivers a practical, mid-density FPGA option for designers seeking a compact, well-balanced device: substantial logic capacity (6,100 elements), meaningful on-chip RAM (≈94 Kbits), and nearly 200 I/Os in a small 256-ball fpBGA. Its commercial temperature rating and RoHS compliance make it suitable for a wide range of embedded, communications, and consumer applications that need reliable, reconfigurable logic without unnecessary complexity.

As a member of the LatticeECP2 family, this device benefits from the family’s system-level features—DSP blocks, embedded block RAM architecture, and flexible clocking and I/O resources—helping teams scale designs and reuse IP across similar device classes.

Request a quote or submit your purchase inquiry to begin evaluation of the LFECP6E-3F256C for your next design.